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Infineon Technologies S29GL256S90TFA023

Name: S29GL256S90TFA023
Brand: Infineon Technologies
SKU: S29GL256S90TFA023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90TFA023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S90TFA023.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL256S90TFA023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffered programming (512-byte write buffer), and uniform 128-kB sector erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL256S90TFA023 datasheet, S29GL256S90TFA023 pinout, S29GL256S90TFA023 application, or S29GL256S90TFA023 equivalent, key selection criteria include verified 90 ns tACC timing under VCC = VIO, support for Versatile I/O (1.65–3.6 V), OTP array lockability, CFI compliance, and AEC-Q100 grade 3 qualification status per ordering code suffix.

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling dual-bit-per-cell storage without sacrificing reliability. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability for both programming and erasing.

The flash uses word-aligned addressing (A0–A23), 32-byte page reads, and supports multiple protection modes: volatile/non-volatile sector protection, hardware WP#, and 1024-byte OTP array with two independently lockable regions - all accessible via standard CFI-compliant command set.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	256 Mb (32 MB), organized as 2,097,152 × 16-bit words - sufficient for full firmware images in resource-constrained embedded hosts.
Random access time (tACC)	90 ns at VCC = VIO - enables direct XIP execution from flash without external cache penalty in real-time control loops.
Page access time (tPACC)	15 ns - accelerates sequential instruction fetch within same 32-byte aligned page during burst execution.
Write buffer size	512 bytes (256 words) - reduces effective programming time by >3× vs. single-word writes in firmware update routines.
ECC capability	On-die single-bit error correction - eliminates need for external ECC logic in safety-critical boot memory paths.
Endurance & retention	100,000 program/erase cycles; 20-year data retention - meets long-lifecycle requirements for industrial gateways and medical devices.
Operating voltage	VCC = 2.7–3.6 V; VIO = 1.65–VCC - allows interoperability with mixed-voltage SoCs (e.g., 1.8 V I/O, 3.3 V core).
Temperature grade	Industrial (–40°C to +85°C) - validated for continuous operation in uncontrolled ambient environments like factory-floor PLCs.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, 0.5 mm pitch - compatible with standard reflow profiles and legacy PCB footprints.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address inputs	24-bit word-aligned address bus; A23 is MSB for 256 Mb density - no byte addressing; all accesses are 16-bit wide.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports Versatile I/O (1.65–3.6 V) - decouples I/O voltage from core VCC for mixed-signal SoC interfacing.
CE#	Chip enable	Active-low chip select; controls device power state - deassertion places flash in low-power standby (100 µA).
OE#	Output enable	Active-low read strobe; gates output drivers - used with CE# to implement asynchronous read timing (tOE = 25 ns max).
WE#	Write enable	Active-low write strobe; initiates command latching or data loading - required for all program/erase sequences.
RY/BY#	Ready/Busy indicator	Open-drain active-low status pin - asserts low during embedded operations (program/erase); enables hardware polling without register reads.
WP#	Hardware write protect	Active-low sector protection override - physically disables program/erase when asserted, independent of software locks.
RESET#	Hardware reset	Active-low asynchronous reset - forces device into known state and aborts ongoing operations; critical for safe recovery after brownout.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns cycle time - delivers sustained throughput up to 66.7 MBps for linear code execution.
512-byte write buffer	Single-command programming of up to 512 bytes - cuts firmware update time by minimizing command overhead and bus arbitration latency.
Hardware ECC engine	Transparent single-bit correction on every read - prevents silent corruption in boot ROM without software intervention or performance penalty.
Uniform 128-kB sectors	256 identical erase blocks - simplifies wear leveling and partitioning logic in bootloader implementations.
CFI-compliant interface	Standardized JEDEC ID-CFI table at known address - enables automatic detection and configuration by generic flash drivers in Linux/u-boot.
OTP array with dual lock	1024-byte one-time-programmable region split into two independently lockable sections - secures cryptographic keys and calibration data separately.

Applications

Industrial HMI Boot Memory

Network Edge Router Firmware Storage

Use Scenario: Stores boot loader and kernel image for ARM-based human-machine interface panels operating in factory environments with wide thermal swings.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 90 ns tACC.

Use Value: Eliminates need for external SRAM cache; supports rapid cold-start (<500 ms) due to fast page-mode read and CFI auto-configuration.

Use Scenario: Holds firmware and configuration tables for managed Ethernet switches deployed in telecom cabinets with limited airflow.

