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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S90TFA010

Name: S29GL256S90TFA010
Brand: Infineon Technologies
SKU: S29GL256S90TFA010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90TFA010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S90TFA010.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

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Product details

Overview

S29GL256S90TFA010 from Infineon is a 256 Mb (32 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 90 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) for read/program/erase - deployed in industrial embedded systems for firmware storage and boot code execution.

For engineers reviewing the S29GL256S90TFA010 datasheet, S29GL256S90TFA010 pinout, S29GL256S90TFA010 application, or S29GL256S90TFA010 equivalent, key selection criteria include asynchronous 16-bit interface timing, 128 kB uniform sector erase, internal hardware ECC for single-bit correction, OTP array support, and AEC-Q100 Grade 3 qualification for automotive control modules.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard random reads and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations, status monitoring via RY/BY# pin or status register, and automatic ECC generation/correction during read cycles.

The flash array is organized into uniform 128 kB sectors, each individually erasable, with advanced sector protection (ASP) enabling volatile and non-volatile lock settings per sector. It includes a dedicated 1024-byte one-time-programmable (OTP) array split into two lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-complexity microcontrollers.
Random Access Time	90 ns at VCC = VIO; enables fast XIP execution without external cache penalty.
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages for burst instruction fetch.
Programming Buffer	512 bytes; reduces effective programming time by batching up to 256 words per command.
ECC Support	Internal hardware single-bit error correction; eliminates need for external ECC logic in safety-critical boot paths.
Endurance & Retention	100,000 program/erase cycles and 20-year data retention; suitable for field-upgradable industrial firmware.
Operating Temp	–40°C to +85°C (Industrial Grade); validated for use in motor control, HMI, and gateway ECUs.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with legacy flash socket designs and automated PCB assembly.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density (max address = 0x1FFFFFF).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads without external multiplexing.
CE#	Chip Enable	Active-low enable controlling device selection; tCE = 90 ns max defines minimum chip select assertion window.
OE#	Output Enable	Active-low read strobe; tOE = 25 ns max governs output valid delay after OE# assertion.
WE#	Write Enable	Active-low write strobe; initiates command latching or data programming when CE# and OE# are inactive.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded program/erase, high when operation complete or ready for next command.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into reading state and clears internal command registers.
VCC	Core Supply	3.0 V ±0.3 V supply for core logic and array; supports single-supply system design with no VPP requirement.
VIO	I/O Supply	1.65 V to VCC; enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.

Key Features

Feature	Design Value
Versatile I/O Voltage Range	VIO supports 1.65 V–3.6 V, allowing seamless integration with mixed-voltage SoCs and FPGAs without external voltage translation.
Uniform 128 kB Sector Architecture	Enables precise firmware partitioning (e.g., bootloader, app, config) with independent erase control and protection per sector.
Hardware ECC Engine	On-the-fly single-bit error correction during read cycles eliminates software overhead and improves boot reliability in noisy environments.
512-Byte Programming Buffer	Reduces average programming time by >4× vs. single-word writes, critical for field firmware updates over constrained interfaces.
Secure OTP Array	1024-byte one-time-programmable region with dual lock bits enables secure storage of keys, calibration data, or device-specific identifiers.

Applications

Automotive Engine Control Unit (ECU)

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in AEC-Q100 Grade 3 qualified ECU modules.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency and ECC-protected integrity.

Use Value: Ensures deterministic boot timing and immunity to bit flips during vehicle vibration or EMI exposure.

Use Scenario: Holding ladder logic firmware, I/O configuration tables, and safety-critical runtime parameters in DIN-rail mounted PLCs.

IC Role / Device Role / Timing Role: Parallel NOR flash serving as primary firmware store with sector-level erase for modular firmware updates.

Use Value: Enables field updates without full reflash; 128 kB sector granularity allows patching only modified logic blocks.

