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Infineon Technologies S29GL256S90TFI010
- Part No.:
- S29GL256S90TFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S90TFI010.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,597
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Product details
Overview
S29GL256S90TFI010 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with MIRRORBIT™ Eclipse 65 nm technology, 3.0 V core supply (2.7–3.6 V), 16-bit data bus, and industrial temperature grade (–40°C to +85°C). It delivers 90 ns random access time, 15 ns page access time, and integrates hardware ECC for single-bit error correction - used in boot code storage and firmware update storage for embedded controllers.
For engineers reviewing the S29GL256S90TFI010 datasheet, S29GL256S90TFI010 pinout, S29GL256S90TFI010 application, or S29GL256S90TFI010 equivalent, this device supports asynchronous XIP-capable read, sector-erase protection, OTP secure silicon region, CFI-compliant interface, and Versatile I/O (1.65–VCC) for mixed-voltage system integration.
Technical Context
This parallel NOR flash implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously using command sequences. It features 128 kB uniform sectors, suspend/resume capability for both program and erase, and status monitoring via status register, data polling, or RY/BY# pin.
The device uses a 32-byte page-aligned read architecture: initial access fetches a full 32-byte page in 90 ns; subsequent reads within the same page require only 15 ns by toggling low-order address bits. Programming employs a 512-byte write buffer supporting up to 256 words per operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 256 Mb (32 MB), organized as 2,097,152 × 16-bit words - defines maximum firmware image size and boot partition capacity. |
| Random access time (tACC) | 90 ns at VCC = VIO - enables direct execution from flash (XIP) in real-time microcontroller applications. |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch within a 32-byte aligned page during burst execution. |
| Write buffer size | 512 bytes (256 words) - reduces effective programming time vs. byte/word-by-word writes in firmware field updates. |
| ECC support | On-die hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot storage. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial control and automotive ECUs. |
| Operating temperature | –40°C to +85°C (Industrial grade) - qualified for deployment in factory automation and telecom infrastructure equipment. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 14 mm × 20 mm body, 0.5 mm lead pitch. Compatible with automated PCB assembly and legacy socket-based debug interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit word address bus (AMAX = A23); supports full 256 Mb addressing with 16-bit data alignment. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO (1.65–VCC) for flexible host interface voltage translation. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-chip memory expansion. |
| OE# | Output enable | Active-low read strobe; gates output drivers to prevent bus contention during shared-memory access. |
| WE# | Write enable | Active-low control for write/program/erase command latching; synchronizes command execution timing. |
| RY/BY# | Ready/Busy indicator | Open-drain status pin; low during embedded operations (program/erase), high when ready for next command. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| WP# | Write protect | Hardware sector protection enable; prevents accidental program/erase of protected sectors when asserted. |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent I/O voltage range (1.65 V to VCC) allows interfacing with 1.8 V, 2.5 V, or 3.3 V hosts without level shifters. |
| Asynchronous page-mode read | 32-byte page alignment enables 15 ns intra-page reads - improves instruction throughput in XIP-based MCU boot loaders. |
| 512-byte programming buffer | Reduces average programming time by >60% vs. single-word writes - critical for fast over-the-air firmware updates. |
| Advanced sector protection (ASP) | Volatile and non-volatile lock bits per 128 kB sector - supports secure bootloader partitioning and field-upgrade isolation. |
| Secure silicon region (OTP) | 1024-byte one-time-programmable array with two lockable regions - stores cryptographic keys or calibration data permanently. |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with 90 ns random access and sector-level write protection. Use Value: Ensures deterministic boot timing and immunity to power interruption during field updates due to hardware ECC and suspend/resume erase capability. |
Use Scenario: Holding certified bootloader and safety-critical application code in automotive engine control units compliant with AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Primary boot flash with 100,000-cycle endurance and 20-year data retention under thermal cycling (-40°C to +85°C). Use Value: Meets ISO 26262 ASIL-B requirements via on-die ECC, OTP key storage, and hardware write protection for immutable bootloader partition. |