IC Role / Device Role / Timing Role: Firmware storage with field-upgradable partitions protected by hardware WP# and OTP-locked security keys.

Use Value: Enables secure over-the-air updates with atomic sector erase and built-in ECC - prevents bricking during power interruption.

Medical Diagnostic Device Code Storage

Automotive ADAS Camera Module Flash

Use Scenario: Retains certified diagnostic application code and calibration data in portable ultrasound units requiring 20-year data integrity.

IC Role / Device Role / Timing Role: Safety-critical code storage with AEC-Q100 grade 3 qualification and 100K-cycle endurance.

Use Value: Meets IEC 62304 Class C software requirements via on-die ECC, sector protection, and traceable 20-year retention.

Use Scenario: Stores camera ISP firmware and lens calibration parameters in automotive surround-view systems operating at 105°C junction.

IC Role / Device Role / Timing Role: Automotive-grade firmware memory qualified to AEC-Q100 grade 2 (–40°C to +105°C) with OTP-secured calibration data.

Use Value: Guarantees functional safety compliance through hardware-enforced write protection and lockable OTP regions for ASIL-B data.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S90TFI020	Same die, 56-ball VBU Fortified BGA (9 mm × 7 mm); 100 ns tACC; industrial grade (–40°C to +85°C)	Used where board space is constrained and BGA assembly is available; slightly slower access than TSOP variant	Select for high-density layouts needing footprint reduction; verify PCB reflow compatibility with 0.5 mm pitch balls.
MX29GL256FHT2I-90G	Macronix 256 Mb parallel NOR; 90 ns tACC; 3.0 V; no integrated ECC; CFI-compliant but lacks OTP array	Lower-cost alternative where external ECC or software-level error handling is acceptable	Choose when budget limits drive component cost sensitivity and system-level ECC is already implemented.

Compared with S29GL256S90TFA023, the Infineon VBU-packaged variant trades speed for compactness, while the Macronix part omits on-die ECC and OTP - making the TSOP version optimal for designs prioritizing guaranteed data integrity, ease of layout, and long-term firmware security.

Availability

S29GL256S90TFA023 is available at Aetrix Electronics and suitable for industrial HMI boot memory, network edge router firmware storage, medical diagnostic device code storage, and automotive ADAS camera module flash requiring stable component supply across extended product lifecycles.

Supply support for S29GL256S90TFA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.

The GL-S family targets high-reliability embedded systems requiring deterministic XIP performance, long-term data retention, and hardware-enforced security - designed specifically for boot code, firmware, and configuration storage in mission-critical devices.

FAQ

Does S29GL256S90TFA023 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation with 90 ns random access time and 15 ns page-mode read, enabling CPU instruction fetch directly from flash without copying to RAM. The device's asynchronous interface and deterministic timing meet real-time interrupt latency requirements in RTOS-based systems.

What is the function of the Versatile I/O (VIO) feature?

Versatile I/O allows independent voltage supply (1.65–3.6 V) for the DQ[15:0] bus, decoupling I/O signaling from the 3.0 V core supply. This enables seamless interfacing with 1.8 V or 2.5 V SoCs while maintaining full 3.0 V core performance and reliability.

How is sector protection implemented on this device?

Sector protection uses three methods: hardware WP# pin (global lock), software-controlled Advanced Sector Protection (ASP) with volatile/non-volatile bits per 128-kB sector, and OTP-based permanent locking. All methods prevent accidental program/erase without affecting read access or CFI queries.

Can the 1024-byte OTP array be reprogrammed after locking?

No - once either of the two OTP lock bits is set, the corresponding 512-byte region becomes permanently read-only. Locking is irreversible and requires specific unlock-bypass commands before programming; post-lock, only read access remains enabled for that region.

S29GL256S90TFA023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S90TFA023 FAQ

1.How can I place an order for S29GL256S90TFA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90TFA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90TFA023 reliable?

The price and inventory of S29GL256S90TFA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90TFA023 is usually 5 days.

3.What payment methods are accepted for S29GL256S90TFA023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90TFA023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90TFA023?

S29GL256S90TFA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90TFA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90TFA023?

For technical support, including S29GL256S90TFA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90TFA023 requirements.

6.How does Aetrix verify that S29GL256S90TFA023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90TFA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90TFA023 meets industry standards.

7.What is the process for return or replacement of S29GL256S90TFA023?

All S29GL256S90TFA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90TFA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90TFA023 part is unused and in its original packaging.

Return procedure for S29GL256S90TFA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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