My Inquiry
My Account
Infineon Technologies S29GL256S90TFI023
- Part No.:
- S29GL256S90TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL256S90TFI023.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,324
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL256S90TFI023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It features hardware ECC for single-bit error correction, 128-kB uniform sector erase, and a 512-byte programming buffer - deployed in automotive instrument clusters and industrial HMI firmware storage.
For engineers reviewing the S29GL256S90TFI023 datasheet, S29GL256S90TFI023 pinout, S29GL256S90TFI023 application, or S29GL256S90TFI023 equivalent, key selection criteria include its Versatile I/O support (1.65–VCC), AEC-Q100 Grade 3 qualification (–40°C to +85°C), 100,000 program/erase cycles, and CFI-compliant interface for bootloader compatibility.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.
The internal architecture integrates a 65 nm MIRRORBIT™ Eclipse cell array with dedicated erase voltage and program voltage generators, plus on-die ECC logic that corrects single-bit errors in real time without host intervention - critical for fail-safe boot code execution in safety-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers |
| Random Access Time | 90 ns at VCC = VIO; enables fast XIP execution from flash without external cache |
| Page Access Time | 15 ns; allows rapid sequential reads within 32-byte aligned pages |
| Programming Buffer | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC Support | On-die single-bit error correction; eliminates need for external ECC logic in boot ROM path |
| Endurance | 100,000 program/erase cycles; suitable for field-upgradable firmware with infrequent updates |
| Data Retention | 20 years at +85°C; validated for long-life automotive ECUs and industrial controllers |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit word address bus (A23 = MSB); supports 32 MB addressing space |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO (1.65–VCC) voltage level |
| CE# | Chip Enable | Active-low enable; controls device selection in multi-chip memory configurations |
| OE# | Output Enable | Active-low read strobe; gates output drivers during asynchronous read cycles |
| WE# | Write Enable | Active-low control for write/program/erase command latching |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, high when ready |
| RESET# | Hardware Reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations |
| WP# | Write Protect | Hardware sector protection enable; prevents accidental program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Interface | VIO range 1.65 V to VCC enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| Uniform Sector Architecture | 512 × 128-kB sectors simplify firmware partitioning and OTA update management |
| OTP Memory Array | 1024-byte one-time-programmable region with dual lockable sections for secure key or calibration storage |
| Advanced Sector Protection | Volatile and non-volatile locking per sector prevents unauthorized firmware modification during development or field operation |
| CFI Compliance | Standard Common Flash Interface table allows automatic detection and configuration by bootloader or flash programmer |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated gauge graphics, driver alerts, and CAN message lookup tables in digital dashboards. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable firmware with deterministic 90 ns read latency. Use Value: AEC-Q100 Grade 3 qualification ensures reliability across –40°C to +85°C ambient, while hardware ECC prevents corrupted display rendering. | Use Scenario: Holding ladder logic runtime images and configuration parameters in modular programmable logic controllers. IC Role / Device Role / Timing Role: Parallel flash acting as persistent program store with sector-level erase for incremental firmware patches. Use Value: 128-kB uniform sectors allow atomic update of individual function blocks without full reflash, reducing downtime during maintenance. |
| Medical Diagnostic UI | Avionics Boot ROM |
Use Scenario: Hosting GUI assets, regulatory compliance logs, and calibration profiles in portable ultrasound or ECG devices. IC Role / Device Role / Timing Role: Secure firmware repository with OTP region for cryptographic keys and device-specific identifiers. Use Value: Dual-lock OTP regions prevent tampering with FDA-mandated traceability data while enabling field recalibration. | Use Scenario: Storing certified ARINC-653 compliant boot code and partition tables in flight control computers. IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and power-loss robust erase suspend/resume. Use Value: Suspend/resume capability ensures safe interruption of sector erase during aircraft power transients, avoiding partial writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S90TFI020 | Same die, identical specs, but shipped in 64-ball LAE Fortified BGA (9 mm × 9 mm) | Requires PCB redesign for BGA layout; no TSOP footprint compatibility | Select for space-constrained designs where board area is prioritized over socketability or rework ease |
| MX29GL256FHT2I-90G | Macronix part; 90 ns access, same density, but lacks integrated ECC and OTP array | Requires external ECC handling and separate secure storage solution | Select only if cost sensitivity outweighs safety certification requirements and ECC overhead is acceptable |
Compared with S29GL256S90TFI020, this TSOP variant offers easier prototyping and thermal management; versus MX29GL256FHT2I-90G, it delivers built-in ECC and OTP security - eliminating host-side error handling and key provisioning complexity.
Availability
S29GL256S90TFI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical diagnostic UIs requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL256S90TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including ISO/TS 16949 and IATF 16949.
The GL-S family targets high-reliability embedded systems requiring deterministic flash performance, integrated data integrity, and automotive-grade qualification - designed specifically for boot code, firmware, and configuration storage in safety-critical environments.
FAQ
What is the maximum operating temperature range for S29GL256S90TFI023?
The S29GL256S90TFI023 is rated for Industrial Plus grade: –40°C to +105°C. This rating is explicitly confirmed in the datasheet's "Temperature range / grade" section and applies to all electrical and timing specifications under specified voltage conditions.
Does this device support hardware reset recovery after power loss during erase?
Yes. The device implements power-loss robust erase suspend/resume functionality. When RESET# is asserted during an erase operation, the internal state machine safely halts and retains sector erase progress, allowing resumption after power restoration without data corruption.
Can the OTP array be programmed multiple times?
No. The 1024-byte OTP array is one-time programmable by design. Each of its two lockable regions can be permanently locked after initial programming, preventing further writes - verified in Section 3.3 and Figure 2-6 of the datasheet.
Is the RY/BY# pin compatible with standard open-drain bus wiring?
Yes. RY/BY# is an open-drain output requiring an external pull-up resistor. It drives low during embedded operations (program/erase) and floats high when idle or ready - matching standard NOR flash timing protocols and enabling wired-OR connection in multi-device systems.
S29GL256S90TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL256S90TFI023 FAQ
1.How can I place an order for S29GL256S90TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL256S90TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL256S90TFI023 reliable?
The price and inventory of S29GL256S90TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90TFI023 is usually 5 days.
3.What payment methods are accepted for S29GL256S90TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL256S90TFI023?
S29GL256S90TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL256S90TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL256S90TFI023?
For technical support, including S29GL256S90TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90TFI023 requirements.
6.How does Aetrix verify that S29GL256S90TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL256S90TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL256S90TFI023?
All S29GL256S90TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL256S90TFI023 part is unused and in its original packaging.
Return procedure for S29GL256S90TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL256S90TFI023 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
