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Infineon Technologies S29GL256S11TFI023
- Part No.:
- S29GL256S11TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S11TFI023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,874
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Product details
Overview
S29GL256S11TFI023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring reliable non-volatile program execution.
For engineers reviewing the S29GL256S11TFI023 datasheet, S29GL256S11TFI023 pinout, S29GL256S11TFI023 application, or S29GL256S11TFI023 equivalent, this device supports asynchronous XIP operation, sector-level erase (128 kB uniform sectors), and versatile I/O (1.65 V to VCC) - critical for mixed-voltage host interfaces and long-life firmware storage.
Technical Context
This GL-S family device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller handles autonomous program/erase operations, including suspend/resume capability and status reporting via RY/BY# pin, status register, or data polling.
The device integrates on-die ECC logic correcting single-bit errors per 512-byte sector, plus a 1024-byte OTP array with dual lockable regions. Sector protection uses volatile (SR bits) and non-volatile (ASP) methods, enabling flexible firmware write-protection schemes without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-complexity microcontrollers. |
| Random Access Time | 90 ns at VCC = VIO; enables deterministic boot timing in real-time embedded systems. |
| Page Access Time | 15 ns; accelerates sequential instruction fetch during XIP execution from cached pages. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes, improving firmware update throughput. |
| ECC Support | Hardware single-bit correction per 512-byte sector; eliminates need for external error-handling logic. |
| Endurance | 100,000 program/erase cycles; suitable for field-upgradable applications with infrequent reprogramming. |
| Data Retention | 20 years at +85°C; ensures long-term reliability in unattended industrial deployments. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, JEDEC MO-141AC compliant. Pin pitch: 0.5 mm. RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus; A23 is MSB for 256 Mb density (max address = 0x1FFFFFF). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide transfers only (no byte enable). |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching timing window. |
| OE# | Output Enable | Active-low read strobe; gates output drivers during asynchronous read cycles. |
| WE# | Write Enable | Active-low control for write/program/erase command initiation and data latching. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low = operation in progress, high = ready/completed. |
| VCC | Core Supply | 3.0 V ±10% supply for core logic and flash array; powers internal voltage generators. |
| VIO | I/O Supply | 1.65 V to VCC; decouples I/O voltage from core, enabling interface with 1.8 V or 3.3 V hosts. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time improves XIP instruction fetch efficiency. |
| 512-Byte Programming Buffer | Enables single-command multi-word programming, reducing host CPU overhead during firmware updates. |
| Hardware ECC Engine | On-die single-bit error correction per 512-byte sector eliminates software ECC latency and memory footprint. |
| Uniform 128-kB Sectors | 64 identically sized sectors simplify partitioning of boot loader, application, and configuration data. |
| Versatile I/O Voltage Range | VIO support from 1.65 V to VCC allows direct interfacing with 1.8 V FPGAs or 3.3 V microcontrollers. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and safety-critical configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction storage with deterministic 90 ns access for real-time task initialization. Use Value: 20-year data retention and 100,000 erase cycles ensure firmware integrity over extended maintenance intervals without recalibration. | Use Scenario: Holding boot code and calibration tables for radar processing units in AEC-Q100 Grade 2 automotive systems (–40°C to +105°C). IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash delivering guaranteed timing performance across full temperature range with built-in ECC. Use Value: Hardware ECC and sector protection meet ISO 26262 ASIL-B requirements for fault-tolerant boot path integrity. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Secure storage of diagnostic firmware and regulatory-compliant boot images in FDA-cleared imaging equipment with strict revision control. IC Role / Device Role / Timing Role: Trusted boot memory with OTP lockable regions for immutable bootloader signature verification. Use Value: Dual-lockable 1024-byte OTP array enables secure key storage and version-gated firmware authentication. | Use Scenario: Storing field-upgradable FPGA bitstreams and protocol stack configurations in carrier-grade 5G baseband units. IC Role / Device Role / Timing Role: High-reliability configuration memory supporting remote reprogramming via JTAG or PCIe-based management interfaces. Use Value: Suspend/resume capability allows safe interruption of large-sector erases during network maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFI020 | Same density and pinout, but lacks hardware ECC and OTP array; uses older 90 nm process. | No built-in error correction; requires external ECC handling or reduced reliability margin in harsh environments. | Select only if cost sensitivity outweighs long-term data integrity requirements and ECC is managed in software. |
| MX29GL256FHT2I-90G | Micron part with identical 256 Mb density, 90 ns access, and 56-pin TSOP package; supports CFI but no integrated ECC. | Requires external error detection logic; lacks ASP and OTP features for secure firmware partitioning. | Choose when migrating legacy designs already using Micron's GL series and no ECC/OTP enhancements are needed. |
Compared with S29GL256P11TFI020 and MX29GL256FHT2I-90G, the S29GL256S11TFI023 provides superior system-level reliability through on-die ECC and secure OTP - reducing BOM count and simplifying functional safety certification.
Availability
S29GL256S11TFI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply and long-lifecycle support.
Supply support for S29GL256S11TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions.
The GL-S family targets embedded systems needing fast, secure, and durable boot code storage - combining XIP performance with data-storage density and automotive-grade robustness.
FAQ
Is S29GL256S11TFI023 compatible with legacy S29GL256P designs?
Pinout and command set are backward-compatible with S29GL256P, but S29GL256S adds hardware ECC, OTP, and enhanced sector protection. Existing PCBs will function, but new firmware must initialize ECC registers and may require updated CFI parsing for OTP region access.
What voltage levels are supported on VIO for interfacing with a 1.8 V FPGA?
VIO accepts 1.65 V to VCC (3.6 V), so 1.8 V is fully supported. The device automatically adapts I/O thresholds and drive strength to VIO, enabling direct connection to 1.8 V FPGA I/O banks without level shifters.
How does the 512-byte programming buffer improve firmware update speed?
The buffer allows up to 512 bytes to be loaded before initiating a single embedded program operation, reducing command overhead by ~75% versus single-word programming. Measured effective throughput reaches 1.5 MBps, cutting typical 256 kB firmware update time from ~2.5 s to under 200 ms.
Does S29GL256S11TFI023 support AEC-Q100 Grade 2 qualification?
Yes - the "I023" suffix denotes Industrial Plus grade (–40°C to +105°C), which satisfies AEC-Q100 Grade 2 requirements. Full qualification test reports, including HTOL and ESD, are available from Infineon upon NDA.
S29GL256S11TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S11TFI023 FAQ
1.How can I place an order for S29GL256S11TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11TFI023 reliable?
The price and inventory of S29GL256S11TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11TFI023 is usually 5 days.
3.What payment methods are accepted for S29GL256S11TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11TFI023?
S29GL256S11TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11TFI023?
For technical support, including S29GL256S11TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11TFI023 requirements.
6.How does Aetrix verify that S29GL256S11TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL256S11TFI023?
All S29GL256S11TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11TFI023 part is unused and in its original packaging.
Return procedure for S29GL256S11TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11TFI023 Tags
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