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Infineon Technologies S29GL256S90DHA020

Name: S29GL256S90DHA020
Brand: Infineon Technologies
SKU: S29GL256S90DHA020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90DHA020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90DHA020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S90DHA020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. Used in boot code storage and firmware execution in industrial control systems.

For engineers reviewing the S29GL256S90DHA020 datasheet, S29GL256S90DHA020 pinout, S29GL256S90DHA020 application, or S29GL256S90DHA020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65 V to V_CC), AEC-Q100 Grade 2 qualification, and TSOP-56 packaging compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports XIP-capable read operations via 32-byte page mode (15 ns intra-page access), and embeds a state-machine-based Embedded Algorithm Controller (EAC) for autonomous program/erase execution without host intervention.

It features dual-voltage I/O support (V_IO = 1.65 V to V_CC), hardware-assisted ECC covering all array reads, and configurable sector protection including volatile/non-volatile lock bits plus a dedicated 1024-byte OTP array with two lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words
Random access time	90 ns at V_CC = V_IO, enabling fast instruction fetch in XIP architectures
Page access time	15 ns for subsequent 32-byte aligned reads within same page
Write buffer size	512 bytes (256 words), reducing effective programming time vs. byte/word writes
Erase endurance	100,000 program/erase cycles per sector, validated for long-life embedded firmware storage
Data retention	20 years at +85°C, ensuring reliability in unpowered industrial environments
Operating temperature	–40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2), suitable for under-hood automotive ECUs
Supply voltage	Single 2.7–3.6 V V_CC; I/O compatible with 1.65–3.6 V V_IO, easing interface to mixed-voltage SoCs

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC standard MO-142AC.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word address bus; A23 is MSB for 256 Mb density (2,097,152 words)
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports byte/word writes and 32-byte page reads
CE#	Chip enable	Active-low chip select; controls device power state and command latching
OE#	Output enable	Active-low read strobe; gates output drivers during read operations
WE#	Write enable	Active-low control for write/program/erase command initiation and data latching
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operation (low = busy)
RESET#	Hardware reset	Active-low asynchronous reset that halts ongoing operations and clears status register
WP#	Write protect	Hardware sector protection enable; low = locks protected sectors against accidental erase/write
V_CC	Core supply	2.7–3.6 V single supply powering core logic, charge pumps, and internal regulators
V_SS	Ground	Digital ground reference for all signals and internal circuitry
V_IO	I/O supply	Independent 1.65–3.6 V supply for input thresholds and output drive strength

Key Features

Feature	Design Value
Hardware ECC engine	On-the-fly single-bit error correction with automatic detection and correction during read, eliminating need for external SW/FW ECC handling
Uniform 128 kB sectors	256 identically sized, independently erasable sectors simplify firmware partitioning and field update management
Suspend/resume capability	Interruptible program or erase operations allow high-priority read access without aborting background writes
Common Flash Interface (CFI)	Standardized parameter table enables OS/driver auto-detection of geometry, timing, and command set without hard-coded assumptions
Advanced Sector Protection (ASP)	Volatile (lock-down via command) and non-volatile (hardware fuse) sector locking options prevent unauthorized firmware modification
1024-byte OTP array	Two separately lockable 512-byte regions for secure storage of keys, calibration data, or device-specific identifiers

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and calibrated engine maps in AEC-Q100 Grade 2 ECU modules operating under hood temperatures up to +105°C.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency for real-time instruction fetch.

Use Value: Meets automotive lifecycle requirements (100K cycles, 20-year retention) while supporting in-field firmware updates via sector erase.

Use Scenario: Holding firmware and configuration data in programmable logic controllers deployed in factory automation environments with wide thermal cycling.

IC Role / Device Role / Timing Role: Reliable parallel boot memory interfaced to ARM Cortex-M7 or RISC-V SoCs with 16-bit bus width.

Use Value: Versatile I/O (1.65–3.6 V) allows direct connection to mixed-voltage processors without level shifters.

