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Infineon Technologies S29GL256S90FHA023

Name: S29GL256S90FHA023
Brand: Infineon Technologies
SKU: S29GL256S90FHA023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90FHA023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90FHA023.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:2,500

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Product details

Overview

S29GL256S90FHA023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.

For engineers reviewing the S29GL256S90FHA023 datasheet, S29GL256S90FHA023 pinout, S29GL256S90FHA023 application, or S29GL256S90FHA023 equivalent, key selection criteria include its 128 kB uniform sector erase architecture, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant interface for firmware update compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), 32-byte page read capability, and embedded algorithm controller (EAC) for autonomous program/erase operations. Its internal ECC engine corrects single-bit errors on-the-fly during read, and status monitoring supports RY/BY# pin, data polling, and status register interrogation.

The GL-S architecture separates instruction fetch (XIP-optimized random access) from bulk data storage (buffered programming), enabling simultaneous boot code execution and firmware patching. Sector protection includes volatile/non-volatile lock bits per 128 kB sector and a dedicated 1024-byte OTP array with two lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-range MCUs with space for dual-bank OTA updates.
Random Access Time	90 ns at VCC = VIO; enables sub-11 MHz bus timing for legacy parallel interfaces without wait states.
Page Access Time	15 ns; allows burst reads within 32-byte aligned pages-critical for tight XIP loop performance.
Write Buffer Size	512 bytes; reduces effective programming time by 3–5× vs. single-word writes, accelerating field firmware updates.
ECC Support	Hardware single-bit correction; eliminates need for external ECC logic or software overhead in safety-critical boot paths.
Endurance & Retention	100,000 program/erase cycles / 20 years data retention; meets industrial lifecycle requirements for unattended equipment.
Operating Temperature	–40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive ECUs and high-ambient industrial controllers.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width). Pinout validated per Infineon datasheet 001-98285 Rev. *U, Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density (2²⁴ × 16 bits = 32 MB).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads; compatible with standard 16-bit microprocessor buses.
CE#	Chip Enable	Active-low chip select; controls device power state and enables command decoding; tCE = 90 ns max.
OE#	Output Enable	Active-low output control; gates data onto DQ bus during read; tOE = 25 ns max.
WE#	Write Enable	Active-low write strobe; initiates program/erase commands and data latching; synchronized with CE#/OE#.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low = operation in progress; used for hardware flow control without polling.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into standby and clears internal state; required for power-up initialization.
VCC	Core Supply	2.7–3.6 V single supply for core logic, programming, and erase; eliminates need for separate VPP.
VIO	I/O Supply	1.65–3.6 V versatile I/O voltage; decouples interface voltage from core, enabling mixed-voltage system integration.

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse Technology	Enables higher density and lower power vs. older floating-gate NOR, with improved endurance and reduced leakage in standby.
Asynchronous 32-byte Page Read	Reduces average read latency for sequential instruction fetch; avoids pipeline stalls in XIP applications.
512-byte Programming Buffer	Allows one command to load up to 256 words; cuts total programming time by minimizing command overhead and bus arbitration.
Advanced Sector Protection (ASP)	Per-sector volatile/non-volatile lock bits prevent accidental erase/write-essential for bootloader and calibration data security.
Common Flash Interface (CFI)	Standardized parameter table enables automatic driver detection and cross-vendor firmware portability in embedded OS environments.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and real-time control firmware in AEC-Q100 Grade 2 ECU with ambient operating range up to +105°C.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability; provides deterministic 90 ns read access for critical startup sequences.

Use Value: Hardware ECC ensures boot integrity after 10+ years of thermal cycling; ASP prevents corruption during CAN-based firmware updates.

Use Scenario: Holding firmware and configuration data in modular PLC backplanes where hot-swap and long-term reliability are mandatory.

IC Role / Device Role / Timing Role: Parallel interface flash for ARM Cortex-M7-based controller with external bus interface; supports dual-bank firmware swapping.

Use Value: 128 kB uniform sectors enable atomic firmware partitioning; 512-byte buffer accelerates field updates over RS-485 service ports.

Medical Imaging System Boot Memory

Telecom Base Station Configuration Storage

Use Scenario: Secure boot storage in FDA-cleared imaging devices requiring data retention validation and tamper-resistant OTP regions.

