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Infineon Technologies S29GL256S90FAI013
- Part No.:
- S29GL256S90FAI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S90FAI013.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,674
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Product details
Overview
S29GL256S90FAI013 from Spansion is a 256-Mbit (32 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 90 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-protected boot-block locking, and is used in embedded firmware storage for industrial controllers and network edge devices.
For engineers reviewing the S29GL256S90FAI013 datasheet, S29GL256S90FAI013 pinout, S29GL256S90FAI013 application, or S29GL256S90FAI013 equivalent, key selection criteria include verified 90 ns read timing, VIO/VCC flexibility (1.65–3.6 V I/O with 2.7–3.6 V core), industrial-grade reliability, and sector-based write protection architecture.
Technical Context
This device implements a parallel asynchronous interface with address/data multiplexing support, compatible with standard x16 bus configurations. It integrates embedded erase and program algorithms with status register polling and ready/busy output for host coordination.
Memory organization is structured as 512 uniform 64-KB sectors, enabling granular protection and field-upgradable firmware partitions. The Fortified BGA package includes enhanced mechanical robustness and thermal performance for high-reliability industrial deployment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB), directly maps to firmware image storage for mid-tier microcontrollers |
| Access Time | 90 ns max random access - enables deterministic boot code fetch in real-time systems |
| Supply Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - supports mixed-voltage SoC interfacing without level shifters |
| Temperature Range | –40°C to +85°C industrial grade - qualified for uncontrolled ambient environments |
| Package | LAA064 Fortified BGA, 11 mm × 13 mm - optimized for board-level reliability under thermal cycling |
| Protection Scheme | Hardware sector lock with PPB/Read Password modes - prevents unauthorized firmware overwrite |
| Process Technology | 65 nm MirrorBit Eclipse - delivers lower power consumption and higher endurance vs. legacy NOR |
Pinout & Package
Package: Fortified Ball-Grid Array (LAA064), 64-ball, 11 mm × 13 mm footprint, 0.8 mm pitch, RoHS-compliant Pb-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 32 MB linear addressing with A0 LSB |
| DQ0–DQ15 | Data I/O (x16) | 16-bit bidirectional data bus; supports byte-wide access via BYTE# control |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous NOR control signals; active-low, fully decoded timing |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling internal erase/program completion |
| RESET# | Hardware Reset Input | Asynchronous reset that returns device to read mode and clears status registers |
| VCC, VIO, GND | Power Supplies | Separate core (VCC) and I/O (VIO) rails enable voltage domain isolation |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 64-KB Sector Architecture | Enables independent locking/unlocking of any sector - critical for dual-bank firmware updates |
| Password-Protected Boot Block (PPB) | Prevents accidental or malicious overwrite of bootloader region without valid password entry |
| Embedded Program/Erase Algorithms | Reduces host CPU overhead - no external timing control required for write cycles |
| VIO Flexibility (1.65–VCC) | Eliminates need for external level shifters when interfacing with 1.8 V or 3.3 V logic |
| Extended Temperature Operation | Validated operation across –40°C to +85°C - suitable for outdoor telecom and factory automation |
Applications
| Industrial PLC Firmware Storage | Telecom Edge Router Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory-floor environments with wide thermal swings. IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic 90 ns instruction fetch during cold start and runtime updates. Use Value: Sector protection ensures bootloader integrity while allowing field-upgradable application modules without full flash reprogramming. | Use Scenario: Hosting boot code and packet-processing microcode in carrier-grade edge routers operating continuously at elevated ambient temperatures. IC Role / Device Role / Timing Role: Primary NOR Flash for XIP (eXecute-In-Place) execution of boot ROM and initialization routines. Use Value: 65 nm MirrorBit Eclipse process reduces active power by ~30% vs. 90 nm predecessors, lowering thermal load in dense line cards. |
| Medical Diagnostic Equipment BIOS | Automotive ADAS Camera Module Storage |
Use Scenario: Storing safety-critical BIOS and calibration tables in portable ultrasound and imaging systems requiring long-term data retention. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with hardware-enforced sector lock and password verification. Use Value: PPB mode ensures bootloader remains protected even after unexpected power loss during update sequences. | Use Scenario: Holding camera sensor configuration, lens correction profiles, and firmware patches in automotive surround-view camera modules. IC Role / Device Role / Timing Role: High-reliability nonvolatile storage interfaced directly to ARM Cortex-A53 application processor via parallel bus. Use Value: Industrial temperature rating and fortified BGA package withstand repeated thermal cycling in engine bay proximity mounting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S29GL256S90TFI010 | Same die, identical specs, but in TSOP-56 package instead of LAA064 BGA | Preferred where board space allows larger footprint and hand-soldering is acceptable | Select for cost-sensitive designs with less stringent board area constraints |
| Infineon HY29F256100TFC | 100 ns access time, 3.3 V only (no VIO flexibility), 48-pin TSOP | Lower performance margin; lacks PPB and password modes | Only suitable where boot security and mixed-voltage I/O are not required |
Compared with S29GL256S90FAI013, the TSOP variant offers identical functionality in a more serviceable package, while the Infineon part sacrifices security features and timing performance for legacy compatibility - making the Spansion BGA version optimal for new industrial designs demanding compactness and firmware integrity.
Availability
S29GL256S90FAI013 is available at Aetrix Electronics and suitable for industrial PLCs, telecom edge routers, and medical diagnostic equipment requiring stable component supply over extended product lifecycles.
Supply support for S29GL256S90FAI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion (now part of Cypress Semiconductor, acquired by Infineon in 2019) specialized in high-reliability NOR Flash and microcontroller solutions for industrial and automotive markets.
The S29GL-S series was engineered specifically for deterministic boot code execution and secure firmware storage in harsh-environment embedded systems, emphasizing endurance, data retention, and hardware-based protection.
FAQ
Is S29GL256S90FAI013 pin-compatible with earlier S29GL256P variants?
No. The S29GL256S uses a 64-ball Fortified BGA (LAA064) package, whereas S29GL256P variants use 56-pin TSOP packages. Physical layout, ball count, and signal mapping differ significantly - PCB redesign is required for migration.
Does this device support Quad SPI or other serial interfaces?
No. S29GL256S90FAI013 implements a parallel x16 asynchronous interface only. It does not include SPI, QSPI, or HyperBus controllers - it requires a dedicated parallel memory bus with address/data multiplexing support.
What is the maximum endurance and data retention specification?
Per Spansion documentation, the device guarantees 100,000 program/erase cycles per sector and 20-year data retention at 85°C - validated under JEDEC JESD22-A117 conditions with full sector protection enabled.
Can VIO be operated at 1.8 V while VCC is at 3.3 V?
Yes. The datasheet specifies VIO range as 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V, enabling direct interface to 1.8 V logic families without level translation circuitry.
S29GL256S90FAI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S90FAI013 FAQ
1.How can I place an order for S29GL256S90FAI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90FAI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90FAI013 reliable?
The price and inventory of S29GL256S90FAI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FAI013 is usually 5 days.
3.What payment methods are accepted for S29GL256S90FAI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FAI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90FAI013?
S29GL256S90FAI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90FAI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90FAI013?
For technical support, including S29GL256S90FAI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FAI013 requirements.
6.How does Aetrix verify that S29GL256S90FAI013 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90FAI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FAI013 meets industry standards.
7.What is the process for return or replacement of S29GL256S90FAI013?
All S29GL256S90FAI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FAI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90FAI013 part is unused and in its original packaging.
Return procedure for S29GL256S90FAI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S90FAI013 Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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