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Infineon Technologies S29GL256S90DHI013
- Part No.:
- S29GL256S90DHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S90DHI013.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,015
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Product details
Overview
S29GL256S90DHI013 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), 16-bit data bus, and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in boot code storage for industrial HMIs and firmware update partitions in network edge routers.
For engineers reviewing the S29GL256S90DHI013 datasheet, S29GL256S90DHI013 pinout, S29GL256S90DHI013 application, or S29GL256S90DHI013 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, sector-level erase granularity (128 kB), OTP array security, Versatile I/O voltage support (1.65–VCC), and AEC-Q100 grade compatibility options.
Technical Context
This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting both random and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via status register, data polling, or RY/BY# pin.
The architecture features uniform 128-kbyte sectors, a 512-byte write buffer enabling up to 256-word programming bursts, and dual-mode sector protection (volatile/non-volatile). Internal hardware ECC operates transparently during read cycles without software intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB) - supports full firmware images for mid-tier microcontrollers and real-time OS kernels |
| Random Access Time | 90 ns at VCC = VIO - enables direct XIP execution from flash without external cache penalty |
| Page Access Time | 15 ns - accelerates sequential instruction fetch within 32-byte aligned pages |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external ECC logic or software overhead |
| Endurance & Retention | 100,000 program/erase cycles / 20 years data retention - suitable for field-upgradable embedded systems |
| Operating Voltage | VCC: 2.7–3.6 V; VIO: 1.65–VCC - allows interoperability with mixed-voltage SoC interfaces |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit address bus supporting 8-Mword (32 MB) addressing space; A22 is MSB for 256 Mb density |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in byte/word mode per CFI configuration |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching timing |
| OE# | Output Enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write Enable | Active-low write strobe; initiates program/erase command sequences with address/data setup |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into reading ID mode or aborts ongoing operation |
| WP# | Write Protect | Hardware sector lock override; disables program/erase when asserted low |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time - improves instruction throughput in XIP configurations |
| 512-Byte Programming Buffer | Enables burst programming of up to 256 words - cuts average programming time vs. single-word writes |
| Hardware ECC Engine | Single-bit error correction on every read - ensures data integrity without CPU intervention or latency penalty |
| Advanced Sector Protection | Volatile and non-volatile locking per 128-kB sector - supports secure firmware partitioning and field update safety |
| OTP Array | 1024-byte one-time-programmable region with two lockable sections - stores cryptographic keys or calibration data |
Applications
| Industrial HMI Boot Storage | Network Edge Router Firmware |
|---|---|
Use Scenario: Storing bootloader and kernel image for ARM Cortex-A series-based human-machine interface controllers operating in factory environments. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable random access and deterministic 90 ns read latency. Use Value: Eliminates need for external SRAM caching; enables fast cold-start (<500 ms) and reliable over-the-air firmware rollback. | Use Scenario: Holding dual firmware images and configuration tables in managed Ethernet switches deployed at telecom aggregation points. IC Role / Device Role / Timing Role: Dual-bank flash memory supporting atomic firmware swaps and sector-protected parameter storage. Use Value: Guarantees fail-safe updates via 128-kB uniform sector erase and hardware write protection on critical config regions. |
| Automotive ADAS Camera Module | Medical Diagnostic Imaging Controller |
Use Scenario: Storing calibration data, sensor fusion algorithms, and boot firmware in AEC-Q100 Grade 2 camera modules for advanced driver assistance systems. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and built-in ECC for safety-critical data. Use Value: Meets ISO 26262 ASIL-B requirements through hardware ECC and 100,000-cycle endurance under thermal cycling stress. | Use Scenario: Hosting FPGA configuration bitstreams and diagnostic application binaries in portable ultrasound imaging devices requiring regulatory traceability. IC Role / Device Role / Timing Role: Secure firmware repository with OTP-locked calibration constants and CFI-compliant identification for audit compliance. Use Value: Enables FDA 21 CFR Part 11 compliance via immutable OTP storage and sector-level write-lock enforcement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P90TFI010 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCBs where board area is prioritized over socketability or rework ease | Select when footprint miniaturization outweighs serviceability needs and thermal profile permits BGA mounting |
| MX29GL256FHT2I-90G | Macronix part with identical 256 Mb density, 90 ns access, and 16-bit bus; lacks OTP array and has different CFI implementation | Used in cost-sensitive consumer gateways where OTP security and CFI tooling compatibility are non-critical | Choose only if legacy toolchain support for Macronix-specific command sets is already established |
Compared with S29GL256P90TFI010 and MX29GL256FHT2I-90G, the S29GL256S90DHI013 uniquely combines TSOP package serviceability, integrated OTP security, and Infineon's validated AEC-Q100 qualification path - making it optimal for industrial and automotive designs requiring field-replaceability and functional safety traceability.
Availability
S29GL256S90DHI013 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, and automotive ADAS camera module applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S90DHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and mission-critical systems.
The GL-S family targets embedded systems needing robust, pin-compatible NOR flash with XIP performance, hardware ECC, and automotive qualification - bridging the gap between legacy parallel interfaces and modern reliability demands.
FAQ
Does S29GL256S90DHI013 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation due to its 90 ns random access time and asynchronous parallel interface. Instruction fetches occur directly from flash without copying to RAM, verified by its use in Cortex-A bootloaders and confirmed in Section 1 and Figure 1 of the datasheet. Page-mode reads further accelerate sequential execution within 32-byte boundaries.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL256S90DHI013. It appears only on earlier GL-P generation devices. This GL-S variant uses standard CE#/OE#/WE# control signals exclusively - confirmed by signal listing in Section 8 and pin diagrams in Section 12.1 of the datasheet.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses; once a bit is set to '0', it cannot be reset to '1'. Two independent lock bits prevent further writes to each 512-byte region, ensuring cryptographic keys or calibration data remain immutable after final programming.
How does Versatile I/O (VIO) affect system design?
Versatile I/O allows VIO to operate independently from VCC across 1.65 V to VCC, enabling direct interfacing with 1.8 V or 2.5 V logic while maintaining 3.0 V core operation. This eliminates level shifters in mixed-voltage SoC designs and is validated in DC characteristics Table 10.5 and Section 8.3 of the datasheet.
S29GL256S90DHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S90DHI013 FAQ
1.How can I place an order for S29GL256S90DHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90DHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90DHI013 reliable?
The price and inventory of S29GL256S90DHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90DHI013 is usually 5 days.
3.What payment methods are accepted for S29GL256S90DHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90DHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90DHI013?
S29GL256S90DHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90DHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90DHI013?
For technical support, including S29GL256S90DHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90DHI013 requirements.
6.How does Aetrix verify that S29GL256S90DHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90DHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90DHI013 meets industry standards.
7.What is the process for return or replacement of S29GL256S90DHI013?
All S29GL256S90DHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90DHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90DHI013 part is unused and in its original packaging.
Return procedure for S29GL256S90DHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S90DHI013 Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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