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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S90FHA020

Name: S29GL256S90FHA020
Brand: Infineon Technologies
SKU: S29GL256S90FHA020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90FHA020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90FHA020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:4,750

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Product details

Overview

S29GL256S90FHA020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in automotive instrument clusters requiring fast XIP boot code execution and reliable firmware storage.

For engineers reviewing the S29GL256S90FHA020 datasheet, S29GL256S90FHA020 pinout, S29GL256S90FHA020 application, or S29GL256S90FHA020 equivalent, this device supports asynchronous read, sector erase, suspend/resume operations, OTP array, CFI compliance, and AEC-Q100 Grade 2 (–40°C to +105°C) qualification - critical for functional safety–aware embedded firmware systems.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), 32-byte page read capability, and internal embedded algorithm controller (EAC) managing program/erase sequences without host intervention. It uses dual-plane architecture enabling simultaneous read-while-write via suspend/resume commands.

The on-die ECC engine corrects single-bit errors in real time during read, while the 128 kB uniform sector architecture supports fine-grained firmware updates. The versatile I/O (VIO = 1.65 V to VCC) allows interfacing with mixed-voltage SoCs without level shifters.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB); supports full firmware image storage for mid-tier automotive ECUs
Random access time (tACC)	90 ns at VCC = VIO; enables sub-100 ns boot code fetch for real-time startup
Page access time (tPACC)	15 ns; accelerates sequential instruction fetch within 32-byte aligned pages
Programming buffer	512 bytes; reduces effective programming time by batching up to 256 words per command
Erase endurance	100,000 cycles per sector; supports field firmware updates over 15+ years of vehicle life
Data retention	20 years at +85°C; meets long-term reliability requirements for automotive infotainment and ADAS modules
Operating temperature	–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood and display module deployment

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	Word-aligned address bus (24-bit); A23 = MSB for 256 Mb addressing (max 32 MB space)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads without external multiplexing
CE#	Chip enable	Active-low chip select; controls device power state and enables low-current standby mode
OE#	Output enable	Active-low read strobe; gates output drivers to prevent bus contention during shared-memory access
WE#	Write enable	Active-low write strobe; initiates internal program/erase algorithms when combined with command sequences
RY/BY#	Ready/Busy indicator	Open-drain status signal; asserts low during active program/erase, enabling polling-free interrupt-driven control
RESET#	Hardware reset	Asynchronous active-low reset; forces device into known state and aborts ongoing embedded operations
VCC	Core supply	3.0 V ±10% supply (2.7–3.6 V); powers core logic, EAC, and ECC engine
VIO	I/O supply	1.65–3.6 V independent I/O rail; decouples interface voltage from core for mixed-voltage SoC integration

Key Features

Feature	Design Value
Hardware ECC engine	Single-bit error correction with automatic detection during read; eliminates need for external ECC logic or software overhead
512-byte programming buffer	Enables burst programming of up to 256 words in one command; cuts typical firmware update time by >4× vs. byte-by-byte write
Uniform 128-kB sectors	64 identical erase blocks; simplifies partitioning for bootloader, OS, and application firmware with deterministic erase timing
Suspend/resume capability	Halts active program or erase to service high-priority read requests; essential for real-time HMI responsiveness during OTA updates
1024-byte OTP array	Two lockable regions for secure key storage or calibration data; prevents accidental overwrite after factory programming

Applications

Automotive Instrument Cluster

ADAS Domain Controller Boot Memory

Use Scenario: Stores boot firmware and GUI assets for digital dashboards with real-time rendering requirements.

IC Role / Device Role / Timing Role: XIP-capable NOR flash providing sub-100 ns instruction fetch directly to MCU core.

Use Value: Eliminates external RAM copy step; reduces boot time by 35 ms and system BOM cost.

Use Scenario: Holds safety-critical boot loader and ASIL-B firmware images for radar/vision processors.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 non-volatile memory with ECC and 100K erase cycles for mission-critical updates.

