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Infineon Technologies S29GL256S90GHI010

Name: S29GL256S90GHI010
Brand: Infineon Technologies
SKU: S29GL256S90GHI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90GHI010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL256S90GHI010.pdf

Description:: IC FLASH 256MBIT PARALLEL 56FBGA

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Product details

Overview

S29GL256S90GHI010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC using 65 nm MIRRORBIT™ Eclipse technology, with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It integrates hardware ECC for single-bit correction, 128 kB uniform sector erase, and supports industrial temperature range (–40°C to +85°C) in 56-pin TSOP package.

For engineers reviewing the S29GL256S90GHI010 datasheet, S29GL256S90GHI010 pinout, S29GL256S90GHI010 application, or S29GL256S90GHI010 equivalent, this device delivers deterministic XIP-capable read performance, robust sector-level protection, and buffer-programming efficiency critical for boot code storage and firmware update in automotive ECUs and industrial controllers.

Technical Context

This parallel NOR flash implements asynchronous interface timing with CE#, OE#, and WE# control signals, supporting both standard word programming and 512-byte buffer programming. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status reporting via status register, data polling, and RY/BY# pin, and includes suspend/resume capability for multi-tasking environments.

The device features Versatile I/O (VIO) allowing I/O voltage from 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention, while the CFI parameter table enables runtime configuration detection by host firmware.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers
Random Access Time	90 ns at VCC = VIO; enables sub-11 MHz synchronous bus interface timing
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages
Programming Buffer	512 bytes; reduces average programming time by up to 4× vs. single-word writes
ECC Support	Internal hardware single-bit error correction; eliminates need for external ECC logic or SW overhead
Endurance	100,000 program/erase cycles per sector; suitable for field-updatable firmware with >10-year service life
Data Retention	20 years at +85°C; validated for automotive underhood and industrial control cabinet deployment

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, 0.5 mm pitch, JEDEC MO-141AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit address bus supporting 8-Mword (32 MB) linear space; A22 is MSB for 256 Mb density
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO (1.65–3.6 V) independent of VCC
CE#	Chip enable	Active-low device select; controls power state entry and timing reference for tCE access
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal state or timing
WE#	Write enable	Active-low write strobe; initiates command latching and embedded program/erase sequences
RY/BY#	Ready/Busy indicator	Open-drain active-low status pin; asserts low during program/erase, high when ready
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations
WP#	Write protect	Active-low hardware sector lock; disables program/erase on protected sectors regardless of software commands

Key Features

Feature	Design Value
65 nm MIRRORBIT™ Eclipse process	Enables higher density and lower leakage vs. older 90 nm NOR, reducing standby current to 100 µA
Asynchronous 32-byte page read	Delivers burst-like throughput without clock signal-ideal for legacy bus interfaces and FPGA glue logic
Separate 1024-byte OTP array	Provides secure storage for keys, calibration data, or device-specific identifiers with dual lockable regions
Advanced Sector Protection (ASP)	Supports volatile (power-on default) and non-volatile (permanent) locking per 128 kB sector
Common Flash Interface (CFI)	Enables automatic driver initialization and runtime parameter discovery without hard-coded timing constants

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing boot loader and calibrated engine maps in diesel ECU with AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code execution memory with deterministic 90 ns read latency and ECC-protected integrity.

Use Value: Ensures fail-safe boot and real-time map access under thermal stress (–40°C to +105°C), meeting ISO 26262 ASIL-B requirements.

Use Scenario: Holding firmware and configuration data for modular programmable logic controllers in factory automation cabinets.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 100,000-cycle endurance and sector-level write protection against accidental overwrite.

Use Value: Enables field firmware updates without downtime; ASP and OTP prevent unauthorized modification of safety-critical logic blocks.

Medical Diagnostic Imaging Boot ROM

Avionics Data Recorder Memory

Use Scenario: Secure boot ROM for MRI subsystem controller requiring certified data retention and tamper resistance.

IC Role / Device Role / Timing Role: Trusted code storage with hardware ECC, OTP lock, and 20-year data retention at +85°C.

Use Value: Eliminates need for external checksum validation; OTP region stores cryptographic keys used during secure boot handshake.

Use Scenario: Non-volatile memory for flight data recorder (FDR) modules capturing sensor telemetry across extended mission durations.

IC Role / Device Role / Timing Role: Radiation-tolerant (tested per AEC-Q100) parallel flash with suspend/resume during power transients.

Use Value: Guarantees uninterrupted logging during voltage dips; sector erase allows cyclic overwrite of oldest data without full chip erase.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI010	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option; identical timing and feature set	Preferred for space-constrained PCBs where fine-pitch BGA routing is acceptable	Select when board layout favors BGA over TSOP and thermal profile permits reflow-compatible packaging
MX29GL256FHT2I-90G	Macronix 256 Mb parallel NOR; 90 ns access, but lacks integrated hardware ECC and OTP array	Requires external ECC handling and software-managed protection; lower cost but higher system integration effort	Choose only if ECC and OTP are not required, and BOM cost reduction outweighs firmware development overhead

Compared with S29GL256P90TFI010, the TSOP package offers easier prototyping and rework; versus MX29GL256FHT2I-90G, the Infineon part delivers verified ECC and OTP security out-of-box-reducing qualification time for safety-critical systems.

Availability

S29GL256S90GHI010 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging boot ROM applications requiring stable component supply and long-term lifecycle support.

Supply support for S29GL256S90GHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

The GL-S family targets embedded systems needing deterministic XIP performance, robust data integrity, and automotive-grade reliability-designed specifically for boot code, firmware, and configuration storage in harsh environments.

FAQ

Does S29GL256S90GHI010 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with deterministic 90 ns random access and 15 ns page-mode reads, enabling direct CPU instruction fetch from flash without RAM copy. Its asynchronous interface and fast initial access make it suitable for ARM Cortex-M and Power Architecture-based boot loaders.

What is the function of the STB pin on S29GL256S90GHI010?

The STB (Standby) pin is not present on the S29GL256S90GHI010. This TSOP variant uses CE# for power-down control; standby mode is entered when CE# is deasserted, reducing current to 100 µA. The STB signal appears only on certain BGA variants for enhanced power sequencing control.

Can the OTP array be reprogrammed after locking?

No. Once either of the two 512-byte OTP lock bits is set via the CFI command sequence, that region becomes permanently read-only. The lock is irreversible and survives power cycles, resets, and reprogramming attempts-ensuring cryptographic key or calibration data immutability.

Is hardware reset (RESET#) required during power-up?

Yes. RESET# must be held low for ≥100 ns after VCC reaches 2.7 V to ensure proper internal initialization and avoid undefined command behavior. A dedicated RC reset circuit or supervisor IC is recommended to meet this requirement across temperature and voltage corners.

S29GL256S90GHI010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL256S90GHI010 FAQ

1.How can I place an order for S29GL256S90GHI010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90GHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90GHI010 reliable?

The price and inventory of S29GL256S90GHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90GHI010 is usually 5 days.

3.What payment methods are accepted for S29GL256S90GHI010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90GHI010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90GHI010?

S29GL256S90GHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90GHI010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90GHI010?

For technical support, including S29GL256S90GHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90GHI010 requirements.

6.How does Aetrix verify that S29GL256S90GHI010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90GHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90GHI010 meets industry standards.

7.What is the process for return or replacement of S29GL256S90GHI010?

All S29GL256S90GHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90GHI010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90GHI010 part is unused and in its original packaging.

Return procedure for S29GL256S90GHI010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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