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Infineon Technologies S29GL256S11TFIV10
- Part No.:
- S29GL256S11TFIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S11TFIV10.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,816
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Product details
Overview
S29GL256S11TFIV10 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust data retention.
For engineers reviewing the S29GL256S11TFIV10 datasheet, S29GL256S11TFIV10 pinout, S29GL256S11TFIV10 application, or S29GL256S11TFIV10 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and OTP array for secure configuration storage.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports page-mode reads (32-byte aligned pages), and uses embedded algorithms for sector erase and buffer programming. Its internal state machine handles command execution without external timing control.
The integrated ECC engine operates transparently during read cycles, correcting single-bit errors in real time using dedicated syndrome logic and spare bytes per sector. Sector protection includes both volatile (lock bits) and non-volatile (ASP register) methods, enabling field-updatable security policies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier automotive ECUs |
| Random Access Time | 90 ns at VCC = VIO; enables sub-100 ns XIP execution latency for real-time code fetch |
| Page Access Time | 15 ns; allows rapid sequential instruction fetch within 32-byte aligned pages |
| Write Buffer Size | 512 bytes; reduces average programming time by batching up to 256 words per command |
| ECC Capability | Single-bit correction per 512-byte sector; eliminates need for external error-handling logic |
| Endurance | 100,000 program/erase cycles; suitable for infrequently updated calibration tables |
| Data Retention | 20 years at +85°C; meets long-life requirements for automotive powertrain modules |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word-aligned address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control |
| CE# | Chip Enable | Active-low chip select; enables device for read/write when asserted with valid address |
| OE# | Output Enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write Enable | Active-low write strobe; latches data on rising edge for program/erase commands |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into standby and clears internal state |
| VCC | Core Supply | 2.7–3.6 V single supply for core logic, programming, and erase functions |
| VIO | I/O Supply | 1.65–3.6 V independent I/O voltage; decouples interface timing from core rail |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse Technology | Enables higher density and lower power vs. legacy 90 nm NOR, with improved endurance and retention |
| Asynchronous Page Read (32-byte) | Reduces effective instruction fetch latency in XIP applications by minimizing address setup overhead |
| 512-byte Programming Buffer | Increases effective write bandwidth to 1.5 MBps, cutting firmware update time by >3× vs. single-word programming |
| Hardware ECC Engine | Corrects single-bit errors on-the-fly without CPU intervention or software overhead |
| Separate 1024-byte OTP Array | Stores immutable calibration data or cryptographic keys with dual lockable regions for hierarchical access control |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code and GUI assets for digital dashboards with real-time rendering requirements. IC Role / Device Role / Timing Role: NOR flash executing XIP code directly from address space; provides deterministic <90 ns instruction fetch latency. Use Value: Eliminates external RAM buffering for code execution, reducing BOM count and board area while meeting ASIL-B timing constraints. | Use Scenario: Holding firmware images and configuration parameters in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile program storage with sector-level protection; supports field updates via RS-485 without erasing operational code. Use Value: 128 kB uniform sectors enable atomic firmware patching; AEC-Q100 Grade 2 rating ensures reliability at +105°C ambient. |
| Medical Diagnostic Imaging Boot | Avionics Display System |
Use Scenario: Hosting boot loader and safety-critical initialization routines for MRI/X-ray controller boards. IC Role / Device Role / Timing Role: Secure boot memory with OTP-locked signature verification keys and hardware ECC for integrity assurance. Use Value: Internal ECC prevents silent corruption of boot code; OTP region resists tampering during regulatory audits or field servicing. | Use Scenario: Storing display firmware and font assets in certified cockpit displays requiring DO-254 compliance. IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention and suspend/resume capability for in-flight updates. Use Value: Suspend/resume allows safe interruption of sector erase during critical flight phases; RY/BY# pin enables precise status monitoring in safety-critical software stacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV10 | Same density and package, but lacks Versatile I/O (VIO fixed to VCC); no 1.65 V compatibility | Not suitable for mixed-voltage systems with 1.8 V I/O domains | Select only if system uses single 3.3 V rail for both core and I/O |
| MX29GL256FHT2I-90G | Macronix part with 90 ns access, but no integrated ECC and only 100K endurance (vs. Infineon's 100K with ECC) | Requires external error detection logic; less suitable for safety-critical boot storage | Consider for cost-sensitive industrial apps where ECC is handled in software |
Compared with S29GL256P11TFIV10, this part adds Versatile I/O flexibility and ECC; versus MX29GL256FHT2I-90G, it delivers hardware-based reliability assurance essential for automotive and medical boot memory.
Availability
S29GL256S11TFIV10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and avionics display systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S29GL256S11TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions.
The GL-S family targets automotive and industrial applications demanding AEC-Q100 qualification, extended temperature operation, and embedded flash with XIP capability and hardware ECC - optimized for ECU boot code and firmware storage.
FAQ
What is the maximum operating temperature range for S29GL256S11TFIV10?
This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. The datasheet specifies full functionality and guaranteed timing across this range, including 90 ns random access and 100,000 program/erase cycles. Thermal derating is not required within these limits.
Does S29GL256S11TFIV10 support byte-level writes?
No - it supports only word-level (16-bit) writes. The device requires DQ15–DQ0 to be driven with valid data and uses WE# to latch each 16-bit word. Byte writes are not supported; partial-word programming must be handled by the host system via read-modify-write sequences.
How does the 512-byte write buffer improve programming efficiency?
The buffer allows up to 256 words (512 bytes) to be loaded before initiating programming, achieving 1.5 MBps effective throughput. This reduces total programming time by eliminating per-word command overhead and enables faster firmware updates compared to single-word programming, especially for contiguous code sections.
Is the OTP array reprogrammable after locking?
No - once either of the two OTP lock bits is set, that 512-byte region becomes permanently read-only. The lock is implemented via one-time fuse elements; no command or voltage sequence can unlock or rewrite a locked region. This ensures cryptographic key or calibration data immutability in production units.
S29GL256S11TFIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S11TFIV10 FAQ
1.How can I place an order for S29GL256S11TFIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11TFIV10 reliable?
The price and inventory of S29GL256S11TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11TFIV10 is usually 5 days.
3.What payment methods are accepted for S29GL256S11TFIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11TFIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11TFIV10?
S29GL256S11TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11TFIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11TFIV10?
For technical support, including S29GL256S11TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11TFIV10 requirements.
6.How does Aetrix verify that S29GL256S11TFIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11TFIV10 meets industry standards.
7.What is the process for return or replacement of S29GL256S11TFIV10?
All S29GL256S11TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11TFIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11TFIV10 part is unused and in its original packaging.
Return procedure for S29GL256S11TFIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11TFIV10 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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