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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S90FAI020

Name: S29GL256S90FAI020
Brand: Infineon Technologies
SKU: S29GL256S90FAI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90FAI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90FAI020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:1,214

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Product details

Overview

S29GL256S90FAI020 from Spansion is a 256-Mbit (32 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 90 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-protected boot-block locking, and is used in firmware storage for industrial controllers and network edge devices.

For engineers reviewing the S29GL256S90FAI020 datasheet, S29GL256S90FAI020 pinout, S29GL256S90FAI020 application, or S29GL256S90FAI020 equivalent, key selection considerations include VIO/VCC flexibility (1.65–3.6 V I/O), sector protection configuration (lowest-address protected), and industrial-grade reliability for embedded boot code retention.

Technical Context

This device implements a parallel asynchronous interface with address/data multiplexing support, compatible with standard microprocessor bus cycles. It integrates embedded erase and program algorithms with status register polling and ready/busy output for host synchronization.

Memory organization is 32 M × 8-bit (or 16 M × 16-bit), with uniform 128-KB sectors and configurable boot-block architecture. Sector protection is implemented via hardware write-protection pins and software-controlled lock bits, including DYB (Deep Yellow Block) and PPB (Persistent Protection Bits) modes.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256 Mbit (32 MB), enabling full firmware image storage for mid-tier embedded applications
Access Time	90 ns random access, supporting real-time boot execution without wait states on 20–25 MHz bus interfaces
Supply Voltage	VCC = 2.7–3.6 V, VIO = 1.65–VCC, allowing direct interfacing with 1.8 V or 3.3 V logic families
Operating Temp	–40°C to +85°C industrial grade, qualified for deployment in uncontrolled ambient environments
Package	LAA064 Fortified BGA (11 mm × 13 mm), optimized for thermal dissipation and board-level reliability in high-vibration systems
Sector Size	Uniform 128 KB sectors + configurable boot blocks, enabling granular firmware update and recovery partitioning
Protection Mode	Lowest-address sector protected at power-up, preventing accidental overwrite of critical boot code during initialization

Pinout & Package

Package: Fortified Ball-Grid Array (LAA064), 64-ball, 0.8 mm pitch, 11 mm × 13 mm body, RoHS-compliant lead-free finish.

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address Inputs	21-bit address bus supporting full 32 MB linear addressing in x8 mode
DQ0–DQ7	Data I/O (x8)	Bidirectional data bus; supports x16 mode with DQ8–DQ15 (not present in this variant)
CE#	Chip Enable	Active-low enable controlling device selection; must be asserted before read/write cycles
OE#	Output Enable	Active-low control for data bus drivers; enables read data output without affecting internal state
WE#	Write Enable	Active-low signal initiating internal program/erase operations when CE# and OE# are inactive
RY/BY#	Ready/Busy Output	Open-drain status indicator: low = operation in progress, high = ready for next command
WP#/ACC	Write Protect / Acceleration	Hardware sector lock override (WP#) and program acceleration enable (ACC) for high-speed programming
VCC, VIO, GND	Power Supplies	Separate core (VCC) and I/O (VIO) rails allow mixed-voltage system integration

Key Features

Feature	Design Value
MirrorBit Eclipse Technology	65 nm process enabling higher density, lower power consumption, and improved data retention (>20 years at 85°C)
Password-Protected Boot Block	PPB and DYB modes enforce persistent, non-volatile protection of startup code against unauthorized modification
Uniform Sector Architecture	128 KB sectors simplify firmware partitioning and reduce risk of partial erase corruption during field updates
VIO Flexibility	1.65–3.6 V I/O voltage range eliminates level-shifting requirements when interfacing with 1.8 V microcontrollers
Industrial Temperature Range	–40°C to +85°C qualification ensures stable operation in factory automation, transportation, and outdoor infrastructure

Applications

Industrial PLC Firmware Storage

Telecom Edge Router Boot Memory

Use Scenario: Storing bootloader and OS kernel in programmable logic controllers deployed in manufacturing lines with wide ambient temperature swings.

IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic 90 ns read access to initialize ARM Cortex-M7 processors within 100 ms of power-on.

Use Value: Lowest-address sector protection prevents corruption during brown-out recovery, ensuring fail-safe restart capability.

Use Scenario: Holding firmware images and configuration tables in carrier-grade Ethernet switches operating in telecom central offices.

IC Role / Device Role / Timing Role: Parallel NOR Flash serving as primary boot source for MIPS-based network processors with strict timing margins.

Use Value: VIO/VCC separation allows direct connection to 1.8 V PHY interfaces while maintaining 3.3 V core stability during power sequencing.

Medical Diagnostic Imaging Control

Railway Signaling System Code Storage

Use Scenario: Retaining safety-critical control firmware in ultrasound and MRI subsystems requiring long-term data integrity and audit compliance.

IC Role / Device Role / Timing Role: Trusted firmware repository with password-protected boot block, accessed during cold start and watchdog-triggered reset sequences.

Use Value: PPB-enabled persistent protection ensures regulatory compliance by preventing unauthorized firmware tampering across device lifecycle.

Use Scenario: Storing certified application code in ERTMS/ETCS Level 2 balise transmission modules installed along rail tracks.

IC Role / Device Role / Timing Role: Industrial-grade NOR Flash delivering guaranteed read performance under vibration, humidity, and extended temperature cycling.

Use Value: LAA064 fortified BGA package resists mechanical stress and thermal fatigue in trackside enclosures exposed to diurnal temperature extremes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S90FHAI020	Same die, enhanced thermal performance via heat-spreading lid; identical timing and command set	Preferred for convection-cooled systems exceeding 70°C ambient with no active cooling	Select when thermal derating margin is required beyond standard LAA064 spec
MX29GL256FHI-90G	Macronix equivalent; 90 ns access, same 64-pin FBGA but different pinout (no RY/BY# dedicated pin)	Requires PCB redesign due to signal mapping differences; supports similar sector protection schemes	Choose only if supply chain diversification is prioritized over drop-in replacement

Compared with S29GL256S90FAI020, the FHAI variant adds thermal headroom without changing interface behavior, while the Macronix MX29GL256FHI demands layout revision but offers alternate sourcing-neither is pin-compatible without hardware adaptation.

Availability

S29GL256S90FAI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot memory, and medical diagnostic imaging control requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S90FAI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion Inc. was a leading provider of flash memory and microcontroller solutions, formed through the merger of AMD's and Fujitsu's flash businesses, later acquired by Cypress Semiconductor in 2015.

This part belongs to the S29GL-S MirrorBit Eclipse NOR Flash family, designed specifically for reliable, high-density boot code and firmware storage in industrial, networking, and automotive-qualified systems where data integrity and long-term retention are critical.

FAQ

Is S29GL256S90FAI020 pin-compatible with earlier S29GL256P variants?

No. The S29GL256S uses a 64-ball Fortified BGA (LAA064) package with different ball map and signal assignments than the 56-pin TSOP of S29GL256P. Key differences include relocated WE# and absence of BYTE# pin. PCB redesign is required for migration.

Does this device support both x8 and x16 data bus widths?

Yes. The S29GL256S90FAI020 supports x8 mode by default (DQ0–DQ7 active). x16 mode requires DQ8–DQ15, which are not bonded out in this specific ordering option (FAI020); only x8 configuration is implemented in this variant.

What is the endurance rating and data retention specification?

This device guarantees 100,000 program/erase cycles per sector and 20-year data retention at 85°C, validated per JEDEC JESD22-A117. Retention degrades logarithmically with temperature; at 25°C, retention exceeds 100 years per JEDEC modeling.

How is sector protection configured in the 02 model number?

The "02" suffix indicates lowest-address sector protection enabled at power-up. This configures the first 128 KB sector (boot block) as write-protected by default, enforced via hardware fuse and PPB lock bits-no software initialization required for basic protection.

S29GL256S90FAI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S90FAI020 FAQ

1.How can I place an order for S29GL256S90FAI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90FAI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90FAI020 reliable?

The price and inventory of S29GL256S90FAI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FAI020 is usually 5 days.

3.What payment methods are accepted for S29GL256S90FAI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FAI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90FAI020?

S29GL256S90FAI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90FAI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90FAI020?

For technical support, including S29GL256S90FAI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FAI020 requirements.

6.How does Aetrix verify that S29GL256S90FAI020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90FAI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FAI020 meets industry standards.

7.What is the process for return or replacement of S29GL256S90FAI020?

All S29GL256S90FAI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FAI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90FAI020 part is unused and in its original packaging.

Return procedure for S29GL256S90FAI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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