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Infineon Technologies S29GL256S90DHI020
- Part No.:
- S29GL256S90DHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S90DHI020.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,952
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Product details
Overview
S29GL256S90DHI020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It features hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte programming buffer-enabling fast embedded code storage and XIP execution in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL256S90DHI020 datasheet, S29GL256S90DHI020 pinout, S29GL256S90DHI020 application, or S29GL256S90DHI020 equivalent, this device supports asynchronous read, sector erase suspend/resume, versatile I/O (1.65–VCC), OTP lockable regions, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
The S29GL256S90DHI020 implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling dual-bit-per-cell storage without compromising reliability. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY#, and automatic ECC correction during read cycles.
It supports three interface modes: standard CE#/OE#-controlled asynchronous read, page-mode read (32-byte aligned, 15 ns subsequent access), and command-set-driven embedded operations including sector erase, buffer programming, and protection configuration via status register and CFI table.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers. |
| Random access time | 90 ns at VCC = VIO - enables real-time XIP execution in safety-critical boot loaders. |
| Page access time | 15 ns - allows rapid sequential instruction fetch within 32-byte aligned pages. |
| Programming buffer | 512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update throughput. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in mission-critical storage paths. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - validated for automotive ECU log storage and industrial HMI firmware. |
| Operating temperature | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive applications and high-ambient industrial gateways. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, 0.5 mm pitch, JEDEC MO-141AC compliant. Pin-compatible with industry-standard parallel NOR flash footprints.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting 2,097,152-word addressing (AMAX = A23); word-aligned only - no byte-level access. |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; supports both read and write transfers in word granularity; compatible with 16-bit microcontroller buses. |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching - must be asserted before OE# or WE# for valid operation. |
| OE# | Output enable | Active-low read strobe; gates output drivers - used with CE# to initiate asynchronous read cycles. |
| WE# | Write enable | Active-low write strobe; initiates command loading or data programming when CE# and OE# are inactive. |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation status - low during program/erase, high when ready for next command. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading ID mode or aborts ongoing operations - critical for safe power-cycle recovery. |
| VCC | Core supply | 3.0 V nominal (2.7–3.6 V); powers core logic, array, and ECC engine - single-supply simplifies PCB power design. |
| VIO | I/O supply | 1.65–VCC range; decouples I/O voltage from core - enables interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | 32-byte aligned page access with 15 ns subsequent word latency - accelerates linear code execution without cache prefetch overhead. |
| Embedded sector erase suspend/resume | Allows interrupting long erase operations (e.g., 477 ms for 128 kB) to service higher-priority reads - essential for real-time OS coexistence. |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128-kB sector - enables secure bootloader partitioning and field-upgrade-safe application zones. |
| 1024-byte OTP array | Two independently lockable 512-byte regions - stores cryptographic keys, calibration data, or device-specific identifiers with irreversible write-once security. |
| Common Flash Interface (CFI) | Standardized parameter table accessible via command sequence - enables automatic driver detection and vendor-agnostic firmware abstraction layers. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated gauge graphics, firmware updates, and vehicle configuration data in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code/data storage with AEC-Q100 Grade 2 qualification and 105°C operation. Use Value: Eliminates external SRAM for code shadowing; 90 ns random access ensures responsive UI rendering during runtime. |
Use Scenario: Holding ladder logic firmware, I/O mapping tables, and safety-critical boot images in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash with hardware ECC and 100K-cycle endurance for unattended 24/7 operation. Use Value: Prevents field failures due to bit corruption; sector protection isolates bootloader from user-programmed logic partitions. |
| Medical Imaging Boot Loader | Avionics Data Logger |
|
Use Scenario: Securely storing certified boot firmware and DICOM configuration profiles in portable ultrasound devices. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked cryptographic keys and CFI-based driver auto-negotiation. Use Value: Meets IEC 62304 Class C software requirements via hardware-enforced integrity and tamper-resistant key storage. |
Use Scenario: Capturing flight parameter snapshots and fault logs in black-box recorders with extended thermal tolerance. IC Role / Device Role / Timing Role: Long-retention (20 years), high-endurance flash operating across –40°C to +105°C with suspendable erase. Use Value: Ensures crash data persistence after thermal shock; page-mode read enables rapid post-event diagnostic dump retrieval. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P90TFI020 | Same density and timing, but 64-ball LAE Fortified BGA (9 mm × 9 mm); lacks OTP array and ASP non-volatile lock mode. | Preferred for space-constrained PCBs where BGA routing is acceptable; unsuitable for secure key storage or permanent sector locking. | Select when footprint size outweighs OTP/security needs and thermal profile remains ≤ +85°C. |
| MX29GL256FHT2I-90G | 256 Mb, 90 ns, 3 V, but uses older 90 nm process; no hardware ECC; 50K endurance; CFI-compliant but no suspend/resume. | Lower-cost option for non-safety-critical consumer electronics; requires software ECC and cannot pause erase during real-time tasks. | Select only for cost-sensitive, non-automotive designs where firmware update frequency is low and error resilience is managed in SW. |
Compared with S29GL256P90TFI020 and MX29GL256FHT2I-90G, the S29GL256S90DHI020 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, OTP security, and erase suspend - making it the sole choice for automotive and industrial systems requiring concurrent reliability, security, and real-time responsiveness.
Availability
S29GL256S90DHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and avionics data loggers requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S90DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-S family targets automotive and industrial embedded systems requiring XIP-capable, high-endurance, thermally robust NOR flash - designed specifically to replace legacy parallel flash while enabling seamless migration from S29GL series.
FAQ
Is S29GL256S90DHI020 pin-compatible with earlier S29GL256N or S29GL256P variants?
No. While all share the same 56-pin TSOP footprint, S29GL256S90DHI020 introduces new command set extensions for suspend/resume and enhanced OTP locking. The RESET# pin behavior and RY/BY# timing also differ per Rev. *U datasheet Section 8.5 and 11.4 - direct replacement requires firmware validation and timing margin review.
Does the hardware ECC correct errors during programming or only during read operations?
Hardware ECC operates exclusively during read operations. It automatically detects and corrects single-bit errors in fetched data words. Programming and erase operations do not invoke ECC; however, the device performs internal verify steps and reports failure via status register bit 5 (PGM/ERASE Error) if write/erase margins are violated.
Can the 1024-byte OTP array be reprogrammed after initial lock?
No. Once either 512-byte region of the OTP array is permanently locked via the LOCK_OTP command (0x60 followed by 0xD0), that region becomes read-only and irreversible. Unlocking is not supported - design must pre-validate all OTP contents before final lock issuance.
What is the minimum VIO voltage required to guarantee reliable command recognition?
The minimum VIO is 1.65 V per datasheet Section 10.4. Below this, command decoding may fail or become metastable. At VIO = 1.65 V, setup/hold times increase by up to 20% versus VIO = VCC; timing margins must be verified using AC characteristics Table 11-3 (VersatileIO column) for CE#, OE#, and WE#.
S29GL256S90DHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S90DHI020 FAQ
1.How can I place an order for S29GL256S90DHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90DHI020 reliable?
The price and inventory of S29GL256S90DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90DHI020 is usually 5 days.
3.What payment methods are accepted for S29GL256S90DHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90DHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90DHI020?
S29GL256S90DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90DHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90DHI020?
For technical support, including S29GL256S90DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90DHI020 requirements.
6.How does Aetrix verify that S29GL256S90DHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90DHI020 meets industry standards.
7.What is the process for return or replacement of S29GL256S90DHI020?
All S29GL256S90DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90DHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90DHI020 part is unused and in its original packaging.
Return procedure for S29GL256S90DHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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