My Inquiry
My Account
Infineon Technologies S29GL256S11FHIV23
- Part No.:
- S29GL256S11FHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S11FHIV23.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,573
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL256S11FHIV23 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL256S11FHIV23 datasheet, S29GL256S11FHIV23 pinout, S29GL256S11FHIV23 application, or S29GL256S11FHIV23 equivalent, this device supports asynchronous read, sector erase, suspend/resume operations, OTP array, CFI compliance, and versatile I/O (1.65 V to VCC) - critical for legacy parallel interface migration and long-lifecycle industrial designs.
Technical Context
This NOR flash implements an asynchronous parallel interface with word-aligned addressing (A0–A23), 32-byte page reads, and 512-byte write buffer programming. Its embedded algorithm controller handles autonomous program/erase with status register, data polling, and RY/BY# signaling.
The device integrates hardware-based ECC for single-bit correction and detects multi-bit errors, supports uniform 128 kB sector erase, and provides advanced sector protection via volatile/non-volatile lock bits plus a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full boot image storage for mid-complexity microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables deterministic XIP execution timing in real-time systems |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per operation |
| ECC Support | Internal hardware single-bit correction; eliminates need for external ECC logic in safety-critical firmware storage |
| Endurance | 100,000 program/erase cycles; suitable for field-upgradable firmware with infrequent updates |
| Data Retention | 20 years at +85°C; meets industrial temperature grade requirements without refresh |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus; A23 is MSB for 256 Mb density (2²⁴ × 16-bit) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide transfers only |
| CE# | Chip Enable | Active-low enable for device selection; controls power-down entry during deselect |
| OE# | Output Enable | Active-low gate for data output; used for read strobing and bus sharing |
| WE# | Write Enable | Active-low control for write operations; latches command/data on rising edge |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low = operation in progress, high = ready |
| VCC | Core Supply | 3.0 V ±0.3 V supply for core logic, programming, and erase functions |
| VIO | I/O Supply | 1.65 V to VCC; decouples I/O voltage from core, enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports 1.65 V to VCC I/O voltage range - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters |
| Hardware ECC | On-die single-bit error correction with automatic detection - ensures firmware integrity without software overhead or external logic |
| 512-byte Programming Buffer | Allows up to 256-word buffered writes - cuts typical programming time by >60% vs. byte/word-by-word methods |
| OTP Array | 1024-byte one-time-programmable region with two independent lock bits - secures calibration data, keys, or device-specific configuration |
| Suspend/Resume | Interrupts active program or erase to service higher-priority reads - essential for real-time interrupt latency control |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration tables in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency. Use Value: 20-year data retention at +85°C and 100,000 erase cycles ensure firmware integrity over full equipment lifecycle without field replacement. | Use Scenario: Holding calibrated display assets and safety-critical boot code in automotive digital instrument clusters compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and hardware ECC for ASIL-B relevant data paths. Use Value: Integrated ECC and OTP array protect against bit flips and unauthorized modification of calibration parameters. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in diagnostic imaging equipment requiring certified reliability and traceability. IC Role / Device Role / Timing Role: Secure, CFI-compliant boot memory with sector protection and status monitoring for audit-ready firmware updates. Use Value: Advanced sector protection (ASP) enables selective locking of critical sectors during field upgrades, preventing accidental overwrite. | Use Scenario: Storing protocol stacks and field-upgradable configuration profiles in carrier-grade base station radios with long deployment horizons. IC Role / Device Role / Timing Role: High-endurance parallel flash supporting frequent remote reconfiguration while maintaining data integrity across thermal cycling. Use Value: 128 kB uniform sector architecture simplifies partitioning for dual-bank update schemes and rollback recovery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV20 | Same density and core voltage, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Targeted at space-constrained PCBs where board area is prioritized over socketability or rework ease | Select when footprint reduction and automated assembly outweigh manual debug/test accessibility |
| MX29GL256FHT2I-90G | Micron equivalent with 90 ns access, but lacks hardware ECC and OTP array; requires external error handling | Suitable for cost-sensitive applications where firmware corruption risk is mitigated by host-level redundancy | Choose only if ECC and OTP features are not required and BOM cost is primary constraint |
Compared with S29GL256P11TFIV20, the S29GL256S11FHIV23 offers superior serviceability via TSOP packaging and identical electrical performance; versus MX29GL256FHT2I-90G, it delivers built-in reliability features that reduce system-level validation effort and improve field failure MTBF.
Availability
S29GL256S11FHIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S11FHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global manufacturing and R&D infrastructure.
The GL-S family targets embedded systems needing robust, pin-compatible NOR flash for boot code and firmware storage - designed specifically for long-lifecycle industrial and automotive applications demanding guaranteed 20-year data retention and AEC-Q100 qualification.
FAQ
Is S29GL256S11FHIV23 compatible with legacy S29GL256N devices?
No. The S29GL256S11FHIV23 uses updated command sets, enhanced ECC architecture, and revised timing parameters compared to the N-series. While pinout is identical in TSOP, firmware drivers must be updated to support new status register layout and suspend/resume behavior per datasheet section 5.5.
What is the function of the STB pin on S29GL256S11FHIV23?
The STB (Strobe) pin is not present on the S29GL256S11FHIV23. This pin exists only on certain BGA variants (e.g., LAE package) for synchronous burst mode support. The TSOP version (FHIV23) omits STB and operates exclusively in asynchronous mode per datasheet Figure 1 and Section 8.1.
Does S29GL256S11FHIV23 support Common Flash Interface (CFI)?
Yes. It implements a full CFI parameter table accessible via standard query commands (0x98 at address 0x55). The CFI data includes vendor ID, device geometry, timing parameters, and command set identification - enabling OS-level flash abstraction layers like MTD in Linux to auto-detect and configure the device.
Can VIO be operated at 1.8 V while VCC is at 3.0 V?
Yes. The versatile I/O feature explicitly supports VIO from 1.65 V to VCC. At VCC = 3.0 V, VIO may be independently set to 1.8 V, allowing direct connection to 1.8 V microcontroller buses without level translation, provided all timing specifications in Table 11.4 are met under those voltage conditions.
S29GL256S11FHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S11FHIV23 FAQ
1.How can I place an order for S29GL256S11FHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11FHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11FHIV23 reliable?
The price and inventory of S29GL256S11FHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11FHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL256S11FHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11FHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11FHIV23?
S29GL256S11FHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11FHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11FHIV23?
For technical support, including S29GL256S11FHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11FHIV23 requirements.
6.How does Aetrix verify that S29GL256S11FHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11FHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11FHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL256S11FHIV23?
All S29GL256S11FHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11FHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11FHIV23 part is unused and in its original packaging.
Return procedure for S29GL256S11FHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11FHIV23 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