Medical Imaging System Boot ROM

Telecom Base Station Configuration Memory

Use Scenario: Hosting boot loader and FPGA configuration bitstreams in Class II medical imaging devices requiring 20-year data retention.

IC Role / Device Role / Timing Role: High-reliability firmware storage with hardware ECC and 100K-cycle endurance for infrequent but mission-critical updates.

Use Value: Meets IEC 62304 traceability requirements through OTP-secured version stamps and sector-lockable update partitions.

Use Scenario: Storing radio calibration profiles, protocol stacks, and regulatory compliance settings across multi-band 4G/5G base station radios.

IC Role / Device Role / Timing Role: Asynchronous parallel flash used for fast read-access to configuration data during RF initialization sequences.

Use Value: 15 ns page-mode reads accelerate radio bring-up; Versatile I/O supports direct connection to 1.8 V FPGA configuration controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256P90TFI010	Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option.	Preferred for space-constrained PCBs where board area is prioritized over socket-based serviceability.	Select when footprint miniaturization outweighs need for socket replacement or manual rework.
MX29GL256FHI-90G	Macronix part with identical 256 Mb density, 90 ns access, and 128 kB sectors; lacks OTP array and ASP flexibility.	Suitable for cost-sensitive consumer applications where secure configuration storage is not required.	Choose for non-safety-critical designs needing lower unit cost and basic feature parity.

Compared with S29GL256P90TFI010, this TSOP variant offers mechanical serviceability and thermal performance advantages; versus MX29GL256FHI-90G, it delivers stronger security and configurability for regulated industrial and automotive deployments.

Availability

S29GL256S90TFA010 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging system boot ROM replacements requiring stable component supply and long-term lifecycle assurance.

Supply support for S29GL256S90TFA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems requiring deterministic boot, field-upgradable firmware, and AEC-Q100-compliant non-volatile storage - optimized for automotive, industrial, and medical applications demanding ECC, OTP, and sector-level protection.

FAQ

Is S29GL256S90TFA010 pin-compatible with earlier S29GL256N or S29GL256P variants?

No. While functionally similar, S29GL256S90TFA010 uses a 56-pin TSOP package with specific pin assignments for VIO, RY/BY#, and RESET# that differ from the 56-pin TSOP layout of S29GL256N and the 64-ball BGA of S29GL256P. Direct substitution requires PCB redesign and signal routing validation.

Does this device support Common Flash Interface (CFI) mode for auto-detection?

Yes. The device implements a full CFI parameter table accessible via standard command sequences (0x98 at address 0x55). This enables host BIOS or bootloader auto-configuration of timing, density, and sector map without hard-coded driver assumptions.

What is the maximum sustained programming throughput using the 512-byte buffer?

At rated 90 ns timing, the device achieves up to 1.5 MBps effective programming rate for 512-byte buffer writes. This assumes optimal command sequencing and no inter-buffer delays; actual throughput in system context depends on host bus arbitration and wait-state insertion.

Can the OTP array be reprogrammed after initial lock?

No. Once either OTP lock bit is set (via specific unlock-and-write sequence), that 512-byte region becomes permanently read-only. The second lock bit operates independently, allowing staged provisioning - e.g., lock first region for device ID, second for calibration data - but neither can be unlocked after programming.

S29GL256S90TFA010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S90TFA010 FAQ

1.How can I place an order for S29GL256S90TFA010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90TFA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90TFA010 reliable?

The price and inventory of S29GL256S90TFA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90TFA010 is usually 5 days.

3.What payment methods are accepted for S29GL256S90TFA010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90TFA010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90TFA010?

S29GL256S90TFA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90TFA010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90TFA010?

For technical support, including S29GL256S90TFA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90TFA010 requirements.

6.How does Aetrix verify that S29GL256S90TFA010 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90TFA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90TFA010 meets industry standards.

7.What is the process for return or replacement of S29GL256S90TFA010?

All S29GL256S90TFA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90TFA010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90TFA010 part is unused and in its original packaging.

Return procedure for S29GL256S90TFA010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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