Infineon Technologies S29GL512P10TFI020
- Part No.:
- S29GL512P10TFI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512P10TFI020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,160
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512P10TFI020 from Cypress Semiconductor (acquired by Infineon) is a 512 Mbit (64 MB), 3.0 V-only page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology. It delivers 100 ns random access time and 25 ns page access time, features a 32-word/64-byte write buffer, uniform 64 Kword sectors (512 total), and supports CFI for host compatibility - deployed in industrial embedded controllers requiring nonvolatile program storage with sector-level protection.
For engineers reviewing the S29GL512P10TFI020 datasheet, S29GL512P10TFI020 pinout, S29GL512P10TFI020 application, or S29GL512P10TFI020 equivalent, key selection criteria include VIO-compatible I/O voltage range (1.65–VCC), WP#/ACC acceleration support, Secured Silicon Sector programmability, and industrial temperature operation (–40°C to +85°C).
Technical Context
This device implements a synchronous/asynchronous hybrid interface with VersatileI/O™ control: all input thresholds and output drive levels are referenced to VIO (1.65–VCC), enabling interoperability with mixed-voltage microcontrollers. Address decoding supports A24–A0 (25 address bits), and byte/word configuration is selected via BYTE# pin.
Embedded algorithms manage program and erase operations with suspend/resume capability; status is reported via RY/BY# and internal status bits. Sector erase (0.5 s typical per 64 Kword sector) and write-buffer programming (13.5 µs/word with VHH) are hardware-accelerated and fully compliant with Common Flash Interface (CFI) query structure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 MB), organized as 512 uniform 64 Kword (128 Kbyte) sectors |
| Access Time | 100 ns random access (Regulated VCC), 25 ns page access - enables fast instruction fetch in boot code execution |
| Write Buffer | 32-word (64-byte) buffer - reduces effective multi-word programming time by >70% vs. single-word writes |
| VIO Range | 1.65 V to VCC (2.7–3.6 V) - allows direct interfacing with 1.8 V or 3.3 V logic without level shifters |
| Erase Endurance | 100,000 cycles per sector - supports field firmware updates over product lifetime |
| Data Retention | 20 years typical - ensures long-term reliability in unpowered storage applications |
| Operating Temp | –40°C to +85°C (Industrial grade) - qualified for use in automotive ECUs and industrial HMIs |
Pinout & Package
Package: 56-pin TSOP (Standard Thin Small Outline Package, TSO56), lead-free (Pb-free), industrial temperature grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A24–A0 | Address Inputs | 25-bit address bus (A24–A0); A24 is MSB for 512 Mbit density |
| DQ15–DQ0 | Data I/O (Word Mode) | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode when BYTE# = VIL |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous control signals; CE# gating enables low-power deselection |
| BYTE# | Bus Width Select | Configures 8-bit (VIL) or 16-bit (VIH) data interface - critical for MCU bus width matching |
| WP#/ACC | Write Protect / Acceleration | VIL: locks top/bottom sector; VHH: enables unlock bypass mode and accelerates programming |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicating active program/erase - used for polling or interrupt-driven timing |
| RESET# | Hardware Reset | Asynchronous reset that terminates ongoing operations and returns device to read mode |
| VIO | Versatile I/O Reference | Defines input threshold and output drive voltage - decouples I/O logic from core VCC supply |
Key Features
| Feature | Design Value |
|---|---|
| Secured Silicon Sector | 128-word (256-byte) factory- or customer-programmable region with lockable Electronic Serial Number - enables secure device identity and anti-cloning |
| Advanced Sector Protection | Persistent lock bits + password-based software protection - prevents unauthorized firmware overwrite in deployed systems |
| Suspend/Resume | Interruptible program/erase operations - allows high-priority read access during background flash updates |
| CFI Compliance | Standardized JEDEC JESD68 query table at 0x0055/0x00AA - enables automatic driver detection and configuration in bootloader environments |
| Low-Power Standby | 1 µA typical standby current - extends battery life in always-on edge nodes and portable diagnostics tools |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
|
Use Scenario: Nonvolatile storage of ladder logic programs and configuration parameters in programmable logic controllers operating in harsh factory environments. IC Role / Device Role: Primary boot and application code storage with sector-locking to prevent accidental corruption during field updates. Use Value: 100,000 erase cycles and –40°C to +85°C rating ensure reliable reprogramming over 10+ years of continuous operation. |
Use Scenario: Storing calibrated engine control maps and diagnostic firmware in powertrain control units subject to thermal cycling and vibration. IC Role / Device Role: CFI-compliant NOR Flash providing deterministic read latency for real-time boot sequence execution. Use Value: 25 ns page access time enables fast instruction fetch from linear memory space, reducing boot time by ~18% vs. legacy 110 ns parts. |
| Medical Imaging System BIOS | Network Router Bootloader |
|
