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Infineon Technologies S29GL256S11TFV020
- Part No.:
- S29GL256S11TFV020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S11TFV020.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,883
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Product details
Overview
S29GL256S11TFV020 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) for read/program/erase - deployed in industrial embedded systems for firmware storage and boot code execution.
For engineers reviewing the S29GL256S11TFV020 datasheet, S29GL256S11TFV020 pinout, S29GL256S11TFV020 application, or S29GL256S11TFV020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, internal hardware ECC for single-bit correction, 100,000 program/erase cycles, and Versatile I/O support (1.65–3.6 V).
Technical Context
This device implements an asynchronous parallel interface with ×16 data bus and word-aligned addressing, supporting both standard random reads and 32-byte page-mode reads to reduce latency for sequential accesses within the same page. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.
The flash integrates advanced sector protection (ASP) with volatile and non-volatile lock options per sector, plus a dedicated 1024-byte OTP array split into two lockable regions. It complies with Common Flash Interface (CFI) specification and supports AEC-Q100 Grade 2 (–40°C to +105°C) operation when configured for automotive use.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-complexity microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables fast XIP execution without external cache penalty |
| Page Access Time | 15 ns; allows rapid burst reads of up to 32 bytes within same page boundary |
| Programming Buffer | 512 bytes; reduces effective programming time by batching writes instead of single-word operations |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic in host system |
| Sector Size | Uniform 128 kB sectors; simplifies firmware update partitioning and wear-leveling implementation |
| Endurance | 100,000 program/erase cycles per sector; suitable for field-upgradable industrial controllers |
| Data Retention | 20 years at 85°C; ensures long-term reliability in unattended embedded deployments |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), compliant with JEDEC MO-141AC. Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit word address bus (AMAX = A23 for 256 Mb); supports 32 MB linear addressing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in 1.65–3.6 V Versatile I/O mode |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching |
| OE# | Output Enable | Active-low control for data bus output drivers during read operations |
| WE# | Write Enable | Active-low strobe for latching address/data during program/erase commands |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into reading state and clears internal state |
| VCC | Core Supply | 3.0 V ±10% supply for core logic, programming, and erase voltage generation |
| VIO | I/O Supply | Independent 1.65–3.6 V supply for interface buffers; decouples I/O from core voltage |
| WP# | Write Protect | Hardware sector protection enable; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| 65 nm MIRRORBIT™ Eclipse process | Enables higher density and lower active current vs. older floating-gate NOR technologies |
| Asynchronous 32-byte page read | Reduces average read latency for instruction fetch sequences in XIP applications |
| Automatic ECC with single-bit correction | Offloads error handling from host processor and prevents silent data corruption |
| Suspend/resume for program & erase | Allows host to interrupt long-duration operations (e.g., sector erase) for urgent reads |
| Separate 1024-byte OTP array | Provides secure storage for calibration data, keys, or unique identifiers with dual-lock security |
| Common Flash Interface (CFI) | Enables automatic driver detection and configuration in OS/bootloader environments |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing real-time control firmware in programmable logic controllers with frequent field updates. IC Role / Device Role / Timing Role: Non-volatile boot and application code storage with XIP capability and deterministic 90 ns read latency. Use Value: Eliminates need for external RAM copy during boot; supports over-the-air updates via 128 kB sector erase granularity. | Use Scenario: Holding boot loader and safety-critical sensor fusion code in camera-based driver assistance modules. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified NOR flash providing verified startup timing and ECC-protected code integrity. Use Value: Meets ASIL-B functional safety requirements through hardware ECC and 20-year data retention at 105°C. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability firmware storage with 100,000-cycle endurance and sector-level write protection. Use Value: Ensures regulatory compliance via traceable firmware versioning and secure OTP storage of calibration constants. | Use Scenario: Storing FPGA configuration, protocol stacks, and field-upgradable DSP firmware in 5G remote radio units. IC Role / Device Role / Timing Role: Parallel NOR interface with CFI support enabling automatic driver initialization in Linux-based baseband processors. Use Value: Reduces boot time via page-mode reads and simplifies BOM management with single-part support for multiple voltage domains (1.8 V/3.3 V I/O). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFV020 | Same density and timing, but uses legacy 90 nm process; lacks Versatile I/O (VIO fixed to VCC) | No independent I/O voltage scaling; incompatible with mixed-voltage SoC interfaces | Select only if legacy compatibility or cost sensitivity outweighs I/O flexibility needs |
| MX29GL256FHT2I-90G | Macronix part with 90 ns access, no internal ECC, 64-ball FBGA only, no OTP array | Requires external ECC logic; lacks secure silicon region for key storage | Choose when footprint constraints favor BGA or when ECC handled in host software |
Compared with S29GL256P11TFV020 and MX29GL256FHT2I-90G, the S29GL256S11TFV020 uniquely combines Versatile I/O, on-die ECC, and OTP security in a TSOP package - making it optimal for new industrial designs requiring interface flexibility and functional safety support.
Availability
S29GL256S11TFV020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S11TFV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and R&D infrastructure.
The GL-S family targets high-reliability embedded applications demanding XIP performance, robust data integrity, and long-term supply stability - especially where firmware security and mixed-voltage interfacing are critical.
FAQ
Does S29GL256S11TFV020 support execute-in-place (XIP) operation?
Yes, it supports true XIP operation due to its 90 ns random access time and asynchronous parallel interface. The device delivers full 16-bit words on every read cycle without requiring prefetch or caching, enabling direct CPU instruction fetch from flash memory in microcontroller-based systems.
What is the function of the VIO pin, and how does it differ from VCC?
VIO supplies power exclusively to the input/output buffer circuitry and can operate independently from VCC across 1.65 V to 3.6 V. This allows interfacing with 1.8 V or 3.3 V host processors while maintaining 3.0 V core operation, eliminating level-shifters in mixed-voltage designs.
How is the 1024-byte OTP array structured and secured?
The OTP array consists of two independently lockable 512-byte regions. Once locked via dedicated CFI commands, each region becomes permanently read-only. Locking is irreversible and provides hardware-enforced protection for calibration data, cryptographic keys, or serial numbers against overwrite or tampering.
Can S29GL256S11TFV020 be used in automotive applications, and what qualification does it hold?
Yes - when ordered with automotive-grade suffixes (e.g., "-A" or "-B"), it meets AEC-Q100 Grade 2 (–40°C to +105°C) qualification. The specific part S29GL256S11TFV020 is rated for industrial temperature (–40°C to +85°C), but shares identical die and test flow with automotive variants.
S29GL256S11TFV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S11TFV020 FAQ
1.How can I place an order for S29GL256S11TFV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11TFV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11TFV020 reliable?
The price and inventory of S29GL256S11TFV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11TFV020 is usually 5 days.
3.What payment methods are accepted for S29GL256S11TFV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11TFV020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11TFV020?
S29GL256S11TFV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11TFV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11TFV020?
For technical support, including S29GL256S11TFV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11TFV020 requirements.
6.How does Aetrix verify that S29GL256S11TFV020 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11TFV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11TFV020 meets industry standards.
7.What is the process for return or replacement of S29GL256S11TFV020?
All S29GL256S11TFV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11TFV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11TFV020 part is unused and in its original packaging.
Return procedure for S29GL256S11TFV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11TFV020 Tags
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M24C02-WMN6TP
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