IC Role / Device Role / Timing Role: Trusted boot source with dedicated 1024-byte OTP array (two lockable regions) for cryptographic keys and calibration constants.

Use Value: Non-volatile sector locks + OTP locking meet IEC 62304 Class C software safety requirements for persistent configuration integrity.

Use Scenario: Storing FPGA bitstreams and DSP firmware in carrier-grade base station radios operating continuously at elevated ambient temperatures.

IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to TI C66xx DSP EMIF; leverages page mode for fast bitstream loading during warm reboot.

Use Value: 20-year data retention and 100,000-cycle endurance ensure zero field failures over 15-year product lifecycle without maintenance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI020	Same density and timing, but 64-ball LAE BGA (9 mm × 9 mm); no Versatile I/O (VIO fixed to VCC); lacks AEC-Q100 qualification.	Preferred for space-constrained PCBs where BGA routing is acceptable and automotive temperature grade is not required.	Select when footprint size is critical and industrial temp (–40°C to +85°C) suffices; avoid for automotive or mixed-voltage designs.
MX29GL256FHI-90G	256 Mb, 90 ns, but Macronix part; uses different command set, no integrated ECC, and only 10,000 erase cycles.	Suitable for cost-sensitive consumer applications where ECC and extended endurance are not mandated.	Choose only for non-safety-critical designs with shorter product lifecycles; requires full firmware driver rework due to command incompatibility.

Compared with S29GL256P90TFI020 and MX29GL256FHI-90G, the S29GL256S90FHA023 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, Versatile I/O, and 100,000-cycle endurance-making it the only option qualified for automotive and long-life industrial boot memory where data integrity is non-negotiable.

Availability

S29GL256S90FHA023 is available at Aetrix Electronics and suitable for automotive engine control units, industrial PLCs, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S90FHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and automotive qualification expertise.

The GL-S family targets high-reliability embedded systems needing robust, pin-compatible NOR flash for boot code and firmware-designed specifically for XIP-capable microcontrollers in automotive, industrial, and medical applications.

FAQ

Is S29GL256S90FHA023 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. S29GL256S90FHA023 uses a 56-pin TSOP package with specific pin assignments for Versatile I/O (VIO) and enhanced reset behavior. The S29GL256N uses 56-pin TSOP but lacks VIO and RY/BY# functionality; S29GL256P uses 64-ball BGA. Direct replacement requires PCB redesign and firmware timing validation.

Does this device support execute-in-place (XIP) operation without external buffering?

Yes. Its 90 ns random access time and asynchronous interface allow direct CPU instruction fetch from the flash array. No external cache or SRAM buffering is needed for basic XIP, though performance-critical loops benefit from 32-byte page mode reads to minimize address setup overhead.

What is the role of the 1024-byte OTP array, and how is it secured?

The OTP array contains two independently lockable 512-byte regions used for immutable data like cryptographic keys or factory calibration values. Once locked via dedicated CFI commands, each region becomes permanently read-only; unlocking is impossible, and lock status is retained through power cycles and reboots.

How does the hardware ECC interact with the status register and RY/BY# pin during read operations?

ECC correction occurs transparently during every read: if a single-bit error is detected, it is corrected before data appears on DQ lines, and the ECC status bit (bit 6 of status register) is set. RY/BY# remains high (ready) throughout-no timing penalty or external intervention is required for correction.

S29GL256S90FHA023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S90FHA023 FAQ

1.How can I place an order for S29GL256S90FHA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90FHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90FHA023 reliable?

The price and inventory of S29GL256S90FHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FHA023 is usually 5 days.

3.What payment methods are accepted for S29GL256S90FHA023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FHA023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90FHA023?

S29GL256S90FHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90FHA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90FHA023?

For technical support, including S29GL256S90FHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FHA023 requirements.

6.How does Aetrix verify that S29GL256S90FHA023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90FHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FHA023 meets industry standards.

7.What is the process for return or replacement of S29GL256S90FHA023?

All S29GL256S90FHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FHA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90FHA023 part is unused and in its original packaging.

Return procedure for S29GL256S90FHA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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