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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S90FHI020

Name: S29GL256S90FHI020
Brand: Infineon Technologies
SKU: S29GL256S90FHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90FHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90FHI020.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S90FHI020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It implements MIRRORBIT™ Eclipse 65 nm technology, features 512-byte write buffer, hardware ECC for single-bit correction, and uniform 128 kB sector erase-used in boot code storage for industrial controllers and automotive ECUs.

For engineers reviewing the S29GL256S90FHI020 datasheet, S29GL256S90FHI020 pinout, S29GL256S90FHI020 application, or S29GL256S90FHI020 equivalent, key selection criteria include asynchronous parallel interface timing, Versatile I/O voltage support (1.65 V to VCC), OTP array security, CFI compliance, and AEC-Q100 Grade 3 qualification for automotive use cases.

Technical Context

This device operates as an x16 asynchronous parallel NOR flash with word-aligned addressing and page-mode read capability: each initial access fetches a full 32-byte aligned page, with subsequent intra-page reads completing in 15 ns. The embedded algorithm controller handles all program/erase operations-including suspend/resume-and integrates status register, data polling, and RY/BY# signaling for real-time operation monitoring.

Hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, while the separate 1024-byte OTP array supports two lockable regions for secure configuration or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers
Interface	Asynchronous x16 parallel; enables direct XIP execution without external buffering
Random Access Time	90 ns at VCC = VIO; meets real-time boot latency requirements in industrial PLCs
Page Access Time	15 ns; accelerates sequential instruction fetch within cached pages
Write Buffer Size	512 bytes; reduces average programming time by batching up to 256 words per command
ECC	Internal hardware single-bit correction; eliminates need for external error-handling logic
Endurance	100,000 program/erase cycles; suitable for field-upgradable firmware partitions
Data Retention	20 years at 85°C; ensures long-term reliability in unattended embedded deployments

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 20.0 mm × 10.16 mm × 1.2 mm height, lead-free and RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit address bus supporting 8-Mword (32 MB) address space; A22 is MSB
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads with no external multiplexing
CE#	Chip enable	Active-low chip select; controls device power state and enables multi-chip addressing
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal state
WE#	Write enable	Active-low write strobe; initiates command sequences and data latching
RY/BY#	Ready/Busy indicator	Open-drain active-low signal indicating ongoing program/erase; used for hardware flow control
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts pending operations
VCC	Core supply	3.0 V ±0.3 V supply for logic and memory array; powers internal voltage generators
VIO	I/O supply	1.65 V to VCC; allows interfacing with 1.8 V, 2.5 V, or 3.3 V host systems
WP#	Write protect	Active-low hardware sector protection enable; prevents accidental program/erase of protected sectors

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65 V–VCC I/O supply enables mixed-voltage system integration without level shifters
512-byte programming buffer	Reduces effective programming time by >60% vs. single-word writes for firmware updates
Uniform 128-kB sectors	Simplifies partitioning of boot loader, application, and parameter storage with deterministic erase boundaries
CFI-compliant interface	Enables automatic detection and configuration by standard flash-aware bootloaders and OS drivers
OTP array with dual lock regions	Provides tamper-resistant storage for cryptographic keys or calibration coefficients with independent locking

Applications

Industrial PLC Firmware Storage

Automotive ECU Boot Memory

Use Scenario: Storing boot code and safety-critical firmware in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <90 ns latency.

Use Value: Ensures deterministic startup under -40°C to +85°C ambient; ECC prevents silent corruption of control logic.

Use Scenario: Holding bootloader and diagnostic firmware in engine control units requiring AEC-Q100 Grade 3 qualification.

IC Role / Device Role / Timing Role: Certified parallel NOR flash for secure, high-reliability boot path with OTP-based key storage.

Use Value: Meets automotive functional safety requirements via 100K-cycle endurance and 20-year data retention at 85°C.

Medical Imaging System Configuration

Telecom Base Station BIOS

Use Scenario: Storing calibration tables and device-specific configuration parameters in MRI and ultrasound equipment.

IC Role / Device Role / Timing Role: Secure parameter storage using dual-lock OTP regions and hardware write protection.

Use Value: Prevents unauthorized modification of medical device settings; ASP enables field-selectable sector lockdown.

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in carrier-grade wireless infrastructure equipment.

IC Role / Device Role / Timing Role: High-density, low-latency parallel flash for fast cold-boot recovery and remote firmware updates.

Use Value: 512-byte buffer and page-mode read accelerate BIOS load time by ~40% vs. legacy NOR devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI020	Same density and timing, but uses 64-ball LAE FBGA (9 mm × 9 mm); lacks OTP array	Preferred for space-constrained PCBs where TSOP footprint is prohibitive	Select when board area is critical and OTP functionality is not required
MX29GL256FHT2I-90G	Macronix part with identical 256 Mb / 90 ns spec, but no integrated ECC or Versatile I/O	Requires external ECC logic and level-shifting for mixed-voltage designs	Choose only if cost sensitivity outweighs reliability and design simplicity benefits

Compared with S29GL256P90TFI020, this TSOP variant offers superior board-level serviceability and OTP security; versus MX29GL256FHT2I-90G, it delivers built-in ECC and seamless I/O voltage flexibility-reducing BOM count and validation effort.

Availability

S29GL256S90FHI020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL256S90FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and mission-critical applications.

The GL-S family targets embedded systems needing robust, pin-compatible NOR flash with enhanced reliability features-including ECC, OTP, and AEC-Q100 qualification-for boot and firmware storage in harsh environments.

FAQ

What is the maximum operating temperature range for S29GL256S90FHI020?

This part is rated for industrial temperature range: –40°C to +85°C. It is not qualified for automotive Grade 2 (–40°C to +105°C) or extended industrial grades. The suffix 'I' in the ordering code explicitly denotes industrial grade, confirmed in Infineon's datasheet section 10.4.

Does S29GL256S90FHI020 support common flash interface (CFI) queries?

Yes, it fully implements the Common Flash Interface specification, including ID-CFI ASO map at fixed addresses. This enables automatic detection by U-Boot, Linux MTD drivers, and commercial flash programmers without custom initialization code.

Can S29GL256S90FHI020 be used with a 1.8 V I/O interface?

Yes-its Versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.0 V, VIO may be set to 1.8 V, allowing direct connection to 1.8 V microcontroller buses without level shifters, as verified in datasheet section 8.3.

Is hardware reset (RESET#) required for reliable operation after power-up?

Yes. The device requires a valid RESET# pulse after VCC stabilizes to ensure proper initialization of internal state machines and command registers. Datasheet section 11.3 specifies minimum RESET# pulse width (≥100 ns) and timing relative to VCC ramp.

S29GL256S90FHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S90FHI020 FAQ

1.How can I place an order for S29GL256S90FHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90FHI020 reliable?

The price and inventory of S29GL256S90FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FHI020 is usually 5 days.

3.What payment methods are accepted for S29GL256S90FHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90FHI020?

S29GL256S90FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90FHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90FHI020?

For technical support, including S29GL256S90FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FHI020 requirements.

6.How does Aetrix verify that S29GL256S90FHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FHI020 meets industry standards.

7.What is the process for return or replacement of S29GL256S90FHI020?

All S29GL256S90FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90FHI020 part is unused and in its original packaging.

Return procedure for S29GL256S90FHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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