Infineon Technologies S29GL256S11TFV010
- Part No.:
- S29GL256S11TFV010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S11TFV010.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,012
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Product details
Overview
S29GL256S11TFV010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL256S11TFV010 datasheet, S29GL256S11TFV010 pinout, S29GL256S11TFV010 application, or S29GL256S11TFV010 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array for secure configuration, and AEC-Q100 Grade 2 qualification for automotive embedded control units.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffered programming without external timing control. Its internal state machine handles command execution, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read operations.
The GL-S architecture separates address decoding, erase voltage generation, and program voltage regulation into dedicated on-die blocks. Sector protection is managed through volatile (SR bits) and non-volatile (ASP registers) methods, while the 1024-byte OTP array enables one-time secure storage of calibration data or cryptographic keys with dual lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full firmware images in mid-tier MCU applications. |
| Access time (random) | 90 ns at VCC = VIO - enables direct XIP execution from flash with minimal CPU wait states. |
| Page access time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages. |
| Write buffer size | 512 bytes - allows single-command programming of up to 256 words, reducing host software overhead. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical systems. |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - meets long-life requirements for industrial controllers. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and high-ambient industrial gateways. |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch). RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address inputs | 24-bit word-aligned address bus; A23 is MSB for 256 Mb density (2,097,152 words). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 1.65–3.6 V I/O voltage (VIO) independent of core VCC. |
| CE# | Chip enable | Active-low device select; controls power-down entry when deasserted during standby. |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state or current draw. |
| WE# | Write enable | Active-low control for write/program/erase command latching and data capture timing. |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal reflecting internal operation status; used for polling instead of software delays. |
| RESET# | Hardware reset | Active-low asynchronous reset that halts all embedded operations and returns device to read mode. |
| WP# | Write protect | Active-low hardware lock for top/bottom sectors; overrides software protection commands when asserted. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65–3.6 V independently of VCC - simplifies interfacing with mixed-voltage SoCs and FPGAs. |
| 512-byte programming buffer | Enables 1.5 MBps effective write speed - cuts firmware update time by >4× vs. single-word programming. |
| Uniform 128 kB sectors | 128 identical erase blocks simplify BOM management and field firmware partitioning across product variants. |
| Secure OTP array | 1024-byte one-time-programmable region with two lockable sections - stores immutable keys or calibration offsets. |
| CFI-compliant interface | Standardized JEDEC JESD68 parameter table - enables auto-detection and driver compatibility across toolchains. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in AEC-Q100 Grade 2 qualified ECU modules operating at 105°C ambient. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and hardware ECC for ASIL-B functional safety compliance. Use Value: Eliminates external error-correction logic and supports deterministic 90 ns instruction fetch latency under thermal stress. |
Use Scenario: Holding firmware and configuration data in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: High-reliability firmware repository with 100,000-cycle endurance and 20-year data retention at 85°C. Use Value: Reduces field maintenance frequency and avoids firmware corruption due to power loss during updates. |
| Medical Imaging System Boot Memory | Telecom Base Station Configuration |
Use Scenario: Hosting boot code and FPGA bitstreams in Class II medical devices requiring long-term data integrity and audit-trail traceability. IC Role / Device Role / Timing Role: Secure, tamper-resistant boot memory with OTP-locked calibration parameters and sector-level write protection. Use Value: Meets IEC 62304 software lifecycle requirements via hardware-enforced write locks and ECC-verified reads. |
Use Scenario: Storing radio configuration profiles and protocol stacks in outdoor 4G/5G base station remote radio units (RRUs). IC Role / Device Role / Timing Role: Field-upgradable configuration store supporting hot-swap firmware patches without system reboot. Use Value: Enables zero-downtime updates using suspend/resume during sector erase and buffered programming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFV010 | Same density and package, but lacks Versatile I/O (VIO fixed to VCC); no 1.65 V low-VIO support. | Not suitable for mixed-voltage SoC interfaces requiring independent I/O rail scaling. | Select only if system uses single 3.3 V rail for both core and I/O, and lower VIO headroom is unnecessary. |
| MX29GL256FHT2I-90G | Macronix 256 Mb parallel NOR; 90 ns access, but no integrated ECC and no OTP array. | Requires external ECC logic and separate secure storage for keys; higher BOM cost and PCB area. | Consider only if cost sensitivity outweighs safety certification needs and design simplicity goals. |
Compared with S29GL256P11TFV010 and MX29GL256FHT2I-90G, the S29GL256S11TFV010 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, Versatile I/O, and OTP security in a single 56-ball VBU package-reducing validation effort and enabling consolidated firmware+security architecture.
Availability
S29GL256S11TFV010 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, medical imaging boot systems, and telecom base station configuration storage requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for S29GL256S11TFV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.
The GL-S family targets automotive and industrial embedded systems needing robust, high-speed parallel NOR flash with integrated reliability features-designed specifically for XIP-capable boot memory in safety-critical environments.
FAQ
What is the maximum operating junction temperature for S29GL256S11TFV010?
The device is rated for operation up to +105°C ambient temperature (AEC-Q100 Grade 2), with a maximum junction temperature of +125°C under specified thermal conditions. Thermal resistance (θJA) is 42°C/W for the 56-ball VBU package, requiring appropriate PCB copper pour and airflow in sealed enclosures.
Does S29GL256S11TFV010 support byte-level writes?
No. The device only supports word-level (16-bit) writes and requires programming in multiples of the 512-byte buffer size. Single-word programming is possible but not byte-addressable; DQ0–DQ7 and DQ8–DQ15 must be written together as a 16-bit word.
How is the OTP array protected from accidental overwrite?
The 1024-byte OTP array has two independently lockable regions. Once locked via dedicated CFI commands (0x60 → 0xD0), the lock becomes permanent and irreversible-even after power cycle or reset. Lock status is readable via CFI query, and attempts to program locked regions return status error.
Can S29GL256S11TFV010 be used with a 1.8 V I/O interface?
Yes. With VIO supplied at 1.8 V (within 1.65–3.6 V range) and VCC at 3.0 V, the device fully supports 1.8 V logic signaling on DQ0–DQ15, CE#, OE#, WE#, and RY/BY#. All timing parameters remain valid per datasheet Table 2–3 under VersatileIO conditions.
S29GL256S11TFV010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S11TFV010 FAQ
1.How can I place an order for S29GL256S11TFV010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11TFV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11TFV010 reliable?
The price and inventory of S29GL256S11TFV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11TFV010 is usually 5 days.
3.What payment methods are accepted for S29GL256S11TFV010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11TFV010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11TFV010?
S29GL256S11TFV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11TFV010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11TFV010?
For technical support, including S29GL256S11TFV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11TFV010 requirements.
6.How does Aetrix verify that S29GL256S11TFV010 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11TFV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11TFV010 meets industry standards.
7.What is the process for return or replacement of S29GL256S11TFV010?
All S29GL256S11TFV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11TFV010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11TFV010 part is unused and in its original packaging.
Return procedure for S29GL256S11TFV010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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