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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S90GHA010

Name: S29GL256S90GHA010
Brand: Infineon Technologies
SKU: S29GL256S90GHA010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90GHA010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL256S90GHA010.pdf

Description:: IC FLASH 256MBIT PARALLEL 56FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:1,976

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Product details

Overview

S29GL256S90GHA010 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates from a single 2.7–3.6 V supply, supports versatile I/O (1.65 V to VCC), and targets boot code storage in industrial microcontroller-based systems.

For engineers reviewing the S29GL256S90GHA010 datasheet, S29GL256S90GHA010 pinout, S29GL256S90GHA010 application, or S29GL256S90GHA010 equivalent, this device delivers deterministic XIP-capable read latency, sector-level erase control, OTP security features, and AEC-Q100 Grade 2 qualification for automotive infotainment and ADAS host firmware storage.

Technical Context

The S29GL256S90GHA010 implements an asynchronous parallel interface with ×16 data bus and word-aligned addressing (A0–A22). Its embedded algorithm controller (EAC) manages autonomous program/erase operations, including suspend/resume capability and status monitoring via RY/BY# pin, status register, or data polling.

It integrates a 512-byte write buffer enabling up to 256-word buffered programming, and features uniform 128-kbyte sectors with Advanced Sector Protection (ASP) supporting both volatile and non-volatile lock modes. The device includes a 1024-byte one-time-programmable (OTP) array split into two lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words - defines maximum firmware image size and address space footprint
Random access time	90 ns at VCC = VIO - enables direct execution from flash (XIP) without performance penalty in MCU boot sequences
Page access time	15 ns - accelerates sequential reads within 32-byte aligned pages during code fetch or table lookup
Erase endurance	100,000 program/erase cycles per sector - supports field firmware updates over product lifetime
Data retention	20 years at +85°C - ensures long-term reliability of stored boot code and calibration data
I/O voltage range	1.65 V to VCC - allows interoperability with mixed-voltage SoCs and simplifies level-shifting design
Operating temperature	–40°C to +105°C (Industrial Plus grade) - qualified for under-hood automotive and industrial edge controllers

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	Word-aligned address bus; A22 is MSB for 256 Mb (2M × 16) organization
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports byte/word writes and reads without external multiplexing
CE#	Chip enable	Active-low device selection; controls power state and enables internal timing for access initiation
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal state or timing
WE#	Write enable	Active-low control for write/program/erase command latching and data capture
RY/BY#	Ready/Busy indicator	Open-drain active-low signal reflecting internal operation status; used for hardware flow control
WP#	Write protect	Hardware sector protection override; disables program/erase when asserted low
VCC	Core supply	Single 2.7–3.6 V supply powering core logic, charge pumps, and ECC engine
VIO	I/O supply	Independent 1.65–VCC supply for interface buffers - decouples I/O voltage from core rail

Key Features

Feature	Design Value
Hardware ECC engine	On-die single-bit error correction with automatic detection - eliminates need for external ECC logic in safety-critical boot paths
512-byte programming buffer	Enables 256-word buffered writes - reduces effective programming time by >3× vs. single-word algorithms
Uniform 128-kB sectors	256 identical erase blocks - simplifies firmware partitioning and wear leveling implementation
Suspend/resume capability	Pauses active program or erase on command - enables real-time interrupt handling without data corruption risk
CFI-compliant interface	Standardized ID and parameter table accessible via read commands - enables generic flash driver reuse across platforms

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, CAN message tables, and boot loader in vehicle dashboard ECUs.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 90 ns read latency and AEC-Q100 Grade 2 qualification.

Use Value: Enables zero-latency startup and secure firmware updates via diagnostic port without external ECC ICs.

Use Scenario: Holding real-time OS kernel, motion control algorithms, and configuration parameters in programmable logic controllers.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 100,000 erase cycles and 20-year data retention at +85°C.

Use Value: Supports unattended operation over 15+ years with field-upgradable firmware and sector-level protection against accidental overwrite.

