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Infineon Technologies S29GL256S90GHI020

Name: S29GL256S90GHI020
Brand: Infineon Technologies
SKU: S29GL256S90GHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90GHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL256S90GHI020.pdf

Description:: IC FLASH 256MBIT PARALLEL 56FBGA

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Product details

Overview

S29GL256S90GHI020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), 16-bit data bus, and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL256S90GHI020 datasheet, S29GL256S90GHI020 pinout, S29GL256S90GHI020 application, or S29GL256S90GHI020 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, 128 kB uniform sector erase granularity, OTP array security, CFI compliance, and Versatile I/O support (1.65 V–VCC).

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention. It supports page-mode read (32-byte aligned pages), buffer programming of up to 512 bytes per command, and suspend/resume for both program and erase cycles.

The architecture includes dedicated status register, data polling, and RY/BY# pin for real-time operation monitoring. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, and the 1024-byte OTP array is split into two independently lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words - enables full firmware image storage for mid-tier microcontrollers.
Random access time (tACC)	90 ns at VCC = VIO - ensures deterministic boot latency in XIP-capable systems.
Page access time (tPACC)	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages.
Programming buffer size	512 bytes - reduces host overhead by batching writes; achieves 1.5 MBps effective write rate.
Erase block size	Uniform 128 kB sectors - simplifies firmware update partitioning and wear leveling logic.
Data retention	20 years - guarantees long-term reliability in unattended industrial deployments.
Endurance	100,000 program/erase cycles - supports frequent field firmware updates over product lifetime.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), RoHS-compliant, lead-free, JEDEC MO-141AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A22	Address inputs	23-bit address bus supporting 2,097,152 word locations (A22 = MSB); word-aligned only.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports Versatile I/O (VIO = 1.65 V to VCC).
CE#	Chip enable	Active-low device select; controls power state entry/exit and enables multi-device decoding.
OE#	Output enable	Active-low read strobe; gates output drivers during asynchronous read cycles.
WE#	Write enable	Active-low control for write/program/erase command latching and data capture.
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operation (low = busy); used for polling or interrupt-driven flow control.
RESET#	Hardware reset	Active-low asynchronous reset that aborts ongoing operations and returns device to read mode.
WP#	Write protect	Active-low hardware lock for top/bottom sectors; complements software-based ASP protection.

Key Features

Feature	Design Value
Hardware ECC engine	On-die single-bit error correction with automatic detection - eliminates need for external ECC logic in safety-critical boot paths.
Asynchronous page-mode read	32-byte aligned page access with 15 ns intra-page timing - improves instruction throughput in XIP execution without cache dependency.
512-byte programming buffer	Reduces host command overhead by 90% vs. single-word programming - critical for fast firmware patching in production test environments.
Advanced sector protection (ASP)	Volatile and non-volatile lock modes per 128 kB sector - enables flexible, field-updatable security policies for bootloader and parameter partitions.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables OS/driver auto-configuration without hard-coded timing or geometry assumptions.

Applications

Industrial HMI Boot Storage

Network Edge Router Firmware

Use Scenario: Storing boot loader and kernel image in fanless, sealed industrial HMIs operating continuously at 70°C ambient.

IC Role / Device Role / Timing Role: Primary non-volatile XIP-capable code storage with deterministic 90 ns read latency and 20-year data retention.

Use Value: Eliminates external SRAM buffering and reduces BOM count by enabling direct CPU instruction fetch from flash.

Use Scenario: Holding dual-image firmware for fail-safe OTA updates in carrier-grade edge routers with hot-swap power supplies.

IC Role / Device Role / Timing Role: Dual-bank firmware repository supporting atomic sector erase and suspend/resume during power transitions.

Use Value: Enables zero-downtime firmware rollback using 128 kB uniform sectors and hardware WP#-protected bootloader region.

Automotive Instrument Cluster

Medical Diagnostic Device

Use Scenario: Storing calibrated display assets and safety-critical UI logic in AEC-Q100 Grade 3 instrument clusters (–40°C to +85°C).

