Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29GL256S90TFI013

Part No.:
S29GL256S90TFI013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL256S90TFI013.pdf
Description:
IC FLASH 256MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,743

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29GL256S90TFI013 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C), used for code storage and XIP execution in embedded microcontroller boot systems.

For engineers reviewing the S29GL256S90TFI013 datasheet, S29GL256S90TFI013 pinout, S29GL256S90TFI013 application, or S29GL256S90TFI013 equivalent, key selection criteria include asynchronous 16-bit interface timing, on-chip ECC for single-bit correction, 128-kB uniform sector erase, OTP array support, and Versatile I/O voltage range (1.65 V to VCC).

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without host CPU intervention, using command sequences written to specific address/data latches. It supports both standard word programming and buffer programming of up to 512 bytes per operation.

The flash array uses 65 nm MIRRORBIT™ Eclipse technology with split-gate cells, enabling 100,000 program/erase cycles and 20-year data retention. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a dedicated 1024-byte OTP array with two lockable regions.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density256 Mb (32 MB), organized as 2,097,152 × 16-bit words
Random access time90 ns at VCC = VIO, enabling fast instruction fetch in XIP applications
Page access time15 ns for subsequent reads within same 32-byte aligned page
Programming buffer512-byte write buffer supporting burst programming to reduce effective write latency
ECC capabilityOn-die hardware ECC correcting single-bit errors per 512-byte sector
Operating voltageVCC: 2.7–3.6 V; VIO: 1.65 V to VCC - decouples I/O logic from core supply
Endurance & retention100,000 program/erase cycles; guaranteed 20-year data retention at 85°C

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 400 mil width, JEDEC MO-141AC compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A22Address inputs23-bit address bus supporting 256 Mb addressing (AMAX = A23)
DQ0–DQ15Data I/O16-bit bidirectional data bus; supports word-wide transfers only
CE#Chip enableActive-low chip select; controls device power state and command recognition
OE#Output enableActive-low control for data output drivers during read operations
WE#Write enableActive-low signal initiating write, program, or erase command latching
RY/BY#Ready/Busy indicatorOpen-drain output signaling active embedded operation (low = busy)
RESET#Hardware resetActive-low input forcing device into known initial state; resets internal state machine
VCCCore supply3.0 V nominal core voltage (2.7–3.6 V); powers array and logic
VIOI/O supplyIndependent I/O voltage (1.65–VCC) enabling mixed-voltage system interfacing

Key Features

FeatureDesign Value
Asynchronous page-mode read15 ns access for sequential reads within 32-byte pages improves code execution throughput
Embedded Algorithm Controller (EAC)Hardware-executed program/erase algorithms eliminate host software overhead and timing constraints
Versatile I/O voltage rangeVIO from 1.65 V to VCC allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters
Common Flash Interface (CFI)Standardized parameter table enables automatic driver configuration and cross-manufacturer compatibility
Advanced Sector Protection (ASP)Volatile and non-volatile locking per 128-kB sector prevents accidental firmware overwrite in field-deployed systems

Applications

Industrial HMI Boot StorageAutomotive ECU Firmware

Use Scenario: Storing boot code and configuration data for programmable logic controllers with real-time OS.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability; 90 ns random access ensures deterministic interrupt response.

Use Value: Eliminates external SRAM copy step; reduces BOM count and boot latency by executing directly from flash.

Use Scenario: Holding calibrated engine control parameters and safety-critical firmware in Tier-1 automotive ECUs.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified firmware storage with on-die ECC and sector locking.

Use Value: Ensures functional safety compliance via hardware error correction and write-protection against voltage transients.

Medical Diagnostic Imaging BootNetwork Router Firmware

Use Scenario: Secure boot image storage in FDA-cleared imaging devices requiring long-term data integrity.

IC Role / Device Role / Timing Role: OTP-protected calibration data storage with 20-year retention guarantee at 85°C ambient.

Use Value: Meets regulatory requirements for unattended operation over product lifetime without firmware refresh.

Use Scenario: Storing bootloader, OS kernel, and configuration images in carrier-grade edge routers.