| Telecom Base Station Configuration | Medical Imaging System BIOS |
|
Use Scenario: Storing FPGA configuration bitstreams and runtime configuration tables in 5G baseband units requiring rapid reconfiguration. IC Role / Device Role / Timing Role: High-reliability parallel flash with 512-byte buffer programming and CFI interface for standardized firmware management. Use Value: Enables sub-second field upgrades via buffered programming and avoids external ECC overhead through integrated single-bit correction. |
Use Scenario: Hosting BIOS and diagnostic self-test routines in FDA-cleared medical imaging devices where data integrity is mission-critical. IC Role / Device Role / Timing Role: Secure, long-retention firmware storage with OTP region for calibration constants and tamper-resistant sector locking. Use Value: Guarantees firmware authenticity and prevents unauthorized modification via hardware WP# and ASP lock bits, satisfying IEC 62304 software lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P90TFI010 | Same density and timing, but lacks Versatile I/O (fixed VIO = VCC); no 1.65–2.5 V support. | Not suitable for mixed-voltage systems requiring 1.8 V host interface. | Select only if host I/O matches 3.0 V and cost optimization outweighs voltage flexibility. |
| MX29GL256FHI-90G | Macronix equivalent; identical 90 ns tACC, 128 kB sectors, but no OTP array or ASP non-volatile lock mode. | Lacks secure key storage and persistent sector lockdown - insufficient for certified bootloader partitions. | Choose when basic firmware storage suffices and OTP/ECC robustness is not required. |
Compared with S29GL256P90TFI010, this part adds Versatile I/O for broader host compatibility; compared with MX29GL256FHI-90G, it provides OTP and non-volatile ASP for enhanced security - making it uniquely suited for safety-certified and mixed-voltage embedded designs.
Availability
S29GL256S90TFI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and telecom base station configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL256S90TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing XIP-capable, high-endurance parallel NOR flash with integrated ECC and secure silicon features - designed specifically for boot code integrity and long-term firmware storage in mission-critical applications.
FAQ
Is S29GL256S90TFI010 pin-compatible with earlier S29GL256N or S29GL256P variants?
No. S29GL256S90TFI010 uses a 56-pin TSOP package with specific pin assignments for Versatile I/O and RY/BY#, differing from the 56-pin TSOP layout of S29GL256N (no VIO) and S29GL256P (no RY/BY#). Pin mapping must be verified against the Rev. *U datasheet Figure 8-1 and Table 8-1.
Does this device support synchronous read or DDR interface modes?
No. S29GL256S90TFI010 is strictly asynchronous - all read operations use CE#, OE#, and address setup/hold timing per AC specifications. It does not implement clocked or double-data-rate interfaces; timing relies solely on static address valid windows and RY/BY# status signaling.
Can the OTP region be erased or rewritten after programming?
No. The 1024-byte OTP array is physically one-time programmable: once a bit is set to '0', it cannot be reset to '1'. Each of the two lockable regions can be permanently locked via dedicated command sequences, preventing further writes - intended for permanent key or calibration storage.
What is the minimum VIO voltage supported during read operations?
The minimum supported VIO is 1.65 V, as specified in the Versatile I/O feature. At VIO = 1.65 V, the device maintains full functionality including read access, status polling, and command execution - enabling interoperability with 1.8 V logic families while powered from a 3.0 V VCC supply.
S29GL256S90TFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S90TFI010 FAQ
1.How can I place an order for S29GL256S90TFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90TFI010 reliable?
The price and inventory of S29GL256S90TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90TFI010 is usually 5 days.
3.What payment methods are accepted for S29GL256S90TFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90TFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90TFI010?
S29GL256S90TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90TFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90TFI010?
For technical support, including S29GL256S90TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90TFI010 requirements.
6.How does Aetrix verify that S29GL256S90TFI010 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90TFI010 meets industry standards.
7.What is the process for return or replacement of S29GL256S90TFI010?
All S29GL256S90TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90TFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90TFI010 part is unused and in its original packaging.
Return procedure for S29GL256S90TFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S90TFI010 Tags
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M24C02-WMN6TP
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