IC Role / Device Role / Timing Role: Secure, high-reliability code storage with OTP-configurable calibration offsets and ASP-locked safety partitions.

Use Value: Meets ASIL-B functional safety requirements via hardware ECC, 100K-cycle endurance, and lockable OTP region for calibration data.

Use Scenario: Hosting FDA-cleared diagnostic firmware and regulatory audit logs in portable ultrasound devices requiring traceable firmware revisions.

IC Role / Device Role / Timing Role: Tamper-resistant firmware vault with CFI-identified geometry and dual-lock OTP for revision-stamped configuration records.

Use Value: Supports 21 CFR Part 11 compliance through hardware-enforced write protection and immutable OTP version metadata.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S90TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package - no TSOP footprint compatibility.	Used where board space is constrained and reflow assembly is preferred over wave soldering.	Select when PCB layout prioritizes compactness and thermal performance over legacy TSOP socket compatibility.
MX29GL256FHT2I-90G	Macronix part; 90 ns tACC but lacks hardware ECC and OTP array - requires external error handling and configuration storage.	Suitable for cost-sensitive consumer gateways where ECC is managed in software and security is not mandated.	Choose only if system-level ECC implementation is already in place and OTP functionality is unnecessary.

Compared with S29GL256S90GHI020, the TSOP-packaged Infineon variant offers guaranteed hardware ECC and OTP security out-of-box, while the LAE BGA alternative trades footprint for thermal efficiency, and the Macronix option sacrifices on-die reliability features for lower unit cost.

Availability

S29GL256S90GHI020 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, automotive instrument cluster code storage, and medical diagnostic device firmware requiring stable component supply across extended lifecycle programs.

Supply support for S29GL256S90GHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems needing deterministic XIP performance, robust data integrity, and long-term firmware storage - designed specifically for industrial, automotive, and medical applications demanding AEC-Q100 qualification and 20-year retention.

FAQ

Does S29GL256S90GHI020 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation with 90 ns random access time and 15 ns page-mode timing. The device delivers full 16-bit words on every read cycle without internal prefetch or caching, enabling direct CPU instruction fetch from flash address space without intermediate RAM buffering.

What is the function of the RY/BY# pin, and how should it be interfaced?

RY/BY# is an open-drain ready/busy indicator: low during active program/erase operations, high when idle or ready for next command. It must be pulled up externally (typically 4.7 kΩ to VIO) and can drive interrupts or be polled via GPIO. It does not require clocking and operates asynchronously with all command sequences.

How is the 1024-byte OTP array structured and accessed?

The OTP array is a separate 1024-byte region divided into two 512-byte lockable blocks. It is accessed via standard CFI query and specific unlock-bypass commands. Once locked (via dedicated OTP lock command), each block becomes permanently read-only - used for storing calibration data, MAC addresses, or firmware version stamps.

Can S29GL256S90GHI020 operate with VIO = 1.8 V while VCC = 3.3 V?

Yes, the Versatile I/O feature explicitly supports VIO from 1.65 V to VCC. At VIO = 1.8 V and VCC = 3.3 V, all input thresholds and output drive levels comply with 1.8 V logic families, enabling seamless interfacing with low-voltage FPGAs or ASICs while maintaining full 3.3 V core functionality and timing specs.

S29GL256S90GHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL256S90GHI020 FAQ

1.How can I place an order for S29GL256S90GHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90GHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90GHI020 reliable?

The price and inventory of S29GL256S90GHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90GHI020 is usually 5 days.

3.What payment methods are accepted for S29GL256S90GHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90GHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90GHI020?

S29GL256S90GHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90GHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90GHI020?

For technical support, including S29GL256S90GHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90GHI020 requirements.

6.How does Aetrix verify that S29GL256S90GHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90GHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90GHI020 meets industry standards.

7.What is the process for return or replacement of S29GL256S90GHI020?

All S29GL256S90GHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90GHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90GHI020 part is unused and in its original packaging.

Return procedure for S29GL256S90GHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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