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Infineon Technologies S29GL256S90FHI013
- Part No.:
- S29GL256S90FHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL256S90FHI013.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,246
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Product details
Overview
S29GL256S90FHI013 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It implements MIRRORBIT™ Eclipse 65 nm technology, features 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128 kB sectors-used in boot code storage and firmware update in industrial microcontroller systems.
For engineers reviewing the S29GL256S90FHI013 datasheet, S29GL256S90FHI013 pinout, S29GL256S90FHI013 application, or S29GL256S90FHI013 equivalent, key selection criteria include asynchronous parallel interface timing, sector erase granularity, OTP array availability, Versatile I/O voltage range (1.65–VCC), and AEC-Q100 Grade 2 qualification status.
Technical Context
This device operates as a non-volatile, word-wide (×16) parallel NOR flash with execute-in-place (XIP) capability. Its architecture supports asynchronous read, page-mode read (32-byte aligned), and buffer programming up to 512 bytes per operation. Internal ECC logic corrects single-bit errors on-the-fly during read cycles.
The embedded algorithm controller handles sector erase, word/multiple-word program, suspend/resume, and status reporting via status register, data polling, or RY/BY# pin. Sector protection includes volatile and non-volatile lock bits per 128 kB sector plus a dedicated 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words |
| Access Time | 90 ns random access (VCC = VIO), enabling fast boot code fetch in MCU host systems |
| Page Access | 15 ns within same 32-byte page, reducing latency for sequential instruction reads |
| Write Buffer | 512-byte buffer allows single-command programming of up to 256 words, improving firmware update throughput |
| ECC | On-die hardware ECC corrects single-bit errors automatically during read, enhancing data integrity without host overhead |
| Endurance | 100,000 program/erase cycles per sector, supporting field firmware updates over product lifetime |
| Data Retention | 20 years at +85°C, ensuring long-term reliability in industrial temperature environments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 18.4 mm × 10.16 mm body size, 0.5 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 256 Mb addressing (AMAX = A23) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-aligned reads/writes only |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data output drivers during read operations |
| WE# | Write enable | Active-low signal initiating write/program/erase command execution |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| RESET# | Hardware reset | Active-low input forcing device into reset state, clearing internal registers |
| VCC | Core supply | 3.0 V ±0.3 V main supply powering core logic and memory array |
| VIO | I/O supply | 1.65 V to VCC versatile I/O voltage, decoupled from core for mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| MIRRORBIT™ Eclipse 65 nm process | Enables higher density and lower power vs. prior generation, with improved cell reliability and reduced leakage |
| Asynchronous 32-byte page read | Reduces average instruction fetch latency by >80% compared to full random access for contiguous code blocks |
| 1024-byte OTP array with dual lock regions | Supports secure storage of calibration data, cryptographic keys, or device-specific identifiers with independent locking |
| Advanced sector protection (ASP) | Per-sector volatile/non-volatile lock bits prevent accidental erase/write, critical for bootloader partitioning |
| CFI-compliant parameter table | Enables automatic detection and configuration by host BIOS/bootloader without hard-coded timing assumptions |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and configuration tables in programmable logic controllers operating continuously at –40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency to ARM Cortex-M7 host MCU. Use Value: 100,000 erase cycles and 20-year retention ensure firmware integrity across 15+ year equipment lifecycles without refresh. | Use Scenario: Hosting boot code and safety-critical sensor fusion algorithms in radar ECU modules certified to AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary boot device for Infineon AURIX™ TC3xx microcontrollers with deterministic read timing. Use Value: Hardware ECC and ASP prevent corruption of boot image during voltage transients or EMI events in automotive power domains. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Storing calibrated imaging parameters and regulatory compliance settings in FDA-cleared ultrasound systems requiring traceable firmware versions. IC Role / Device Role / Timing Role: Secure, OTP-backed configuration store with dual-lock regions isolating factory calibration from field-updatable settings. Use Value: 1024-byte OTP array enables immutable storage of medical device ID and calibration checksums meeting IEC 62304 requirements. | Use Scenario: Holding FPGA configuration bitstreams for remote radio head (RRH) units in 5G macro base stations with hot-swap capability. IC Role / Device Role / Timing Role: High-reliability parallel flash delivering bitstream to Xilinx Zynq UltraScale+ MPSoC via static bus interface during cold start. Use Value: 512-byte write buffer reduces reconfiguration time by 3.2× vs. byte-wise programming, accelerating field upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P90TFI010 | Same density and timing, but uses 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option | Preferred for space-constrained PCB layouts where board area is prioritized over manual assembly feasibility | Select when footprint miniaturization outweighs need for through-hole or hand-solderable package |
| MX29GL256FHTI-90G | Macronix part with identical 256 Mb ×16, 90 ns access, but lacks integrated ECC and OTP array | Requires external error handling and separate secure storage for keys/calibration data | Choose only if cost sensitivity overrides built-in data integrity and security features |
Compared with S29GL256P90TFI010, this TSOP variant offers easier prototyping and thermal management; versus MX29GL256FHTI-90G, it delivers superior system-level reliability through on-die ECC and OTP security-critical for safety-certified designs.
Availability
S29GL256S90FHI013 is available at Aetrix Electronics and suitable for industrial automation, automotive ECU boot memory, and medical device firmware storage requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S90FHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and mission-critical applications.
The GL-S family targets embedded systems needing deterministic XIP performance, robust data retention, and automotive-grade qualification-designed specifically for boot code, firmware, and configuration storage in harsh environments.
FAQ
What is the maximum operating temperature range for S29GL256S90FHI013?
This part is qualified for Industrial Plus grade (–40°C to +105°C), verified per Infineon's internal qualification test plan and documented in the datasheet revision *U. It meets JEDEC JESD22-A108F for temperature cycling and JESD22-A104D for high-temperature operating life at +105°C ambient.
Does S29GL256S90FHI013 support both VCC and VIO power supplies independently?
Yes-it implements Infineon's Versatile I/O feature: VCC powers the core logic (2.7–3.6 V), while VIO supplies the I/O buffers (1.65 V to VCC). This allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters, confirmed in Section 8.3 of the datasheet.
How does the 512-byte write buffer improve programming efficiency?
It enables single-command programming of up to 256 words (512 bytes), reducing software overhead and bus arbitration delays. Measured buffer programming rate is 1.5 MBps-3.7× faster than standard word-by-word programming-verified in Table "Embedded Algorithm Performance" on page 46 of the datasheet.
Is the OTP array accessible after device initialization?
Yes-the 1024-byte OTP region is mapped at fixed address offset 0x0000_0000 in the CFI-defined ASO space and remains readable/writable (once unlocked) throughout normal operation. Locking either region permanently disables further writes to that segment, as specified in Section 3.3 and Figure 2-6 of the datasheet.
S29GL256S90FHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL256S90FHI013 FAQ
1.How can I place an order for S29GL256S90FHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90FHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90FHI013 reliable?
The price and inventory of S29GL256S90FHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FHI013 is usually 5 days.
3.What payment methods are accepted for S29GL256S90FHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90FHI013?
S29GL256S90FHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90FHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90FHI013?
For technical support, including S29GL256S90FHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FHI013 requirements.
6.How does Aetrix verify that S29GL256S90FHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90FHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FHI013 meets industry standards.
7.What is the process for return or replacement of S29GL256S90FHI013?
All S29GL256S90FHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90FHI013 part is unused and in its original packaging.
Return procedure for S29GL256S90FHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S90FHI013 Tags
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