Infineon Technologies S29GL256S90DHI023
- Part No.:
- S29GL256S90DHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S90DHI023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL256S90DHI023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), 16-bit data bus, and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in boot code storage for industrial PLCs and automotive ECUs requiring deterministic XIP execution.
For engineers reviewing the S29GL256S90DHI023 datasheet, S29GL256S90DHI023 pinout, S29GL256S90DHI023 application, or S29GL256S90DHI023 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, sector-level erase granularity (128 kB), OTP array support, Versatile I/O voltage range (1.65 V to VCC), and AEC-Q100 Grade 3 qualification.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without external microcontroller intervention. Its architecture supports page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command, reducing effective write latency versus byte-by-byte methods.
The flash uses uniform 128-kbyte sectors with Advanced Sector Protection (ASP), supporting both volatile and non-volatile lock bits per sector. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit failures via status register bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables real-time XIP execution in safety-critical boot loaders |
| Page Access Time | 15 ns; allows rapid sequential instruction fetch within same 32-byte page |
| Programming Buffer | 512 bytes; reduces average programming time by ~7× vs. single-word writes |
| ECC Support | Hardware single-bit correction; eliminates need for external error-handling logic |
| Endurance | 100,000 program/erase cycles; suitable for field-upgradable firmware with infrequent updates |
| Data Retention | 20 years at 85°C; meets long-lifecycle requirements for industrial control systems |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch), compliant with JEDEC MO-141AC. Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit word address bus; A22 selects highest 128 kB sector (AMAX = A23 for 256 Mb) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 16-bit word transfers only |
| CE# | Chip Enable | Active-low device select; controls power state and command latching |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write Enable | Active-low write strobe; initiates command or data load on rising edge |
| RY/BY# | Ready/Busy | Open-drain status indicator; low = operation in progress |
| WP# | Write Protect | Hardware sector protection enable; active-low, tied high for normal operation |
| VCC | Core Supply | 3.0 V ±0.3 V; powers core logic, EAC, and internal voltage generators |
| VIO | I/O Supply | 1.65 V to VCC; decouples I/O signaling from core voltage for mixed-voltage systems |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned access with 15 ns subsequent reads - accelerates linear code execution without cache |
| 512-Byte Programming Buffer | Reduces total programming time for firmware patches by batching writes into single-command bursts |
| Hardware ECC Engine | Single-bit correction applied automatically on every read - removes software overhead and improves MTBF |
| Uniform 128-kB Sectors | Enables precise firmware partitioning (e.g., bootloader, app, config) with independent erase control |
| OTP Array (1024 B) | Two lockable regions store immutable keys or calibration data - prevents accidental overwrites post-production |
Applications
| Industrial PLC Boot Memory | Automotive ECU Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and real-time control firmware in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; provides deterministic 90 ns read latency for hard real-time task startup. Use Value: Eliminates external RAM copy step during boot; 20-year data retention ensures firmware integrity across 15+ year equipment lifecycles. | Use Scenario: Holds calibrated engine control algorithms and diagnostic firmware in Tier-1 automotive ECUs certified to AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Secure, sector-protected firmware repository; supports in-field updates via CAN FD with suspend/resume during critical operations. Use Value: Hardware ECC and 100K-cycle endurance enable safe over-the-air updates without compromising functional safety compliance. |
| Medical Imaging System BIOS | Avionics Data Logger |
Use Scenario: Stores BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring radiation-tolerant, long-retention storage. IC Role / Device Role / Timing Role: Dual-role memory: executes boot code (XIP) and stores calibration tables; accessed via 16-bit parallel bus synchronized to system clock. Use Value: Versatile I/O (1.65–3.6 V) interfaces directly with 1.8 V FPGA I/O banks while maintaining 3.0 V core stability. | Use Scenario: Captures flight-critical telemetry and fault logs in DO-178C-certified avionics recorders with extended thermal range operation. IC Role / Device Role / Timing Role: High-reliability data archive with sector-lock protection; erased only during maintenance cycles using hardware WP# and ASP commands. Use Value: 128 kB uniform sectors allow isolated logging partitions; 105°C industrial-plus grade supports conduction-cooled chassis mounting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P90DHI023 | Same density and timing, but lacks hardware ECC and OTP array | Not suitable for safety-critical boot storage requiring error correction | Select only when cost sensitivity outweighs ECC requirement and firmware update frequency is low |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, no built-in ECC, CFI-compatible but different command set | Requires firmware driver modification; no suspend/resume during erase | Use only in legacy designs where migration path includes full HAL revalidation |
Compared with S29GL256P90DHI023 and MX29GL256FHT2I-90G, the S29GL256S90DHI023 uniquely combines hardware ECC, OTP security, and suspend/resume functionality - making it the only choice for ISO 26262 ASIL-B boot memory where data integrity and update robustness are mandatory.
Availability
S29GL256S90DHI023 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant flash memory.
Supply support for S29GL256S90DHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, sector-level firmware update flexibility, and automotive-grade reliability - bridging the gap between traditional NOR and NAND-based code storage.
FAQ
What is the maximum operating temperature range for S29GL256S90DHI023?
The S29GL256S90DHI023 is rated for industrial temperature range: –40°C to +85°C. This grade is explicitly defined in the datasheet Rev. *U (Section "Temperature range / grade") and applies to the DHI023 suffix variant. It does not support the +105°C industrial-plus or AEC-Q100 Grade 2 variants.
Does this device support synchronous burst reads or only asynchronous operation?
S29GL256S90DHI023 supports only asynchronous read operations. The datasheet confirms all read accesses are asynchronous (page 5, "Product overview"), with no clock input or burst mode timing specifications. Page-mode reads rely on address changes-not clock edges-to trigger subsequent 15 ns accesses within the same 32-byte page.
Can the 1024-byte OTP array be used for storing cryptographic keys?
Yes - the OTP array consists of two independently lockable 512-byte regions, intended for permanent storage of security-critical data such as encryption keys, calibration constants, or device identifiers. Once locked (via dedicated unlock/lock commands), regions become permanently read-only and immune to erase or program commands.
Is hardware reset (RESET#) required before issuing commands after power-up?
Yes - the datasheet specifies a Power-On Reset (POR) sequence requiring RESET# assertion for ≥100 µs after VCC reaches 2.7 V (Section 11.3). Skipping this may result in undefined command interpretation or failed status register initialization, especially in systems lacking controlled power-rail sequencing.
S29GL256S90DHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL256S90DHI023 FAQ
1.How can I place an order for S29GL256S90DHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90DHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90DHI023 reliable?
The price and inventory of S29GL256S90DHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90DHI023 is usually 5 days.
3.What payment methods are accepted for S29GL256S90DHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90DHI023 transactions.
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4.How is shipping managed for S29GL256S90DHI023?
S29GL256S90DHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90DHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90DHI023?
For technical support, including S29GL256S90DHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90DHI023 requirements.
6.How does Aetrix verify that S29GL256S90DHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90DHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90DHI023 meets industry standards.
7.What is the process for return or replacement of S29GL256S90DHI023?
All S29GL256S90DHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90DHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90DHI023 part is unused and in its original packaging.
Return procedure for S29GL256S90DHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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