My Inquiry
My Account
Infineon Technologies S29GL256S11FHIV13
- Part No.:
- S29GL256S11FHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11FHIV13.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,755
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL256S11FHIV13 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive ECUs.
For engineers reviewing the S29GL256S11FHIV13 datasheet, S29GL256S11FHIV13 pinout, S29GL256S11FHIV13 application, or S29GL256S11FHIV13 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56/LAA/LAE/VBU package compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports XIP-capable read operations via 32-byte page mode (15 ns intra-page access), and embeds a state-machine-based Embedded Algorithm Controller (EAC) for autonomous program/erase execution without external timing control.
It features dual protection architecture: non-volatile Advanced Sector Protection (ASP) per sector plus a separate 1024-byte OTP array with two lockable regions; status monitoring uses status register reads, data polling, and RY/BY# pin assertion-enabling deterministic host-side operation coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables direct code execution from flash in real-time systems |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | On-die hardware single-bit error correction; eliminates need for external ECC logic |
| Endurance | 100,000 program/erase cycles per sector; suitable for field-upgradable firmware |
| Data Retention | 20 years at +85°C; validated for long-life automotive and industrial deployments |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write Enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known initial state |
| VCC | Core Supply | 2.7–3.6 V single supply for core logic, programming, and erase |
| VIO | I/O Supply | 1.65–VCC versatile I/O voltage; decouples interface level from core rail |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns intra-page cycle time-reduces instruction fetch latency in XIP systems |
| Embedded Algorithm Controller (EAC) | On-chip state machine handles full program/erase sequences autonomously-eliminates host CPU timing overhead |
| Advanced Sector Protection (ASP) | Volatile and non-volatile locking per 128 kB sector-enables secure bootloader partitioning and field update safety |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands-enables OS/driver auto-detection and generic flash abstraction layers |
| Secure Silicon Region (OTP) | 1024-byte one-time-programmable array with two independently lockable regions-stores cryptographic keys or calibration data |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and diagnostic firmware in AEC-Q100 Grade 2 qualified ECU modules. IC Role / Device Role / Timing Role: Boot ROM and runtime firmware store; executes code in-place with ≤90 ns random access latency. Use Value: 20-year data retention at +105°C ensures reliability over vehicle lifetime without refresh cycles. | Use Scenario: Holding firmware and configuration data for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile program memory with sector-level write protection to prevent accidental corruption during field updates. Use Value: 128 kB uniform sectors enable precise firmware partitioning and atomic update rollback capability. |
| Medical Imaging System Boot Memory | Avionics Data Logger |
Use Scenario: Hosting boot loader and safety-critical initialization routines in FDA-compliant imaging equipment. IC Role / Device Role / Timing Role: Secure boot memory with OTP region storing cryptographic root keys and device identity. Use Value: Hardware ECC corrects single-bit errors induced by radiation or aging-ensuring boot integrity without software intervention. | Use Scenario: Recording flight parameters and system health metrics in certified avionics black box recorders. IC Role / Device Role / Timing Role: High-endurance data archive memory supporting frequent sector rewrites under DO-178C constraints. Use Value: 100,000 erase cycles per sector meets extended service life requirements for airborne data logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV10 | Same density and architecture but uses 64-ball LAA Fortified BGA (13 mm × 11 mm); no TSOP option | Targeted at space-constrained PCBs where thermal performance and board area outweigh hand-solderability needs | Select when footprint miniaturization and higher thermal dissipation are prioritized over manual assembly or legacy socket compatibility |
| MX29GL256FHT2I-90G | Micron part with identical 256 Mb density, 90 ns access, and 128 kB sectors-but lacks integrated hardware ECC and OTP array | Requires external error handling and key management; suitable for cost-sensitive non-safety-critical designs | Choose only if ECC and secure OTP are not required, and cross-manufacturer qualification is acceptable |
Compared with S29GL256P11TFIV10, the S29GL256S11FHIV13 offers TSOP-56 packaging for easier prototyping and repair, while MX29GL256FHT2I-90G trades Infineon's integrated ECC and OTP for lower unit cost-making it viable only in non-safety-certified contexts.
Availability
S29GL256S11FHIV13 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot memory requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S11FHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.
FAQ
Is S29GL256S11FHIV13 pin-compatible with earlier S29GL256N or S29GL256P variants?
No. While functionally similar, S29GL256S introduces updated command sets, enhanced ASP behavior, and revised timing margins. Pinout matches S29GL256P in TSOP-56, but CE#/OE#/WE# setup/hold timing and RY/BY# assertion behavior differ-requiring validation against Rev. *U datasheet before drop-in replacement.
Does this device support burst read or synchronous interface modes?
No. S29GL256S11FHIV13 is strictly asynchronous and does not support burst, clocked, or DDR modes. It relies on CE#, OE#, and WE# strobes for all operations. Page mode read (15 ns intra-page) is the fastest sequential access method-not a synchronous burst protocol.
Can the OTP region be reprogrammed after initial programming?
No. The 1024-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be permanently locked via dedicated CFI commands-preventing further writes even to unlocked portions of the same region.
What is the minimum VIO voltage supported during read operations?
The minimum valid VIO is 1.65 V per datasheet Section 10.4. Operation below this voltage violates absolute maximum ratings and may cause data corruption or undefined output states. For 1.8 V I/O systems, VIO must be set to 1.8 V; for 3.3 V interfaces, VIO = VCC is recommended for optimal noise margin.
S29GL256S11FHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S11FHIV13 FAQ
1.How can I place an order for S29GL256S11FHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11FHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11FHIV13 reliable?
The price and inventory of S29GL256S11FHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11FHIV13 is usually 5 days.
3.What payment methods are accepted for S29GL256S11FHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11FHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11FHIV13?
S29GL256S11FHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11FHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11FHIV13?
For technical support, including S29GL256S11FHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11FHIV13 requirements.
6.How does Aetrix verify that S29GL256S11FHIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11FHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11FHIV13 meets industry standards.
7.What is the process for return or replacement of S29GL256S11FHIV13?
All S29GL256S11FHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11FHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11FHIV13 part is unused and in its original packaging.
Return procedure for S29GL256S11FHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11FHIV13 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
