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Infineon Technologies S29GL256S90DHA010

Name: S29GL256S90DHA010
Brand: Infineon Technologies
SKU: S29GL256S90DHA010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90DHA010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90DHA010.pdf

Description:: IC FLASH 256MBIT CFI 64FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL256S90DHA010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), ×16 data bus, and 90 ns random access time. It features 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-kbyte sectors, and supports industrial temperature range (–40°C to +85°C) in 56-pin TSOP package. Used in boot code storage for embedded controllers requiring XIP capability and deterministic read latency.

For engineers reviewing the S29GL256S90DHA010 datasheet, S29GL256S90DHA010 pinout, S29GL256S90DHA010 application, or S29GL256S90DHA010 equivalent, key selection criteria include page-mode read performance (15 ns), sector-erase endurance (100,000 cycles), OTP array availability, ASP protection granularity, and Versatile I/O voltage support (1.65 V to VCC).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), 32-byte page reads, and embedded algorithm controller (EAC) for autonomous program/erase operations. It uses dual-plane architecture enabling suspend/resume during programming or erasing, and integrates status register, data polling, and RY/BY# pin for real-time operation monitoring.

The internal ECC engine operates transparently during read cycles, correcting single-bit errors without software intervention, while the Common Flash Interface (CFI) table provides standardized JEDEC-compliant identification and timing parameters. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods per 128-kbyte sector.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers.
Random access time	90 ns at VCC = VIO - enables direct XIP execution from flash with sub-100 ns instruction fetch latency.
Page access time	15 ns - allows burst reads within 32-byte aligned pages for high-throughput data streaming.
Write buffer size	512 bytes (256 words) - reduces effective programming time by batching writes, improving firmware update throughput.
Erase endurance	100,000 program/erase cycles per sector - suitable for field-upgradable systems with infrequent but critical reprogramming.
Data retention	20 years at +85°C - ensures long-term reliability in industrial control and automotive ECUs without refresh.
Operating temperature	–40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments without thermal derating.
I/O voltage range	1.65 V to VCC - supports mixed-voltage system interfacing (e.g., 1.8 V I/O with 3.3 V core) without level shifters.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus; A23 is MSB for 256 Mb density (2,097,152 words); no byte addressing.
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports high-speed read/write with common flash interface timing compliance.
CE#	Chip enable	Active-low chip select; controls device power state and enables command decoding when asserted.
OE#	Output enable	Active-low read strobe; gates output drivers during read cycles; used with CE# for asynchronous timing control.
WE#	Write enable	Active-low write strobe; initiates program/erase commands and data latching on rising edge of WE#.
RY/BY#	Ready/Busy indicator	Open-drain active-low signal indicating internal operation progress; used for hardware polling instead of software polling.
RESET#	Hardware reset	Active-low asynchronous reset that aborts ongoing operations and returns device to read mode.
VCC	Core supply	3.0 V nominal (2.7–3.6 V); powers core logic, EAC, and memory array; single-supply simplifies power design.
VIO	I/O supply	1.65–VCC; independently configurable I/O voltage supports mixed-signal SoC interfacing.
WP#	Write protect	Active-low hardware lock for top/bottom sectors; complements software-based Advanced Sector Protection (ASP).

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns cycle time - accelerates sequential code/data fetch in XIP applications.
Internal hardware ECC	Single-bit error correction per 512-byte sector - eliminates need for external error-handling firmware overhead.
512-byte write buffer	Reduces average programming time by up to 4× vs. single-word writes - critical for fast field firmware updates.
Advanced Sector Protection (ASP)	Volatile and non-volatile lock per 128-kbyte sector - enables secure boot partitioning and OTA update isolation.
One-Time Programmable (OTP) array	1024-byte region with two lockable segments - stores immutable keys, calibration data, or device-specific identifiers.
Suspend/resume capability	Interrupts erase or program to service higher-priority reads - maintains system responsiveness during background flash operations.

Applications

Boot Code Storage

Firmware Update Storage

Use Scenario: Storing bootloader and initial firmware image for ARM Cortex-M or RISC-V microcontrollers in industrial gateways.

IC Role / Device Role / Timing Role: Primary non-volatile code memory enabling eXecute-In-Place (XIP) with deterministic 90 ns instruction fetch latency.

Use Value: Eliminates need for external RAM copy during startup, reducing BOM cost and boot time by >30% versus serial flash.

Use Scenario: Holding validated firmware images for over-the-air (OTA) updates in connected HVAC controllers.

IC Role / Device Role / Timing Role: Dual-bank-capable storage with sector-level erase isolation to maintain operational firmware while updating standby bank.

