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Infineon Technologies S29GL256S90FHI023

Name: S29GL256S90FHI023
Brand: Infineon Technologies
SKU: S29GL256S90FHI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90FHI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL256S90FHI023.pdf

Description:: IC FLASH 256MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL256S90FHI023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used for boot code storage and firmware execution in industrial control systems.

For engineers reviewing the S29GL256S90FHI023 datasheet, S29GL256S90FHI023 pinout, S29GL256S90FHI023 application, or S29GL256S90FHI023 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65–VCC), OTP array, and AEC-Q100 Grade 3 qualification for automotive embedded use.

Technical Context

This device implements asynchronous parallel interface logic with dedicated CE#, OE#, and WE# control lines, supporting XIP-capable read operations and embedded program/erase algorithms managed by an on-chip Embedded Algorithm Controller (EAC). Its architecture enables page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command.

The flash array is organized into uniform 128 kB sectors, each individually erasable, and includes status register polling, RY/BY# pin signaling, and Advanced Sector Protection (ASP) with volatile/non-volatile lock options. The integrated 1024-byte OTP array supports two lockable regions for secure configuration or calibration data storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); sufficient for full boot image + firmware in resource-constrained microcontrollers
Random Access Time	90 ns at VCC = VIO; enables deterministic timing for real-time boot and interrupt vector fetch
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages during code execution
Write Buffer Size	512 bytes; reduces effective programming time vs. single-word writes by >8× in typical firmware updates
ECC Support	On-die hardware single-bit error correction; eliminates need for external ECC logic in safety-critical systems
Endurance & Retention	100,000 program/erase cycles / 20-year data retention; meets long-lifecycle requirements for industrial gateways
Operating Temperature	–40°C to +85°C (Industrial Grade); validated for deployment in uncontrolled ambient environments

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit address bus; A22 is MSB for 256 Mb density (2²³ × 16-bit = 32 MB)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports word-aligned reads/writes only
CE#	Chip Enable	Active-low enable for device selection; controls power state and command latching
OE#	Output Enable	Active-low control for data bus output drivers; used during read operations
WE#	Write Enable	Active-low strobe for write command and data capture; initiates program/erase sequences
RY/BY#	Ready/Busy	Open-drain status indicator; low = operation in progress, high = ready/completed
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations
VCC	Core Supply	2.7–3.6 V main supply for core logic, array, and internal voltage generators
VIO	I/O Supply	1.65–VCC versatile I/O voltage; decouples interface level from core voltage for mixed-signal SoC interfacing

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse technology	Enables higher density and lower active current vs. legacy 90 nm NOR, reducing thermal load in sealed enclosures
Asynchronous 32-byte page read	Minimizes instruction fetch latency during XIP execution without requiring burst-mode controller support
1024-byte OTP array with dual lock regions	Allows permanent storage of unique device identifiers and calibrated sensor offsets, with independent locking per region
Common Flash Interface (CFI) table	Enables automatic detection and configuration by bootloader firmware without hard-coded timing or geometry parameters
Suspend/resume for program & erase	Permits high-priority interrupt service during long-duration flash operations without data corruption risk

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency and deterministic sector erase for field updates.

Use Value: Eliminates external SRAM copy step during boot; 128 kB uniform sectors simplify update partitioning and reduce risk of partial erase failure.

Use Scenario: Holding boot code and safety-critical sensor fusion firmware in camera-based driver assistance modules.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified NOR flash serving as primary boot source with hardware ECC and OTP for calibration data.

Use Value: Meets ISO 26262 ASIL-B requirements via on-die ECC and 100K-cycle endurance, enabling safe over-the-air firmware recovery.

Medical Imaging System Configuration

Energy Meter Secure Parameter Storage

Use Scenario: Storing FPGA configuration bitstreams and calibration tables in portable ultrasound devices with strict power budget constraints.

