Infineon Technologies S29GL256S90DHI010
- Part No.:
- S29GL256S90DHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S90DHI010.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,520
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Product details
Overview
S29GL256S90DHI010 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory IC using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) for read/program/erase - deployed in industrial embedded systems for firmware storage and XIP boot code execution.
For engineers reviewing the S29GL256S90DHI010 datasheet, S29GL256S90DHI010 pinout, S29GL256S90DHI010 application, or S29GL256S90DHI010 equivalent, key selection criteria include asynchronous 16-bit interface timing, 128 kB uniform sector erase granularity, internal hardware ECC for single-bit correction, Versatile I/O support (1.65–3.6 V), and AEC-Q100 Grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both random and page-mode reads: initial access fetches a full 32-byte aligned page, subsequent intra-page reads complete in 15 ns. The embedded algorithm controller (EAC) manages all program/erase operations, including suspend/resume, status reporting via RY/BY# pin or status register, and automatic ECC generation/correction during read.
It features dual-voltage I/O (VIO = 1.65–VCC), enabling direct interfacing with 1.8 V or 3.3 V controllers without level shifters. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a dedicated 1024-byte OTP array with two lockable regions for secure boot configuration or calibration data.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers. |
| Random Access Time | 90 ns at VCC = VIO; enables real-time XIP execution without wait states on 10 MHz+ bus clocks. |
| Page Access Time | 15 ns; allows rapid sequential instruction fetch within same 32-byte page boundary. |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command. |
| ECC Support | Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical boot paths. |
| Endurance & Retention | 100,000 program/erase cycles; 20-year data retention at 85°C - suitable for field-upgradable industrial controllers. |
| Operating Temperature | –40°C to +85°C (Industrial Grade); validated for use in motor drives and PLCs without thermal derating. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 20.0 mm × 10.16 mm × 1.2 mm height, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits = 32 MB). |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads without multiplexing. |
| CE# | Chip Enable | Active-low enable for device selection; controls power-down entry when deasserted. |
| OE# | Output Enable | Active-low control for output buffer; used to gate read data onto shared bus. |
| WE# | Write Enable | Active-low strobe for write cycles; initiates command latching or data programming. |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during active program/erase, high when ready. |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| VCC | Core Supply | 3.0 V core supply (2.7–3.6 V); powers logic, memory array, and EAC. |
| VIO | I/O Supply | Independent I/O voltage (1.65–VCC); decouples interface voltage from core for mixed-voltage systems. |
| WP# | Write Protect | Hardware sector protection enable; disables program/erase when asserted. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page fetch with 15 ns intra-page access - accelerates linear code execution in XIP mode. |
| 512-Byte Programming Buffer | Enables single-command write of up to 256 words, reducing host CPU overhead vs. byte-by-byte programming. |
| Hardware ECC Engine | On-the-fly single-bit error detection and correction during read - ensures boot reliability without software intervention. |
| Uniform 128 kB Sectors | 64 identical sectors simplify firmware partitioning and over-the-air update management in embedded Linux or RTOS environments. |
| Versatile I/O Voltage | VIO range 1.65–3.6 V allows direct connection to 1.8 V FPGA I/O banks or 3.3 V MCU buses without external translators. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated engine maps and boot firmware in AEC-Q100 Grade 3 qualified ECUs operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency for real-time interrupt response. Use Value: Internal ECC and 100K-cycle endurance ensure reliable operation over 15-year vehicle lifetime without field failures. | Use Scenario: Holding ladder logic firmware and configuration data in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Parallel boot memory mapped to ARM Cortex-M7 or RISC-V SoC address space with no external wait-state logic. Use Value: 128 kB uniform sectors allow atomic firmware updates via sector erase, minimizing downtime during maintenance windows. |
| Medical Diagnostic Imaging Boot ROM | Avionics Data Logger Memory |
Use Scenario: Secure boot image storage for FDA-cleared ultrasound or MRI subsystems requiring traceable firmware integrity. IC Role / Device Role / Timing Role: OTP-protected boot loader region combined with ECC-verified main firmware partition. Use Value: Dedicated 1024-byte OTP array with dual lockable regions enables immutable bootloader + configurable parameter storage. | Use Scenario: High-reliability flight data recording in DO-160G-compliant avionics units exposed to wide temperature swings and vibration. IC Role / Device Role / Timing Role: Radiation-tolerant (tested) NOR flash with suspend/resume capability for uninterrupted logging during power transients. Use Value: Program/erase suspend allows immediate response to critical flight events while preserving partially written log segments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P90TFI010 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option. | Targeted at space-constrained PCBs where surface-mount area is prioritized over manual rework accessibility. | Select when board layout requires BGA footprint and thermal performance exceeds TSOP limits. |
| MX29GL256FHT2I-90G | Macronix part with 90 ns access, 128 kB sectors, but lacks integrated ECC and OTP array. | Requires external ECC handling and separate secure storage for calibration data. | Choose only if cost sensitivity outweighs functional safety requirements and boot security needs. |
Compared with S29GL256P90TFI010, the TSOP package offers easier prototyping and repair; versus MX29GL256FHT2I-90G, the Infineon part delivers built-in ECC and OTP - eliminating design complexity for safety-certified systems.
Availability
S29GL256S90DHI010 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging boot ROM deployments requiring stable component supply across multi-year production cycles.
Supply support for S29GL256S90DHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-S family targets mission-critical embedded applications demanding deterministic timing, long-term data retention, and automotive-grade reliability - specifically engineered for XIP boot, firmware storage, and secure configuration in harsh environments.
FAQ
What is the maximum operating frequency supported by the S29GL256S90DHI010's parallel interface?
The device uses an asynchronous interface with no clock signal - timing is governed by access parameters like tACC (90 ns) and tPACC (15 ns). It interfaces directly with microcontrollers or FPGAs running at ≤10 MHz bus clocks without wait states, and supports burst reads via page mode for higher effective throughput.
Does the S29GL256S90DHI010 support both 1.8 V and 3.3 V I/O interfaces?
Yes - its Versatile I/O feature allows VIO to operate from 1.65 V to 3.6 V, enabling native interfacing with 1.8 V logic families (e.g., low-power FPGAs) and 3.3 V microcontrollers without external level shifters, provided VCC remains within 2.7–3.6 V.
How is sector protection implemented, and can it be changed in-system?
Sector protection uses both volatile (lock bits cleared on power cycle) and non-volatile (ASP bits retained after power loss) methods. Protection status is controlled via CFI commands and can be modified dynamically in-system using standard command sequences - no hardware jumper or fuse required.
Is the 1024-byte OTP array truly one-time programmable, and how is it secured?
Yes - the OTP array consists of 64 rows × 16 bytes, with two independently lockable regions (Region 0 and Region 1). Once a region is locked via dedicated command, its contents become permanently read-only; locking is irreversible and enforced by on-die logic, not software flags.
S29GL256S90DHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S90DHI010 FAQ
1.How can I place an order for S29GL256S90DHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90DHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90DHI010 reliable?
The price and inventory of S29GL256S90DHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90DHI010 is usually 5 days.
3.What payment methods are accepted for S29GL256S90DHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90DHI010 transactions.
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4.How is shipping managed for S29GL256S90DHI010?
S29GL256S90DHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90DHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90DHI010?
For technical support, including S29GL256S90DHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90DHI010 requirements.
6.How does Aetrix verify that S29GL256S90DHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90DHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90DHI010 meets industry standards.
7.What is the process for return or replacement of S29GL256S90DHI010?
All S29GL256S90DHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90DHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90DHI010 part is unused and in its original packaging.
Return procedure for S29GL256S90DHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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