Use Value: Enables atomic firmware swaps with zero downtime using ASP-locked sectors and suspend/resume during field updates.

Secure Key Storage

Automotive ECU Calibration Data

Use Scenario: Storing cryptographic keys and root-of-trust certificates in medical IoT edge devices with regulatory audit requirements.

IC Role / Device Role / Timing Role: OTP array with independent lock bits providing tamper-resistant, write-once storage for security-critical data.

Use Value: Meets IEC 62443-3-3 SL2 requirements for immutable credential storage without software vulnerability surface.

Use Scenario: Retaining engine calibration maps and sensor compensation coefficients across power cycles in Tier-1 automotive ECUs.

IC Role / Device Role / Timing Role: High-endurance (100K cycles), temperature-stable (–40°C to +85°C) non-volatile storage for mission-critical tuning data.

Use Value: Guarantees 20-year data retention under thermal cycling stress, eliminating recalibration service intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI010	Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option; slightly higher tACC (100 ns) in Versatile I/O mode.	Targeted at space-constrained automotive modules where board area is prioritized over manual assembly.	Select when PCB layout requires BGA footprint and thermal performance exceeds TSOP limits.
MX29GL256FHI-90G	256 Mb parallel NOR, 90 ns access, but lacks integrated ECC and OTP array; supports only standard sector protection (no ASP).	Suitable for cost-sensitive consumer electronics where ECC and secure storage are not required.	Choose only if firmware integrity is managed externally and lifecycle cost outweighs reliability features.

Compared with S29GL256P90TFI010, the S29GL256S90DHA010 offers lower-profile TSOP packaging and tighter 90 ns random access, while versus MX29GL256FHI-90G, it delivers hardware ECC, ASP, and OTP-critical for safety-certified and secure embedded systems.

Availability

S29GL256S90DHA010 is available at Aetrix Electronics and suitable for industrial gateways, automotive ECUs, medical edge devices, and telecom infrastructure requiring stable component supply, long-lifecycle support, and AEC-Q100-compliant variants.

Supply support for S29GL256S90DHA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and qualification standards aligned to ISO/TS 16949 and AEC-Q100.

The GL-S family targets embedded systems requiring deterministic XIP performance, robust data integrity, and long-term field reliability-designed specifically for industrial automation, automotive control units, and secure IoT endpoints.

FAQ

Is S29GL256S90DHA010 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. While functionally similar, S29GL256S90DHA010 uses a 56-pin TSOP package with updated pin assignments for Versatile I/O and enhanced protection signals. Pin mapping differs from S29GL256N (56-pin TSOP, legacy I/O) and S29GL256P (64-ball BGA). Direct replacement requires PCB redesign and firmware timing validation.

Does this device support true XIP (eXecute-In-Place) operation without external caching?

Yes. The 90 ns random access time and asynchronous interface allow direct CPU instruction fetch from flash addresses without intermediate RAM buffering. Verified XIP compatibility exists with ARM Cortex-M7, Renesas RX600, and NXP S32K series when configured for 16-bit bus width and proper wait-state settings.

What is the role of the 1024-byte OTP array, and can it be reprogrammed after locking?

The OTP array is physically one-time programmable: once a lock bit is set, the corresponding 512-byte region cannot be erased or rewritten. It stores immutable data such as cryptographic keys or device serial numbers. Unlocking is impossible-even via high-voltage methods-ensuring permanent data integrity per JEDEC JESD22-A117 specification.

How does the internal ECC interact with the CFI query and status register reporting?

ECC correction occurs transparently during read cycles; corrected data is delivered to the bus without flagging errors. Uncorrectable multi-bit errors trigger the Status Register Bit 4 (ECC Fail) and assert RY/BY# low. CFI tables report ECC capability (CFI Query Offset 0x4E = 0x01), but no separate ECC status register exists-error detection relies solely on Status Register and RY/BY#.

S29GL256S90DHA010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: -

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S90DHA010 FAQ

1.How can I place an order for S29GL256S90DHA010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90DHA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90DHA010 reliable?

The price and inventory of S29GL256S90DHA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90DHA010 is usually 5 days.

3.What payment methods are accepted for S29GL256S90DHA010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90DHA010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90DHA010?

S29GL256S90DHA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90DHA010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90DHA010?

For technical support, including S29GL256S90DHA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90DHA010 requirements.

6.How does Aetrix verify that S29GL256S90DHA010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90DHA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90DHA010 meets industry standards.

7.What is the process for return or replacement of S29GL256S90DHA010?

All S29GL256S90DHA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90DHA010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90DHA010 part is unused and in its original packaging.

Return procedure for S29GL256S90DHA010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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