Medical Imaging Boot Memory

Avionics Display System

Use Scenario: Hosting certified boot ROM and FPGA configuration bitstreams in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure, radiation-tolerant (tested per AEC-Q100) flash with OTP lockable regions for regulatory compliance data.

Use Value: Meets IEC 62304 Class C software requirements through hardware-enforced write protection and ECC integrity checking.

Use Scenario: Storing flight-critical display firmware and font assets in cockpit multifunction displays (MFDs).

IC Role / Device Role / Timing Role: High-availability parallel flash with RY/BY# hardware handshaking and suspend/resume for deterministic interrupt response.

Use Value: Guarantees <100 ns worst-case read access during HUD rendering while supporting DO-178C certifiable update mechanisms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI010	Same density and timing, but 64-ball LAE FBGA (9 mm × 9 mm); no TSOP option; higher pin count increases PCB routing complexity	Targeted at space-constrained automotive modules where board area is prioritized over assembly cost	Select when footprint reduction outweighs TSOP rework compatibility and thermal dissipation needs
MX29GL256FHT2I-90G	256 Mb parallel NOR, 90 ns access, but lacks integrated ECC and OTP array; requires external error management	Used in cost-sensitive industrial gateways where firmware integrity is managed in software	Choose only if ECC and secure OTP are not required, and BOM cost is primary constraint

Compared with S29GL256P90TFI010, the TSOP package offers easier rework and better thermal performance; compared with MX29GL256FHT2I-90G, the hardware ECC and OTP provide built-in functional safety and secure provisioning - critical for ISO 26262 and IEC 62443 compliance.

Availability

S29GL256S90GHA010 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot systems, and avionics display firmware requiring stable component supply, long-lifecycle support, and AEC-Q100 qualification.

Supply support for S29GL256S90GHA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and automotive-grade qualification expertise.

The GL-S family targets embedded systems needing deterministic XIP performance, robust firmware storage, and functional safety features - designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.

FAQ

Does S29GL256S90GHA010 support execute-in-place (XIP) operation?

Yes. With 90 ns random access time and asynchronous parallel interface, it enables direct CPU instruction fetch without copying to RAM. The 32-byte page mode (15 ns subsequent reads) further optimizes sequential code execution, making it suitable for ARM Cortex-M and Power Architecture boot loaders.

What is the function of the VIO pin, and can it be tied to VCC?

VIO supplies the I/O buffer voltage independently from VCC. It supports 1.65 V to VCC, allowing interfacing with 1.8 V or 3.3 V SoCs while VCC remains at 3.0 V. Tying VIO to VCC is valid and commonly used in 3.3 V systems, but decoupling enables mixed-voltage designs without level shifters.

How does the hardware ECC work, and is it configurable?

The ECC engine automatically detects and corrects single-bit errors during read operations using Hamming code. It is always enabled and non-configurable - no software initialization or register setting is required. Uncorrectable multi-bit errors trigger status flag assertion, enabling system-level error logging or fail-safe shutdown.

Is the 1024-byte OTP array truly one-time programmable?

Yes. Each of the two 512-byte OTP regions can be permanently locked after programming. Once locked, bits cannot be altered or erased. This provides tamper-resistant storage for cryptographic keys, calibration coefficients, or device serial numbers - verified by Infineon's AEC-Q100 stress testing and data retention validation.

S29GL256S90GHA010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL256S90GHA010 FAQ

1.How can I place an order for S29GL256S90GHA010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90GHA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90GHA010 reliable?

The price and inventory of S29GL256S90GHA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90GHA010 is usually 5 days.

3.What payment methods are accepted for S29GL256S90GHA010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90GHA010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90GHA010?

S29GL256S90GHA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90GHA010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90GHA010?

For technical support, including S29GL256S90GHA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90GHA010 requirements.

6.How does Aetrix verify that S29GL256S90GHA010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90GHA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90GHA010 meets industry standards.

7.What is the process for return or replacement of S29GL256S90GHA010?

All S29GL256S90GHA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90GHA010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90GHA010 part is unused and in its original packaging.

Return procedure for S29GL256S90GHA010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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