Use Value: Meets ISO 26262 diagnostic coverage requirements without additional error-handling SW layer.

Industrial PLC Firmware Storage

Medical Imaging System Configuration Memory

Use Scenario: Retains ladder logic programs and I/O mapping tables across power cycles in factory automation controllers.

IC Role / Device Role / Timing Role: Sector-erasable parallel flash supporting field updates via RS-485 without downtime.

Use Value: Enables hot firmware patching during maintenance windows with verified sector-level integrity checks.

Use Scenario: Stores calibrated sensor profiles and DICOM configuration parameters in portable ultrasound devices.

IC Role / Device Role / Timing Role: OTP-secured parameter memory with tamper-resistant lock bits for regulatory audit trails.

Use Value: Ensures FDA 21 CFR Part 11 compliance via hardware-enforced write protection of calibration records.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI020	Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCBs where board area is prioritized over manual reworkability	Select when footprint miniaturization outweighs hand-soldering serviceability needs
MX29GL256FHI-90G	Macronix part with 90 ns tACC, but lacks built-in ECC and OTP array; requires external error handling	Suitable for cost-sensitive industrial applications where ECC is managed in software or not required	Choose only if firmware update frequency is low and system-level ECC can be implemented in host MCU

Compared with S29GL256P90TFI020, this TSOP variant offers easier prototyping and rework; versus MX29GL256FHI-90G, it delivers hardware ECC and OTP security out-of-box - reducing validation effort for automotive and medical designs.

Availability

S29GL256S90FHA020 is available at Aetrix Electronics and suitable for automotive instrument clusters, ADAS domain controllers, and industrial PLCs requiring stable component supply with AEC-Q100 qualification and 20-year data retention.

Supply support for S29GL256S90FHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and trusted security solutions, with global manufacturing and automotive qualification expertise.

The GL-S family targets high-reliability embedded systems needing fast XIP boot performance and robust firmware storage - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.

FAQ

Does S29GL256S90FHA020 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 90 ns random access time and 15 ns page-mode reads, allowing microcontrollers to execute code directly from flash without copying to RAM. Its asynchronous interface and word-aligned addressing ensure deterministic timing for real-time boot and interrupt response.

What is the function of the RY/BY# pin, and how should it be used in system design?

RY/BY# is an open-drain ready/busy status indicator that goes low during program or erase operations and returns high when complete. It supports both polling and interrupt-driven control - connect to an MCU GPIO with pull-up resistor, and use edge-triggered interrupts to avoid CPU busy-waiting during long erase cycles.

How does the 512-byte programming buffer improve firmware update efficiency?

The buffer allows up to 512 bytes (256 words) to be loaded before initiating internal programming, reducing command overhead and bus arbitration latency. In practice, this cuts average firmware patch time by 4.2× compared to single-word programming, especially beneficial for OTA updates in bandwidth-constrained telematics systems.

Is the OTP array truly one-time programmable, and can either region be locked independently?

Yes. The 1024-byte OTP array contains two separately lockable regions (Region 0 and Region 1). Once a region's lock bit is set via the CFI command sequence, its contents become permanently read-only - even after power cycles or RESET#. This provides hardware-enforced immutability for cryptographic keys or calibration constants.

S29GL256S90FHA020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S90FHA020 FAQ

1.How can I place an order for S29GL256S90FHA020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90FHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90FHA020 reliable?

The price and inventory of S29GL256S90FHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FHA020 is usually 5 days.

3.What payment methods are accepted for S29GL256S90FHA020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FHA020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90FHA020?

S29GL256S90FHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90FHA020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90FHA020?

For technical support, including S29GL256S90FHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FHA020 requirements.

6.How does Aetrix verify that S29GL256S90FHA020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90FHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FHA020 meets industry standards.

7.What is the process for return or replacement of S29GL256S90FHA020?

All S29GL256S90FHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FHA020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90FHA020 part is unused and in its original packaging.

Return procedure for S29GL256S90FHA020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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