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Infineon Technologies S29GL256S90TFA020
- Part No.:
- S29GL256S90TFA020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S90TFA020.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,763
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Product details
Overview
S29GL256S90TFA020 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 90 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial microcontroller systems.
For engineers reviewing the S29GL256S90TFA020 datasheet, S29GL256S90TFA020 pinout, S29GL256S90TFA020 application, or S29GL256S90TFA020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supports both standard and page-mode reads, and uses embedded algorithms for sector erase and buffer programming. Its internal state machine handles command execution without external timing control.
The integrated ECC engine operates transparently during read cycles, correcting single-bit errors in real time using dedicated hardware-no software overhead. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a separate 1024-byte OTP array with dual lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-range MCUs |
| Random Access Time | 90 ns at VCC = VIO; enables fast XIP execution from flash without cache penalty |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes; reduces average program time by batching up to 256 words per operation |
| Erase Granularity | 128 kB uniform sectors; balances flexibility and endurance for field firmware updates |
| Endurance & Retention | 100,000 program/erase cycles / 20 years data retention; suitable for long-life industrial deployments |
| I/O Voltage Range | VIO = 1.65–3.6 V; permits direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
| Operating Temperature | –40°C to +105°C (AEC-Q100 Grade 2); qualified for under-hood automotive and high-temp industrial use |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus; A23 is MSB for 256 Mb density (max address = 0x1FFFFFF) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-wide transfers only |
| CE# | Chip Enable | Active-low enable; controls device selection in multi-chip memory maps |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write Enable | Active-low write strobe; initiates program/erase commands and data latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into reading state and clears internal state |
| VCC | Core Supply | 2.7–3.6 V core and I/O supply; single-rail simplifies power design |
| VIO | I/O Supply | 1.65–3.6 V; independent of VCC in Versatile I/O mode for mixed-voltage systems |
| WP# | Write Protect | Hardware sector protection enable; active-low input for permanent or temporary lock |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC Engine | Single-bit error correction on every read cycle-no CPU intervention required, improves system reliability |
| 512-Byte Programming Buffer | Enables 1.5 MBps effective programming rate; cuts firmware update time vs. byte-by-byte writes |
| Uniform 128-kB Sectors | Allows precise, predictable erase boundaries for modular firmware partitioning and OTA updates |
| Suspend/Resume Commands | Pauses active erase or program operations to service high-priority reads-critical for real-time responsiveness |
| Separate 1024-Byte OTP Array | Two lockable regions store immutable keys, calibration data, or security credentials with hardware write-lock |
| Common Flash Interface (CFI) | Standardized parameter table enables automatic driver detection and configuration in bootloader environments |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤90 ns latency. Use Value: Eliminates need for external SRAM copy; supports deterministic startup and field firmware upgrades via 128 kB sector erase. | Use Scenario: Holding safety-critical boot code and sensor calibration data in radar control units operating at 105°C ambient. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot source for SoC initialization. Use Value: Hardware ECC ensures integrity of boot instructions; OTP region secures calibration parameters against tampering. |
| Medical Imaging System Configuration | Telecom Base Station Firmware |
Use Scenario: Storing FPGA configuration bitstreams and device-specific calibration tables in portable ultrasound equipment. IC Role / Device Role / Timing Role: High-reliability firmware storage with 20-year data retention and 100k-cycle endurance. Use Value: Supports regulatory compliance for long-lifecycle medical devices; OTP array stores factory-trimmed analog offsets. | Use Scenario: Hosting field-upgradable protocol stacks and DSP firmware in carrier-grade wireless infrastructure. IC Role / Device Role / Timing Role: Parallel flash with suspend/resume capability enabling concurrent diagnostics and firmware patching. Use Value: Minimizes service downtime during remote updates; CFI support simplifies driver integration across multiple baseband platforms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P90TFI020 | Same density and timing, but Industrial grade (–40°C to +85°C); lacks AEC-Q100 qualification | Not suitable for automotive under-hood use; lower cost for non-automotive embedded designs | Select when automotive temperature range and qualification are not required |
| MX29GL256FHI-90G | Micron part; identical 256 Mb density, 90 ns access, but uses different command set and lacks built-in ECC | Requires external ECC handling in software/firmware; no OTP array or ASP features | Choose only if legacy compatibility with Micron's GL series is mandatory and ECC is managed externally |
Compared with S29GL256P90TFI020, this part adds AEC-Q100 Grade 2 qualification and extended temperature support; versus MX29GL256FHI-90G, it provides hardware ECC, OTP, and advanced sector protection-reducing firmware complexity and improving field reliability.
Availability
S29GL256S90TFA020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging systems, and telecom base stations requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S90TFA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The GL-S family targets high-reliability embedded systems needing fast, dense, and robust non-volatile code storage-designed specifically for boot memory, firmware update storage, and secure configuration in automotive and industrial applications.
FAQ
Does S29GL256S90TFA020 support execute-in-place (XIP) operation?
Yes. The device supports true XIP with ≤90 ns random access time and page-mode reads (15 ns), enabling direct instruction fetch by microcontrollers without copying to RAM. Its asynchronous interface and word-aligned addressing are optimized for zero-wait-state execution in real-time systems.
What is the function of the RY/BY# pin, and how is it used in system design?
RY/BY# is an open-drain ready/busy status output that goes low during internal program or erase operations and returns high when complete. It must be pulled up externally (typically 4.7 kΩ to VIO) and is used to synchronize host software or hardware wait states-eliminating need for polling or fixed delays.
Can the 1024-byte OTP array be reprogrammed after initial programming?
No. The OTP array consists of one-time-programmable fuses. Once a byte is written, it cannot be erased or rewritten. Each of the two lockable regions can be permanently secured via dedicated lock bits, preventing further writes-even during subsequent power cycles.
How does Versatile I/O (VIO) operation affect interface design with mixed-voltage processors?
VIO allows independent setting of I/O voltage (1.65–3.6 V) separate from core VCC (2.7–3.6 V). This enables direct connection to 1.8 V or 2.5 V microcontrollers without level shifters-provided VIO is configured to match the host's I/O rail, while VCC remains at 3.0 V for optimal core performance.
S29GL256S90TFA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S90TFA020 FAQ
1.How can I place an order for S29GL256S90TFA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90TFA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90TFA020 reliable?
The price and inventory of S29GL256S90TFA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90TFA020 is usually 5 days.
3.What payment methods are accepted for S29GL256S90TFA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90TFA020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90TFA020?
S29GL256S90TFA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90TFA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90TFA020?
For technical support, including S29GL256S90TFA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90TFA020 requirements.
6.How does Aetrix verify that S29GL256S90TFA020 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90TFA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90TFA020 meets industry standards.
7.What is the process for return or replacement of S29GL256S90TFA020?
All S29GL256S90TFA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90TFA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90TFA020 part is unused and in its original packaging.
Return procedure for S29GL256S90TFA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S90TFA020 Tags
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M24C02-WMN6TP
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