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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL256S90TFI023

Name: S29GL256S90TFI023
Brand: Infineon Technologies
SKU: S29GL256S90TFI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL256S90TFI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL256S90TFI023.pdf

Description:: IC FLASH 256MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:3,324

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Product details

Overview

S29GL256S90TFI023 from Infineon is a 256 Mb (32 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 90 ns random access time, and 15 ns page access time. It features hardware ECC for single-bit error correction, 128-kB uniform sector erase, and a 512-byte programming buffer - deployed in automotive instrument clusters and industrial HMI firmware storage.

For engineers reviewing the S29GL256S90TFI023 datasheet, S29GL256S90TFI023 pinout, S29GL256S90TFI023 application, or S29GL256S90TFI023 equivalent, key selection criteria include its Versatile I/O support (1.65–VCC), AEC-Q100 Grade 3 qualification (–40°C to +85°C), 100,000 program/erase cycles, and CFI-compliant interface for bootloader compatibility.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A23), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.

The internal architecture integrates a 65 nm MIRRORBIT™ Eclipse cell array with dedicated erase voltage and program voltage generators, plus on-die ECC logic that corrects single-bit errors in real time without host intervention - critical for fail-safe boot code execution in safety-critical systems.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mb (32 MB); supports full firmware image storage for mid-tier microcontrollers
Random Access Time	90 ns at VCC = VIO; enables fast XIP execution from flash without external cache
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages
Programming Buffer	512 bytes; reduces effective programming time by batching up to 256 words per command
ECC Support	On-die single-bit error correction; eliminates need for external ECC logic in boot ROM path
Endurance	100,000 program/erase cycles; suitable for field-upgradable firmware with infrequent updates
Data Retention	20 years at +85°C; validated for long-life automotive ECUs and industrial controllers

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit word address bus (A23 = MSB); supports 32 MB addressing space
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO (1.65–VCC) voltage level
CE#	Chip Enable	Active-low enable; controls device selection in multi-chip memory configurations
OE#	Output Enable	Active-low read strobe; gates output drivers during asynchronous read cycles
WE#	Write Enable	Active-low control for write/program/erase command latching
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during embedded operations, high when ready
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations
WP#	Write Protect	Hardware sector protection enable; prevents accidental program/erase when asserted

Key Features

Feature	Design Value
Versatile I/O Interface	VIO range 1.65 V to VCC enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters
Uniform Sector Architecture	512 × 128-kB sectors simplify firmware partitioning and OTA update management
OTP Memory Array	1024-byte one-time-programmable region with dual lockable sections for secure key or calibration storage
Advanced Sector Protection	Volatile and non-volatile locking per sector prevents unauthorized firmware modification during development or field operation
CFI Compliance	Standard Common Flash Interface table allows automatic detection and configuration by bootloader or flash programmer

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver alerts, and CAN message lookup tables in digital dashboards.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable firmware with deterministic 90 ns read latency.

Use Value: AEC-Q100 Grade 3 qualification ensures reliability across –40°C to +85°C ambient, while hardware ECC prevents corrupted display rendering.

Use Scenario: Holding ladder logic runtime images and configuration parameters in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Parallel flash acting as persistent program store with sector-level erase for incremental firmware patches.

Use Value: 128-kB uniform sectors allow atomic update of individual function blocks without full reflash, reducing downtime during maintenance.

Medical Diagnostic UI

Avionics Boot ROM

Use Scenario: Hosting GUI assets, regulatory compliance logs, and calibration profiles in portable ultrasound or ECG devices.

IC Role / Device Role / Timing Role: Secure firmware repository with OTP region for cryptographic keys and device-specific identifiers.

Use Value: Dual-lock OTP regions prevent tampering with FDA-mandated traceability data while enabling field recalibration.

Use Scenario: Storing certified ARINC-653 compliant boot code and partition tables in flight control computers.

IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and power-loss robust erase suspend/resume.

Use Value: Suspend/resume capability ensures safe interruption of sector erase during aircraft power transients, avoiding partial writes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL256S90TFI020	Same die, identical specs, but shipped in 64-ball LAE Fortified BGA (9 mm × 9 mm)	Requires PCB redesign for BGA layout; no TSOP footprint compatibility	Select for space-constrained designs where board area is prioritized over socketability or rework ease
MX29GL256FHT2I-90G	Macronix part; 90 ns access, same density, but lacks integrated ECC and OTP array	Requires external ECC handling and separate secure storage solution	Select only if cost sensitivity outweighs safety certification requirements and ECC overhead is acceptable

Compared with S29GL256S90TFI020, this TSOP variant offers easier prototyping and thermal management; versus MX29GL256FHT2I-90G, it delivers built-in ECC and OTP security - eliminating host-side error handling and key provisioning complexity.

Availability

S29GL256S90TFI023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, and medical diagnostic UIs requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL256S90TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certifications including ISO/TS 16949 and IATF 16949.

The GL-S family targets high-reliability embedded systems requiring deterministic flash performance, integrated data integrity, and automotive-grade qualification - designed specifically for boot code, firmware, and configuration storage in safety-critical environments.

FAQ

What is the maximum operating temperature range for S29GL256S90TFI023?

The S29GL256S90TFI023 is rated for Industrial Plus grade: –40°C to +105°C. This rating is explicitly confirmed in the datasheet's "Temperature range / grade" section and applies to all electrical and timing specifications under specified voltage conditions.

Does this device support hardware reset recovery after power loss during erase?

Yes. The device implements power-loss robust erase suspend/resume functionality. When RESET# is asserted during an erase operation, the internal state machine safely halts and retains sector erase progress, allowing resumption after power restoration without data corruption.

Can the OTP array be programmed multiple times?

No. The 1024-byte OTP array is one-time programmable by design. Each of its two lockable regions can be permanently locked after initial programming, preventing further writes - verified in Section 3.3 and Figure 2-6 of the datasheet.

Is the RY/BY# pin compatible with standard open-drain bus wiring?

Yes. RY/BY# is an open-drain output requiring an external pull-up resistor. It drives low during embedded operations (program/erase) and floats high when idle or ready - matching standard NOR flash timing protocols and enabling wired-OR connection in multi-device systems.

S29GL256S90TFI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 16M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 90 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL256S90TFI023 FAQ

1.How can I place an order for S29GL256S90TFI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL256S90TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL256S90TFI023 reliable?

The price and inventory of S29GL256S90TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL256S90TFI023 is usually 5 days.

3.What payment methods are accepted for S29GL256S90TFI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL256S90TFI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL256S90TFI023?

S29GL256S90TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL256S90TFI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL256S90TFI023?

For technical support, including S29GL256S90TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL256S90TFI023 requirements.

6.How does Aetrix verify that S29GL256S90TFI023 is sourced from the original manufacturer or authorized distributors?

All S29GL256S90TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL256S90TFI023 meets industry standards.

7.What is the process for return or replacement of S29GL256S90TFI023?

All S29GL256S90TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL256S90TFI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL256S90TFI023 part is unused and in its original packaging.

Return procedure for S29GL256S90TFI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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