IC Role / Device Role / Timing Role: High-reliability parallel flash with CFI support for standardized Linux MTD drivers.

Use Value: Enables field-upgradable firmware with suspend/resume during erase, minimizing service downtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL256P90TFI010Same density and timing, but lacks Versatile I/O (VIO fixed to VCC); no 1.65–VCC flexibilityNot suitable for mixed-voltage SoC interfaces requiring independent I/O rail controlSelect when system uses single 3.3 V rail and cost sensitivity outweighs I/O flexibility
MX29GL256FHT2I-90GMacronix part; 90 ns access, 128-kB sectors, but no on-die ECC or OTP arrayLacks hardware error correction - requires external SW ECC or redundant storage architectureChoose where BOM cost is critical and ECC handled at system level; verify CFI compatibility

Compared with S29GL256P90TFI010 and MX29GL256FHT2I-90G, the S29GL256S90TFI013 uniquely combines Versatile I/O, on-die ECC, and OTP security in a single-package solution - critical for safety-aware and mixed-voltage embedded designs.

Availability

S29GL256S90TFI013 is available at Aetrix Electronics and suitable for industrial HMI, automotive ECU, and medical diagnostic imaging applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL256S90TFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions.

The GL-S family targets embedded systems needing robust, high-density parallel NOR flash with XIP performance, ECC, and automotive qualification - designed for mission-critical boot and firmware storage.

FAQ

What is the purpose of the Versatile I/O (VIO) feature?

VIO allows independent configuration of the I/O voltage rail from the core supply (VCC), supporting 1.65 V to VCC. This enables direct interfacing with diverse host processors (e.g., 1.8 V FPGA I/O banks or 3.3 V microcontrollers) without external level shifters, reducing board complexity and signal integrity risk.

Does S29GL256S90TFI013 support Execute-in-Place (XIP)?

Yes - its 90 ns random access time and asynchronous read architecture allow direct CPU instruction fetch from flash memory. The device supports true XIP operation without requiring data copying to RAM, verified by Infineon's application notes for ARM Cortex-M and Power Architecture platforms.

How does the 512-byte programming buffer improve system performance?

The buffer enables burst programming of up to 512 bytes in a single command sequence, reducing total programming time versus byte-by-byte writes. For example, writing 512 bytes takes ~340 µs buffer time versus >2 ms using standard single-word programming - accelerating firmware updates and field provisioning.

Is the OTP array truly one-time programmable?

Yes - the 1024-byte OTP region contains two independently lockable sectors. Once locked (via dedicated command sequence), bits can be permanently programmed but never erased or rewritten. This is used for secure keys, calibration constants, or device serial numbers requiring tamper-resistant storage.

S29GL256S90TFI013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-S
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL256S90TFI013 FAQ

1.How can I place an order for S29GL256S90TFI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90TFI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90TFI013 reliable?

The price and inventory of S29GL256S90TFI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90TFI013 is usually 5 days.

3.What payment methods are accepted for S29GL256S90TFI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90TFI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90TFI013?

S29GL256S90TFI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90TFI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90TFI013?

For technical support, including S29GL256S90TFI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90TFI013 requirements.

6.How does Aetrix verify that S29GL256S90TFI013 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90TFI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90TFI013 meets industry standards.

7.What is the process for return or replacement of S29GL256S90TFI013?

All S29GL256S90TFI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90TFI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90TFI013 part is unused and in its original packaging.

Return procedure for S29GL256S90TFI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29GL256S90TFI013 Tags

  • S29GL256S90TFI013
  • S29GL256S90TFI013 PDF
  • S29GL256S90TFI013 Datasheet
  • S29GL256S90TFI013 Specifications
  • S29GL256S90TFI013 Images
  • Infineon Technologies
  • Infineon Technologies S29GL256S90TFI013
  • Buy S29GL256S90TFI013
  • S29GL256S90TFI013 Price
  • S29GL256S90TFI013 Distributor
  • S29GL256S90TFI013 Supplier
  • S29GL256S90TFI013 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER