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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S90FAI023

Name: S29GL256S90FAI023
Brand: Infineon Technologies
SKU: S29GL256S90FAI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90FAI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90FAI023.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S90FAI023 from Spansion is a 256 Mbit (32 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 90 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm); used for firmware storage and boot code execution in embedded controllers and network edge devices.

For engineers reviewing the S29GL256S90FAI023 datasheet, S29GL256S90FAI023 pinout, S29GL256S90FAI023 application, or S29GL256S90FAI023 equivalent, key selection criteria include sector protection configuration (lowest address sector protected), V_IO/V_CC compatibility (2.7–3.6 V), and industrial-grade reliability for long-life embedded deployments.

Technical Context

This device implements a parallel asynchronous interface with page-mode read capability, supporting standard CFI-compliant command sets for erase, program, and query operations. It integrates hardware-based sector protection and supports both single-word and burst write modes via embedded algorithms.

The 65 nm MirrorBit Eclipse architecture enables dual-bit-per-cell storage without floating-gate transistors, delivering higher density and improved data retention (>20 years at 85°C) compared to legacy NOR technologies. Device operation requires no external high-voltage supply - all functions execute at 3.0 V core and I/O voltage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256 Mbit (32 MB) organized as 4,194,304 × 64 bits; supports full-addressable linear memory mapping for XIP execution.
Access Time	90 ns maximum random access time; enables direct execution from flash in real-time control loops with sub-100 ns latency budget.
Supply Voltage	V_CC = V_IO = 2.7–3.6 V; single-rail operation simplifies power design and eliminates level-shifting circuitry.
Temperature Range	Industrial: –40°C to +85°C; qualified for deployment in uncontrolled ambient environments including factory automation and outdoor gateways.
Package Type	Fortified BGA (LAA064), 11 mm × 13 mm, 64-ball array; optimized for thermal dissipation and board-level reliability under thermal cycling.
Sector Protection	Lowest address sector protected by default (Model Number suffix '02'); prevents accidental overwrite of boot loader during field firmware updates.

Pinout & Package

Package: Fortified Ball-Grid Array (LAA064), 64-ball, 0.8 mm pitch, 11 mm × 13 mm body size, RoHS-compliant Pb-free finish.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address Inputs	22-bit address bus supporting full 4 MB addressing space; A0 selects byte within 16-bit word for x16 configuration.
DQ0–DQ15	Data Input/Output	16-bit bidirectional data bus; supports x16 mode only - no x8/x32 configurations supported on this variant.
CE#	Chip Enable	Active-low enable controlling device selection; must be asserted before OE# or WE# to avoid bus contention.
OE#	Output Enable	Active-low control for data output buffer; used during read cycles to gate DQ outputs onto shared system bus.
WE#	Write Enable	Active-low signal initiating internal program/erase sequences when CE# and appropriate command sequence are valid.
RY/BY#	Ready/Busy Output	Open-drain status indicator: low = device busy (erase/program in progress); high = ready for next command.

Key Features

Feature	Design Value
65 nm MirrorBit Eclipse Process	Enables 256 Mbit density in compact BGA package while maintaining >100,000 program/erase cycles and >20-year data retention at 85°C.
Single 3.0 V Supply Operation	Eliminates need for charge pumps or auxiliary voltage rails - reduces BOM count and PCB area in space-constrained designs.
Hardware Sector Protection	Immutable lowest-sector lock (Model '02') prevents corruption of boot code during remote firmware updates or brown-out conditions.
Page-Mode Read Capability	Reduces average read latency by up to 4× vs. random access when fetching sequential instructions or configuration tables.
CFI-Compatible Command Set	Ensures interoperability with standard flash abstraction layers (e.g., U-Boot flash drivers, Linux MTD subsystem) without vendor-specific HAL.

Applications

Industrial PLC Firmware Storage

Telecom Edge Router Boot Memory

Use Scenario: Storing bootloader, FPGA configuration bitstream, and real-time OS kernel in programmable logic controllers deployed in factory-floor environments.

IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic XIP execution with <90 ns instruction fetch latency.

Use Value: Industrial temperature rating and hardware sector protection ensure reliable boot across thermal cycles and prevent unauthorized firmware modification.

Use Scenario: Holding boot firmware and packet-processing microcode in carrier-grade access routers operating 24/7 in telecom central offices.

IC Role / Device Role / Timing Role: Primary parallel NOR flash executing code directly from address space during cold start and failover recovery.

Use Value: Page-mode read accelerates initialization sequence; 20-year data retention guarantees firmware integrity over multi-decade infrastructure lifecycles.

Medical Diagnostic Imaging Control

Automotive ADAS Camera Module

Use Scenario: Storing calibration parameters, safety-critical boot routines, and diagnostic firmware in ultrasound and MRI control units.

IC Role / Device Role / Timing Role: Secure, tamper-resistant nonvolatile memory with locked lowest sector to preserve FDA-mandated boot integrity.

Use Value: Hardware-based protection eliminates software vulnerability surface; industrial temp range supports operation near heat-generating imaging processors.

Use Scenario: Hosting camera sensor initialization firmware and image pre-processing algorithms in automotive surround-view systems.

IC Role / Device Role / Timing Role: Boot-time flash memory enabling fast camera wake-up (<100 ms) and deterministic frame synchronization.

Use Value: 90 ns access time meets ADAS ASIL-B timing constraints; BGA package withstands automotive vibration and thermal shock per AEC-Q100 Grade 3.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S29GL256S90TFI020	Same die, identical timing and command set, but TSOP48 package (12 mm × 20 mm) instead of LAA064 BGA; no fortified mechanical construction.	Preferred for cost-sensitive, lower-density PCBs where board space permits larger footprint and thermal management is less constrained.	Select when mechanical ruggedness is secondary to ease of rework or legacy socket compatibility.
Infineon S29GL256S10FAI023	Same package and pinout, but 100 ns access time (vs. 90 ns); otherwise identical electrical and functional behavior.	Suitable where system timing margin allows 10 ns relaxation - e.g., non-real-time boot loaders or configuration storage only.	Choose when 90 ns performance is not required and inventory consolidation across speed grades is prioritized.

Compared with S29GL256S90FAI023, the TSOP48 alternative trades mechanical robustness for reworkability, while the 100 ns variant relaxes timing at no cost or footprint penalty - both retain identical firmware compatibility and sector protection logic.

Availability

S29GL256S90FAI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot memory, and medical diagnostic imaging control requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S90FAI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion (now part of Cypress Semiconductor, acquired by Infineon in 2019) specialized in high-reliability NOR flash and microcontrollers for industrial and automotive markets before integration into Infineon's memory portfolio.

This device belongs to the S29GL-S MirrorBit Eclipse NOR Flash family, engineered for deterministic boot performance, long-term data retention, and hardware-enforced firmware security in mission-critical embedded systems.

FAQ

Is S29GL256S90FAI023 compatible with standard JEDEC NOR flash command sets?

Yes - it implements the Common Flash Interface (CFI) specification v1.4 and supports industry-standard command sequences for read, program, and sector erase. All commands use the same hex opcodes (e.g., 0x60 for block erase, 0xD0 for confirm) as legacy Spansion/Cypress NOR devices, ensuring drop-in compatibility with existing flash drivers.

What does the '02' suffix in the ordering part number indicate?

The '02' denotes the sector protection configuration: lowest address sector (typically 0x000000–0x00FFFF) is permanently protected against program/erase operations at power-on. This setting is factory-programmed and cannot be altered in-system, safeguarding boot code integrity without software intervention.

Does this device support x8 or x32 data bus widths?

No - S29GL256S90FAI023 is strictly x16 configuration. Its 16-bit DQ bus (DQ0–DQ15) and 22-bit address bus (A0–A21) map to a 4,194,304-word organization. There is no x8 mode support, and no x32 variant exists in the S29GL-S family; wider interfaces require multiplexed or parallel flash arrays.

Can RY/BY# be used as a general-purpose GPIO?

No - RY/BY# is a dedicated open-drain status output reflecting internal device state only. It lacks input capability or configurable drive strength, and its logic level is defined solely by ongoing erase/program activity. Using it as GPIO would violate timing and electrical specifications and risk undefined behavior during critical operations.

S29GL256S90FAI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S90FAI023 FAQ

1.How can I place an order for S29GL256S90FAI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90FAI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90FAI023 reliable?

The price and inventory of S29GL256S90FAI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FAI023 is usually 5 days.

3.What payment methods are accepted for S29GL256S90FAI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FAI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90FAI023?

S29GL256S90FAI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90FAI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90FAI023?

For technical support, including S29GL256S90FAI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FAI023 requirements.

6.How does Aetrix verify that S29GL256S90FAI023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90FAI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FAI023 meets industry standards.

7.What is the process for return or replacement of S29GL256S90FAI023?

All S29GL256S90FAI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FAI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90FAI023 part is unused and in its original packaging.

Return procedure for S29GL256S90FAI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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