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Infineon Technologies S29GL256S90FHI010
- Part No.:
- S29GL256S90FHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S90FHI010.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,802
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Product details
Overview
S29GL256S90FHI010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It features hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte programming buffer-enabling fast embedded code storage and XIP execution in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL256S90FHI010 datasheet, S29GL256S90FHI010 pinout, S29GL256S90FHI010 application, or S29GL256S90FHI010 equivalent, this device supports asynchronous read, sector erase suspend/resume, versatile I/O (1.65–VCC), OTP lockable regions, and AEC-Q100 Grade 2 qualification for high-reliability automotive use.
Technical Context
The S29GL256S90FHI010 implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling dual-bit-per-cell storage without compromising reliability. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY#, and automatic ECC correction during read cycles.
It supports three I/O voltage modes: Full VCC = VIO, VersatileIO (VIO = 1.65–VCC), and hardware reset-driven protection. Sector erase timing is fixed at 477 kBps, and buffer programming achieves 1.5 MBps-both measured under 3.0 V, 25°C conditions with verified command sequences.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words-supports full firmware image storage for mid-tier microcontrollers. |
| Random access time (tACC) | 90 ns at VCC = VIO = 3.0 V-enables real-time XIP execution without wait states in Cortex-M7/M4-based systems. |
| Page access time (tPACC) | 15 ns-allows rapid sequential reads within 32-byte aligned pages, reducing effective instruction fetch latency. |
| Programming buffer size | 512 bytes-reduces host CPU overhead by batching up to 256 words per write command, accelerating firmware updates. |
| ECC capability | Internal hardware single-bit error correction-eliminates need for external ECC logic in safety-critical boot memory applications. |
| Sector size & count | 128 kbyte uniform sectors (256 total)-simplifies partitioning for bootloader, OS, and application firmware with deterministic erase boundaries. |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention-meets long-life requirements for industrial gateways and automotive ECUs. |
Pinout & Package
This device is packaged in a 56-pin TSOP (Thin Small Outline Package) with standard JEDEC MO-141AC footprint, 14 mm × 20 mm body, and 0.5 mm lead pitch. Pin functions are defined per Infineon's datasheet Rev. *U, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus (AMAX = A22 for 256 Mb); supports byte-aligned addressing only via external glue logic. |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; operates at VIO (1.65–3.6 V), independent of VCC-enables mixed-voltage system interfacing. |
| CE# | Chip enable | Active-low chip select; tCE = 90 ns max-determines minimum valid setup time before read/write initiation. |
| OE# | Output enable | Active-low output control; tOE = 25 ns max-governs data hold timing during asynchronous read cycles. |
| WE# | Write enable | Active-low write strobe; controls latching of command/data into internal registers during program/erase sequences. |
| RY/BY# | Ready/Busy indicator | Open-drain status output; low during active program/erase-enables polling-free interrupt-driven operation. |
| RESET# | Hardware reset | Active-low asynchronous reset; restores device to read mode and clears internal state after power-up or fault recovery. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC-enables direct interface with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters. |
| Asynchronous 32-byte page read | Initial access loads full 32-byte page; subsequent intra-page reads take only 15 ns-optimizes burst instruction fetch in XIP mode. |
| Suspend/resume for program & erase | Allows interruption of background erase to service high-priority read requests-critical for real-time OS environments. |
| Advanced sector protection (ASP) | Per-sector volatile/non-volatile lock bits-prevents accidental overwrite of bootloader or calibration data in field-deployed units. |
| 1024-byte OTP array | Two independently lockable 512-byte regions-stores cryptographic keys or unique device identifiers with irreversible write protection. |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver alerts, and CAN message lookup tables in AEC-Q100 Grade 2 qualified head unit. IC Role / Device Role / Timing Role: Boot memory and runtime XIP code store; delivers 90 ns random access to support 60 fps UI rendering. Use Value: Hardware ECC ensures bit-flip resilience in high-temperature cabin environments (>105°C junction), eliminating SW-based scrubbing overhead. |
Use Scenario: Holding firmware, configuration profiles, and ladder logic binaries in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: Non-volatile program memory with sector-level update granularity-enables field firmware patching without full reflash. Use Value: 128-kbyte uniform sectors align with typical PLC firmware partition sizes, simplifying BOM management and version control. |
| Medical Diagnostic Imaging UI | Avionics Display System |
Use Scenario: Hosting GUI assets and safety-critical boot code in Class II medical imaging devices requiring 20-year data retention. IC Role / Device Role / Timing Role: Primary boot ROM with OTP-locked secure boot key-ensures chain-of-trust integrity from power-on reset. Use Value: 100,000 erase cycles support frequent regulatory-mandated firmware validation cycles across product lifetime. |
Use Scenario: Storing display firmware and font libraries in DO-254-compliant cockpit displays operating at –40°C to +85°C. IC Role / Device Role / Timing Role: High-reliability code memory with suspend/resume-allows safe interrupt handling during critical flight phase transitions. Use Value: RY/BY# pin enables deterministic interrupt latency (<1 µs) during erase operations, meeting ARINC 661 timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S90TFI010 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of 56-pin TSOP; identical timing and electrical specs. | Preferred for space-constrained PCBs with fine-pitch routing; requires different layout and reflow profile. | Select when board area is limited and BGA assembly capability exists. |
| MX29GL256FHT2I-90G | Micron equivalent with 90 ns tACC, but no hardware ECC; relies on external controller for error correction. | Lower cost where ECC is handled in SoC or FPGA; not suitable for standalone safety-critical boot memory. | Choose only if host processor provides robust ECC and lifecycle validation is not required. |
Compared with S29GL256S90FHI010, the TSOP variant offers easier prototyping and rework, while the BGA alternative improves thermal performance and signal integrity at higher densities; the Micron part reduces BOM cost but shifts ECC responsibility to the system level.
Availability
S29GL256S90FHI010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical diagnostic UIs, and avionics display systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.
Supply support for S29GL256S90FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems requiring fast XIP-capable NOR flash with integrated ECC and automotive-grade qualification-designed specifically for boot code, firmware, and safety-critical data storage.
FAQ
Does S29GL256S90FHI010 support both 1.8 V and 3.3 V I/O interfaces?
Yes-it supports versatile I/O with VIO ranging from 1.65 V to VCC (2.7–3.6 V). When VCC = 3.0 V, VIO can be set to 1.8 V or 3.3 V independently, enabling direct connection to 1.8 V FPGAs or 3.3 V microcontrollers without external level shifters.
What is the function of the STB pin on this device?
The STB (Strobe) pin is not present on S29GL256S90FHI010. This part uses standard CE#/OE#/WE# control signals only; STB appears in block diagrams as internal signal routing notation-not an external pin. The 56-pin TSOP package has no STB terminal.
Can the OTP region be reprogrammed after locking?
No-the 1024-byte OTP array contains two 512-byte lockable regions. Once a region's lock bit is set via the CFI command sequence, it becomes permanently irreversible. Programming and locking must be performed during final test or secure provisioning; no unlock mechanism exists.
Is the 90 ns access time guaranteed across the full industrial temperature range?
Yes-90 ns random access time (tACC) is specified over the full industrial grade range (–40°C to +85°C) and automotive grade range (–40°C to +105°C), per datasheet Rev. *U Table 2 on page 2. This value applies under VCC = VIO = 3.0 V and CL = 30 pF loading conditions.
S29GL256S90FHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S90FHI010 FAQ
1.How can I place an order for S29GL256S90FHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90FHI010 reliable?
The price and inventory of S29GL256S90FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FHI010 is usually 5 days.
3.What payment methods are accepted for S29GL256S90FHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90FHI010?
S29GL256S90FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90FHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90FHI010?
For technical support, including S29GL256S90FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FHI010 requirements.
6.How does Aetrix verify that S29GL256S90FHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FHI010 meets industry standards.
7.What is the process for return or replacement of S29GL256S90FHI010?
All S29GL256S90FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90FHI010 part is unused and in its original packaging.
Return procedure for S29GL256S90FHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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