Medical Diagnostic Imaging Boot ROM

Telecom Base Station Configuration Memory

Use Scenario: Secure storage of boot firmware and safety-critical initialization routines in FDA-regulated imaging equipment requiring data integrity assurance.

IC Role / Device Role / Timing Role: ECC-protected read path ensures bit-error-free execution of diagnostic algorithms during power-up sequences.

Use Value: Hardware ECC eliminates software overhead and guarantees deterministic startup behavior across product lifetime.

Use Scenario: Retaining FPGA configuration bitstreams and radio calibration tables in outdoor telecom base stations exposed to extended temperature ranges.

IC Role / Device Role / Timing Role: High-density (256 Mb), low-power standby (100 µA) non-volatile memory for infrequently updated but mission-critical data.

Use Value: 128 kB uniform sectors enable atomic reprogramming of individual functional blocks without full-device erase.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P11TFI010	Same density and architecture but uses 64-ball LAE FBGA (9 mm × 9 mm); lacks AEC-Q100 qualification	Preferred for space-constrained consumer or networking designs where automotive qualification is unnecessary	Select when board layout favors BGA over TSOP and industrial temp range suffices
MX29GL256FHT2I-90G	Macronix part with identical 256 Mb density, 90 ns access, and TSOP-56 package; no integrated ECC or OTP array	Lower-cost option where external ECC handling is acceptable and secure key storage is not required	Choose for cost-sensitive applications with existing ECC software stack and no security mandates

Compared with S29GL256P11TFI010, this TSOP-packaged variant offers automotive-grade reliability and integrated ECC; versus MX29GL256FHT2I-90G, it adds hardware error correction and secure OTP-critical for safety-certified systems.

Availability

S29GL256S90DHA020 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware storage, medical imaging boot ROM, and telecom base station configuration requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for S29GL256S90DHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for mission-critical applications.

The GL-S family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with enhanced data integrity, automotive qualification, and flexible I/O voltage support.

FAQ

Is S29GL256S90DHA020 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. While functionally similar, S29GL256S90DHA020 uses a revised command set and timing model optimized for 65 nm MIRRORBIT™ Eclipse technology. Pinout matches TSOP-56 packages, but CE#/OE#/WE# setup/hold timing and status reporting differ-migration requires firmware validation and timing margin review per Rev. *U datasheet Section 11.4.

Does the hardware ECC cover the entire memory array including the CFI and OTP regions?

Yes. The internal ECC engine applies to all read operations across the main flash array, CFI parameter table, and both lockable regions of the 1024-byte OTP array. ECC syndrome generation and correction occur transparently during every read cycle without host intervention or additional latency.

Can the Versatile I/O feature be used to interface directly with a 1.8 V FPGA I/O bank?

Yes. With V_IO supplied at 1.8 V and V_CC at 3.0 V, the device accepts 1.8 V logic levels on address/data/control pins and drives outputs compatible with 1.8 V receivers. DC characteristics in Section 10.5 confirm VIH min = 0.7×V_IO and VOL max = 0.2×V_IO under these conditions.

What is the minimum sector erase time and how is it verified?

The typical sector erase time is 477 ms for a 128 kB sector at +25°C, with maximum specified at 1.5 s per sector. Verification is performed internally by the Embedded Algorithm Controller using voltage threshold sensing and timeout monitoring; status is reported via RY/BY#, status register bit 7 (Erase Suspend), and data polling on DQ7.

S29GL256S90DHA020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL256S90DHA020 FAQ

1.How can I place an order for S29GL256S90DHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90DHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90DHA020 reliable?

The price and inventory of S29GL256S90DHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90DHA020 is usually 5 days.

3.What payment methods are accepted for S29GL256S90DHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90DHA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90DHA020?

S29GL256S90DHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90DHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90DHA020?

For technical support, including S29GL256S90DHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90DHA020 requirements.

6.How does Aetrix verify that S29GL256S90DHA020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90DHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90DHA020 meets industry standards.

7.What is the process for return or replacement of S29GL256S90DHA020?

All S29GL256S90DHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90DHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90DHA020 part is unused and in its original packaging.

Return procedure for S29GL256S90DHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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