My Inquiry
My Account
Infineon Technologies S29GL256S11TFV023
- Part No.:
- S29GL256S11TFV023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S11TFV023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,844
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL256S11TFV023 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It integrates hardware ECC for single-bit correction, 128-kB uniform sector erase, and a 512-byte write buffer-enabling fast in-system programming for boot code storage in industrial microcontroller-based systems.
For engineers reviewing the S29GL256S11TFV023 datasheet, S29GL256S11TFV023 pinout, S29GL256S11TFV023 application, or S29GL256S11TFV023 equivalent, key selection criteria include its asynchronous ×16 interface, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program/erase cycles, and OTP array support for secure configuration storage.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without host CPU intervention. Its architecture supports page-mode read (32-byte aligned, 15 ns subsequent access) and buffer programming (up to 512 bytes per command), reducing effective write latency by >60% versus byte-by-byte programming.
The flash uses dual-plane MIRRORBIT™ cell structure with on-die ECC logic, status register polling, RY/BY# pin signaling, and Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per 128-kB sector. It complies with Common Flash Interface (CFI) v1.4 for standardized software driver compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words |
| Random access time | 90 ns at VCC = VIO = 3.0 V - determines worst-case instruction fetch latency in XIP applications |
| Page access time | 15 ns - enables rapid sequential reads within 32-byte aligned pages for firmware execution |
| Write buffer size | 512 bytes - allows single-command programming of up to 256 words, improving throughput to 1.5 MBps |
| ECC capability | On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot storage |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention at 85°C - validated for long-life industrial deployment |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive and high-ambient industrial control |
Pinout & Package
Package: 56-ball VBU Fortified BGA (9 mm × 7 mm, 0.8 mm pitch), RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 256 Mb addressing (AMAX = A23); word-aligned only |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65–VCC) |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read operations |
| WE# | Write enable | Active-low control for write/program/erase command initiation and data latching |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal indicating internal operation progress or completion |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and returns to read mode |
| WP# | Write protect | Active-low hardware lock for sector protection registers and OTP array |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous ×16 interface | Eliminates clock routing complexity and timing closure challenges in MCU host designs |
| 512-byte programming buffer | Reduces host-side command overhead and improves effective write bandwidth by 4× vs. single-word programming |
| Hardware ECC engine | Corrects single-bit errors on-the-fly without CPU intervention or software overhead |
| Uniform 128-kB sectors | Enables deterministic erase scheduling and wear leveling across 256 independent sectors |
| 1024-byte OTP array | Provides tamper-resistant storage for calibration data, security keys, or unique device identifiers |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
|
Use Scenario: Storing real-time control firmware in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over 15+ years of unattended operation. |
Use Scenario: Holding boot loader and safety monitor code in radar ECU modules requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Secure, high-reliability flash storing ASIL-B critical startup sequences with hardware ECC validation. Use Value: On-die ECC and OTP lockable regions prevent corruption or unauthorized modification of boot code in harsh environments. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
|
Use Scenario: Hosting diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound devices with thermal cycling. IC Role / Device Role / Timing Role: Dual-role memory supporting both code execution (XIP) and parameter storage with sector-level protection. Use Value: Versatile I/O (1.65–3.6 V) allows direct interfacing with 1.8 V or 3.3 V FPGAs without level shifters. |
Use Scenario: Storing field-upgradable configuration tables and protocol stacks in 5G remote radio units exposed to wide temperature swings. IC Role / Device Role / Timing Role: High-density, low-power flash enabling fast reconfiguration via buffer programming and suspend/resume. Use Value: 15 ns page access time accelerates parameter loading during RF calibration sequences, reducing downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFV020 | Legacy 90 nm process; no hardware ECC; 100,000 cycles but only 10-year retention at 85°C | Lacks on-die ECC and OTP array - requires external error handling and separate key storage | Select only if legacy design reuse is required and ECC is implemented in software/firmware |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, same density/package, but no Versatile I/O (VIO fixed at 3.3 V) | Incompatible with mixed-voltage hosts needing 1.8 V I/O; lacks CFI v1.4 and ASP granularity | Choose only when host system uses fixed 3.3 V I/O and does not require OTP or fine-grained sector locking |
Compared with S29GL256P11TFV020 and MX29GL256FHT2I-90G, the S29GL256S11TFV023 delivers superior reliability through integrated ECC and longer data retention, while its Versatile I/O and CFI compliance simplify migration across voltage domains and software ecosystems.
Availability
S29GL256S11TFV023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for S29GL256S11TFV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
The GL-S family targets high-reliability embedded systems requiring robust, pin-compatible NOR flash with enhanced endurance, ECC, and automotive qualification - bridging XIP performance and data storage density.
FAQ
Does S29GL256S11TFV023 support execute-in-place (XIP) operation?
Yes. The device supports true XIP with ≤90 ns random access time and page-mode reads (15 ns subsequent access), enabling direct CPU instruction fetch from flash without RAM copy. Its architecture includes dedicated address/data latches and state control logic optimized for zero-wait-state execution in Cortex-M and Power Architecture MCUs.
What is the function of the STB pin on S29GL256S11TFV023?
The STB (Strobe) pin is not present on S29GL256S11TFV023. This pin appears only on earlier GL-P series devices. The S29GL256S11TFV023 uses standard CE#/OE#/WE# control signals and has no STB functionality - confirmed by Infineon's 001-98285 Rev. *U datasheet Figure 1 and Pin Description Table (Section 8.2).
Can the OTP array be programmed multiple times?
No. The 1024-byte OTP (One-Time Programmable) array consists of fuse-based cells. Each byte can be programmed only once - setting bits from '1' to '0'. Programming is irreversible, and verification must occur immediately after write. Two lockable regions allow independent protection of calibration data and security keys.
Is the 56-ball VBU package RoHS and REACH compliant?
Yes. Infineon certifies the S29GL256S11TFV023 in VBU package as fully RoHS Directive 2011/65/EU compliant and REACH SVHC-free per declaration ID 2023-00127. The package uses matte tin (Sn) terminations and lead-free solder compatible with IPC-J-STD-020D reflow profiles.
S29GL256S11TFV023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S11TFV023 FAQ
1.How can I place an order for S29GL256S11TFV023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S11TFV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S11TFV023 reliable?
The price and inventory of S29GL256S11TFV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S11TFV023 is usually 5 days.
3.What payment methods are accepted for S29GL256S11TFV023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S11TFV023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S11TFV023?
S29GL256S11TFV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S11TFV023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S11TFV023?
For technical support, including S29GL256S11TFV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S11TFV023 requirements.
6.How does Aetrix verify that S29GL256S11TFV023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S11TFV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S11TFV023 meets industry standards.
7.What is the process for return or replacement of S29GL256S11TFV023?
All S29GL256S11TFV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S11TFV023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S11TFV023 part is unused and in its original packaging.
Return procedure for S29GL256S11TFV023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S11TFV023 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
