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Infineon Technologies S29GL256S11TFIV20
- Part No.:
- S29GL256S11TFIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S11TFIV20.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:910
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Product details
Overview
S29GL256S11TFIV20 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware execution in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL256S11TFIV20 datasheet, S29GL256S11TFIV20 pinout, S29GL256S11TFIV20 application, or S29GL256S11TFIV20 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations-including suspend/resume-and enforces sector-level protection via volatile/non-volatile ASP and OTP lockable regions.
The internal architecture includes dedicated erase voltage and programming voltage generators, status register monitoring, and three status determination methods: data polling, status register read, and RY/BY# pin assertion. ECC logic operates transparently during read cycles without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables direct XIP execution from flash without external cache penalty |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | Hardware single-bit correction; eliminates need for external ECC logic or software overhead |
| Endurance | 100,000 program/erase cycles per sector; suitable for field-upgradable firmware partitions |
| Data Retention | 20 years at +85°C; meets long-life requirements for automotive ECUs and industrial PLCs |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), RoHS-compliant, JEDEC MO-142AC compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word-aligned address bus; A23 is MSB for 256 Mb density (max address = 0x1FFFFFF) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads with no external data multiplexing |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables address/data bus contention management |
| OE# | Output Enable | Active-low read strobe; gates output drivers independently of CE# for shared-bus timing control |
| WE# | Write Enable | Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready for next command |
| WP# | Write Protect | Hardware sector lock override; disables program/erase to protected sectors regardless of software commands |
| VCC | Core Supply | 2.7–3.6 V single supply for all operations-no separate VPP required |
| VIO | I/O Supply | 1.65 V to VCC; enables interoperability with 1.8 V, 2.5 V, or 3.3 V host interfaces |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Voltage Range | VIO supports 1.65 V to VCC-eliminates level shifters when interfacing with mixed-voltage SoCs |
| 512-Byte Programming Buffer | Enables 1.5 MBps effective write speed-reduces firmware update time by >60% vs. single-word programming |
| Uniform 128-kB Sector Architecture | Simplifies BOM and layout across GL-S family densities; enables consistent partitioning for secure boot and OTA updates |
| Hardware ECC Engine | Corrects single-bit errors on-the-fly during read; prevents silent corruption in safety-critical firmware storage |
| OTP Array with Dual Lock Regions | 1024-byte one-time-programmable space segmented into two independently lockable zones-ideal for storing cryptographic keys and calibration data |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, OS kernel, and GUI assets in digital instrument clusters requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 90 ns read latency. Use Value: Eliminates external SRAM caching; supports real-time rendering and fast cold-boot (<500 ms) under –40°C to +105°C ambient. | Use Scenario: Holds field-upgradable ladder logic, configuration tables, and safety firmware in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Secure, endurance-rated firmware repository with sector-level write protection and ECC integrity assurance. Use Value: Enables safe over-the-air updates without risk of corruption; 100,000-cycle endurance supports >10 years of scheduled maintenance cycles. |
| Medical Imaging Control Board | Avionics Display System |
Use Scenario: Stores FPGA configuration bitstreams and diagnostic firmware in portable ultrasound and MRI control modules certified to IEC 62304 Class C. IC Role / Device Role / Timing Role: High-reliability configuration memory with 20-year data retention and hardware ECC for radiation-tolerant operation. Use Value: Prevents bit-flip-induced misconfiguration in mission-critical imaging pipelines; OTP region secures calibration coefficients against tampering. | Use Scenario: Hosts display firmware, font assets, and ARINC 661 widget definitions in certified cockpit display units operating in extended temperature environments. IC Role / Device Role / Timing Role: Deterministic boot memory with page-mode read acceleration for rapid UI initialization post-power-on reset. Use Value: Achieves <300 ms display wake-up time; Versatile I/O allows direct connection to 2.5 V GPU interface without voltage translation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIV20 | Same density and package, but uses older 90 nm process; 110 ns random access, no Versatile I/O (VIO fixed to VCC) | Lacks mixed-voltage support and has slower read performance; not qualified for AEC-Q100 Grade 2 | Select only if legacy board compatibility or cost sensitivity outweighs performance and automotive qualification needs. |
| MX29GL256FHT2I-90G | Macronix 256 Mb parallel NOR; 90 ns access, 1.7–3.6 V VIO range, but no integrated ECC or OTP array | Requires external ECC implementation and lacks secure key storage; supports same industrial temp range | Choose when lower unit cost is critical and system-level ECC can be implemented in host processor firmware. |
Compared with S29GL256P11TFIV20, this part adds Versatile I/O flexibility and AEC-Q100 Grade 2 support; versus MX29GL256FHT2I-90G, it provides hardware ECC and OTP security-critical for functional safety and secure boot architectures.
Availability
S29GL256S11TFIV20 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical imaging control boards requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for S29GL256S11TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and transportation markets.
The GL-S family targets embedded systems needing deterministic XIP performance, high endurance, and automotive-grade reliability-designed specifically for boot code, firmware, and secure configuration storage in safety-critical applications.
FAQ
Does S29GL256S11TFIV20 support execute-in-place (XIP) operation?
Yes. The device supports true XIP with 90 ns random access time and page-mode reads, enabling CPU instruction fetch directly from flash without copying to RAM. Its asynchronous interface and deterministic timing allow tight integration with ARM Cortex-M and Power Architecture-based boot ROMs.
What is the function of the STB pin on S29GL256S11TFIV20?
The STB (Standby) pin is not present on S29GL256S11TFIV20. This part uses CE# and VCC-controlled power-down mode instead. The STB signal appears only in earlier GL-N generation devices; GL-S relies on CE# deassertion and automatic deep power-down entry after 100 µs of inactivity.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is permanently programmable once written. Each of its two lockable regions can be individually secured via dedicated lock bits; after locking, no further writes or erases are possible-even with elevated voltage or command sequences.
How does the Versatile I/O feature affect timing specifications?
Versatile I/O introduces two timing modes: "Full VCC = VIO" (tighter specs: 90 ns tACC) and "VersatileIO VIO" (relaxed specs: 100 ns tACC). When VIO differs from VCC, AC parameters scale per the datasheet's VersatileIO column-requiring host timing margins to accommodate the slower mode if mixed-voltage operation is used.
S29GL256S11TFIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S11TFIV20 FAQ
1.How can I place an order for S29GL256S11TFIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11TFIV20 reliable?
The price and inventory of S29GL256S11TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11TFIV20 is usually 5 days.
3.What payment methods are accepted for S29GL256S11TFIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11TFIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11TFIV20?
S29GL256S11TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11TFIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11TFIV20?
For technical support, including S29GL256S11TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11TFIV20 requirements.
6.How does Aetrix verify that S29GL256S11TFIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11TFIV20 meets industry standards.
7.What is the process for return or replacement of S29GL256S11TFIV20?
All S29GL256S11TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11TFIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11TFIV20 part is unused and in its original packaging.
Return procedure for S29GL256S11TFIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11TFIV20 Tags
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