Use Scenario: Secure storage of boot firmware and calibration data in FDA-regulated imaging equipment requiring traceable firmware revisions. IC Role / Device Role: Secured Silicon Sector hosts locked serial number and cryptographic keys; main array stores signed bootloader images. Use Value: Factory-programmable ESN and persistent sector lock bits meet IEC 62304 traceability and integrity requirements. |
Use Scenario: Storing U-Boot or OpenWrt bootloader and fail-safe recovery image in enterprise-grade routers with dual-image update capability. IC Role / Device Role: Dual-sector architecture supports A/B firmware partitioning; WP#/ACC enables accelerated production programming. Use Value: Write buffer programming (13.5 µs/word with VHH) cuts factory flash time by 42% compared to standard command-set writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and package, but uses 65 nm Eclipse process; 10% lower active current (45 mA vs. 50 mA), identical timing specs | Lower power consumption suits battery-backed network gateways; no change to PCB layout or firmware | Select for new designs prioritizing energy efficiency where datasheet revision *C or later is acceptable |
| MX29GL512FHI-10G | Micron part with same 56-pin TSOP, 100 ns access, but lacks VersatileI/O and Secured Silicon Sector; requires external level shifting for 1.8 V hosts | Suitable for cost-sensitive consumer gateways where security and mixed-voltage I/O are not required | Choose only if VIO independence and secure ID features are unnecessary and BOM cost is primary constraint |
Compared with S29GL512S10TFI020, this part offers proven 90 nm reliability and broader I/O flexibility; versus MX29GL512FHI-10G, it provides integrated security and voltage adaptability at modest cost premium - justifying selection in industrial and automotive contexts.
Availability
S29GL512P10TFI020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical imaging BIOS, and network router bootloaders requiring stable component supply across extended product lifecycles.
Supply support for S29GL512P10TFI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor, now part of Infineon Technologies, is a leader in embedded nonvolatile memory and microcontroller solutions, with deep expertise in automotive, industrial, and IoT flash architectures.
The S29GL-P series was designed specifically for high-reliability embedded boot and firmware storage, emphasizing sector protection, long retention, and mixed-voltage interoperability in mission-critical systems.
FAQ
What is the function of the VIO pin on the S29GL512P10TFI020?
VIO sets the reference voltage for all input thresholds and output drive levels. It operates from 1.65 V to VCC (2.7–3.6 V), allowing the device to interface directly with 1.8 V or 3.3 V microcontrollers without external level shifters. This eliminates board-level translation circuitry and reduces system BOM count and signal integrity risk.
Can the Secured Silicon Sector be programmed after device shipment?
Yes - the 128-word Secured Silicon Sector can be programmed and permanently locked either at the factory or by the end customer using standard CFI commands. Once locked, the contents (including the 8-word Electronic Serial Number) become read-only and immune to erase or program commands, supporting secure device authentication in field-deployed systems.
Does the S29GL512P10TFI020 support hardware reset during active programming?
Yes - asserting RESET# asynchronously halts any ongoing program or erase operation and forces the device into reading array data mode. After reset release, the device resumes normal read operation; previously initiated embedded algorithms are aborted and must be reissued, ensuring predictable recovery behavior in fault-tolerant systems.
How does the WP#/ACC pin affect programming performance?
When driven to VHH (~9 V), WP#/ACC activates unlock bypass mode and accelerates programming throughput by eliminating pre-command unlock sequences. This reduces per-word programming time from 60 µs to 13.5 µs, significantly improving factory flash time for large firmware images - while retaining full sector protection when held at VIH during normal operation.
S29GL512P10TFI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 100ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512P10TFI020 FAQ
1.How can I place an order for S29GL512P10TFI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512P10TFI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512P10TFI020 reliable?
The price and inventory of S29GL512P10TFI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512P10TFI020 is usually 5 days.
3.What payment methods are accepted for S29GL512P10TFI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512P10TFI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512P10TFI020?
S29GL512P10TFI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512P10TFI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512P10TFI020?
For technical support, including S29GL512P10TFI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512P10TFI020 requirements.
6.How does Aetrix verify that S29GL512P10TFI020 is sourced from the original manufacturer or authorized distributors?
All S29GL512P10TFI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512P10TFI020 meets industry standards.
7.What is the process for return or replacement of S29GL512P10TFI020?
All S29GL512P10TFI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512P10TFI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512P10TFI020 part is unused and in its original packaging.
Return procedure for S29GL512P10TFI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512P10TFI020 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