IC Role / Device Role / Timing Role: Low-power (100 µA standby) parallel flash with Versatile I/O enabling direct interface to 1.8 V FPGA I/O banks.

Use Value: Reduces BOM count by eliminating level shifters; OTP regions store factory-calibrated transducer coefficients with irreversible lock.

Use Scenario: Retaining tariff schedules, metering constants, and cryptographic keys in smart electricity meters operating across wide temperature ranges.

IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) flash with ASP and OTP for tamper-resistant parameter storage and firmware versioning.

Use Value: Prevents unauthorized parameter modification via non-volatile sector locks; 20-year retention ensures lifetime data integrity without battery backup.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI020	Same density and timing, but uses 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option	Preferred for space-constrained PCB layouts where footprint reduction outweighs manual soldering complexity	Select when board area is critical and reflow capability exists for fine-pitch BGA
MX29GL256FHT2I-90G	Macronix part; identical 256 Mb, 90 ns, TSOP-56, but lacks OTP array and CFI compliance	Acceptable for cost-sensitive consumer applications where secure one-time programming is not required	Choose only if OTP and standardized CFI detection are excluded from system requirements

Compared with S29GL256P90TFI020 and MX29GL256FHT2I-90G, the S29GL256S90FHI023 uniquely combines TSOP-56 packaging, integrated OTP, CFI compliance, and AEC-Q100 Grade 3 qualification-making it the sole choice for automotive and industrial designs requiring field-upgradable secure boot with legacy-compatible footprint.

Availability

S29GL256S90FHI023 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S90FHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global manufacturing and R&D infrastructure.

The GL-S family targets high-reliability embedded systems needing XIP-capable, high-endurance NOR flash for boot code and firmware-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.

FAQ

Is S29GL256S90FHI023 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. While all are 256 Mb parallel NOR flash devices, S29GL256S90FHI023 uses a revised command set and timing model introduced with the GL-S generation. Pin assignments match TSOP-56 mechanical layout, but electrical behavior-including RY/BY# assertion timing and write buffer handling-differs. Migration requires firmware validation and may need PCB layout review for signal integrity under new AC specs.

Does this device support Quad SPI or other serial interfaces?

No. S29GL256S90FHI023 is strictly a parallel-interface NOR flash with 16-bit DQ bus and discrete CE#/OE#/WE# control lines. It does not implement SPI, QSPI, or any serial protocol. For serial NOR alternatives, consider Infineon's SEMPER™ family (e.g., S26KL/S26KS series), which offer different density, timing, and interface trade-offs.

What is the function of the STB pin on this device?

The STB (Strobe) pin is not present on S29GL256S90FHI023. It appears in the generic GL-S block diagram as a placeholder for future variants but is unconnected and unused in this TSOP-56 package. All functional pins are defined in Section 12.1 of the datasheet (001-98285 Rev. *U), and STB is omitted from the actual pin list for this ordering code.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP (One-Time Programmable) array consists of fuse-based cells. Once a byte is programmed (typically from FFh to any non-FFh value), it cannot be erased or rewritten. Each of the two lockable regions can be permanently secured via dedicated lock bits, preventing further writes-even under elevated voltage or special command sequences.

S29GL256S90FHI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (13x11)

S29GL256S90FHI023 FAQ

1.How can I place an order for S29GL256S90FHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90FHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90FHI023 reliable?

The price and inventory of S29GL256S90FHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90FHI023 is usually 5 days.

3.What payment methods are accepted for S29GL256S90FHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90FHI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90FHI023?

S29GL256S90FHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90FHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90FHI023?

For technical support, including S29GL256S90FHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90FHI023 requirements.

6.How does Aetrix verify that S29GL256S90FHI023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90FHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90FHI023 meets industry standards.

7.What is the process for return or replacement of S29GL256S90FHI023?

All S29GL256S90FHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90FHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90FHI023 part is unused and in its original packaging.

Return procedure for S29GL256S90FHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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