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Infineon Technologies S29GL512P12TFIV10
- Part No.:
- S29GL512P12TFIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512P12TFIV10.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,601
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Product details
Overview
S29GL512P12TFIV10 from Cypress Semiconductor is a 512 Mbit (64 Mbyte) single-supply 3.0 V page-mode NOR Flash memory fabricated on 90 nm MirrorBit process technology, featuring 25 ns page access time, 100 ns random access time, uniform 64 Kword (128 Kbyte) sector architecture (512 sectors), and 100,000 erase cycles per sector - deployed in industrial embedded systems for firmware storage and code execution.
For engineers reviewing the S29GL512P12TFIV10 datasheet, S29GL512P12TFIV10 pinout, S29GL512P12TFIV10 application, or S29GL512P12TFIV10 equivalent, key selection criteria include VersatileI/O™ voltage flexibility (VIO = 1.65–VCC), write buffer programming efficiency (64-byte burst), secured silicon sector with electronic serial number, and industrial temperature range (–40°C to +85°C).
Technical Context
This device implements a synchronous-compatible asynchronous interface with dual-bus width support (x16 word/x8 byte via BYTE#), integrated erase/program state machines, and hardware-accelerated programming via WP#/ACC at VHH. It supports CFI-compliant identification and advanced sector protection using persistent bits or password methods.
The memory array uses a split-gate MirrorBit cell structure enabling high-density nonvolatile storage with 20-year data retention and suspend/resume capability for both program and erase operations - critical for real-time system updates without interrupting host operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 Mbyte), organized as 512 × 64 Kword sectors - enables full firmware image storage for mid-tier microcontrollers. |
| Access Time | 100 ns random access (Regulated VCC), 25 ns page access - meets timing requirements for direct XIP (execute-in-place) from flash in ARM Cortex-M7 systems. |
| Write Buffer Size | 64 bytes (32 words) - reduces effective programming time by >4× vs. single-word writes, accelerating field firmware updates. |
| Erase Endurance | 100,000 cycles per sector - supports frequent OTA update cycles in industrial gateways over 10+ years of operation. |
| Data Retention | 20 years typical - ensures long-term reliability in unattended infrastructure equipment without refresh. |
| Operating Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows interoperability with mixed-voltage SoCs (e.g., 1.8 V I/O, 3.3 V core). |
| Temperature Range | –40°C to +85°C (Industrial) - qualified for deployment in outdoor telecom base stations and factory automation controllers. |
Pinout & Package
Package: 56-pin TSOP (Standard Thin Small Outline Package, TSO56), lead-free (Pb-free), industrial temperature grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A24–A0 | Address Inputs | 25-bit address bus supporting full 512 Mbit addressing (A24 MSB); A0–A1 select byte/word mode when BYTE# active. |
| DQ15–DQ0 | Data I/O (x16) | 16-bit bidirectional data bus; DQ15/A-1 serves as LSB address in byte mode - enables flexible bus-width configuration. |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous control signals; CE# gating reduces standby current to 1 µA when deselected. |
| RY/BY# | Ready/Busy Output | Open-drain status signal indicating active erase/program; used for polling or interrupt-driven completion detection. |
| WP#/ACC | Write Protect / Acceleration | Pull-up default; driven to VHH to enable unlock-bypass programming acceleration - critical for high-throughput manufacturing. |
| RESET# | Hardware Reset | Asynchronous active-low reset that aborts ongoing operations and returns device to read mode - ensures safe recovery after power brownout. |
| VIO | Versatile I/O Supply | Independent I/O voltage reference (1.65–VCC); decouples logic interface voltage from core VCC - simplifies mixed-voltage board design. |
Key Features
| Feature | Design Value |
|---|---|
| 90 nm MirrorBit Process | Enables 512 Mbit density in TSOP package with reduced leakage and improved endurance vs. older 110 nm nodes. |
| Secured Silicon Sector | 256-byte factory- or customer-lockable region containing 16-byte electronic serial number - provides immutable device identity for secure boot. |
| Advanced Sector Protection | Persistent lock bits + password method allow granular, irreversible sector lockdown - prevents accidental or malicious firmware overwrite. |
| Suspend/Resume Capability | Allows read access during erase or program operations - enables real-time diagnostics or user interface responsiveness during background updates. |
| CFI Compliance | Standardized JEDEC JESD68 interface enables automatic parameter detection by bootloader - eliminates hardcoded timing constants in firmware. |
Applications
| Industrial PLC Firmware Storage | Automotive Telematics Boot Memory |
|---|---|
|
Use Scenario: Storing and executing boot loader and application firmware in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP support and hardware reset recovery. Use Value: 20-year data retention and –40°C to +85°C operation ensure firmware integrity across extended maintenance cycles without refresh. |
Use Scenario: Holding certified bootloader and OTA update partitions in vehicle telematics control units requiring ASIL-B alignment. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with secured silicon sector for cryptographic key binding. Use Value: Persistent sector protection and electronic serial number enable hardware-rooted trust chain verification during boot. |
| Medical Imaging System Configuration | Network Router Boot Image |
|
Use Scenario: Storing calibration tables, device-specific configuration, and safety-critical startup routines in portable ultrasound scanners. IC Role / Device Role / Timing Role: High-reliability parameter storage with suspend/resume for concurrent diagnostics during boot. Use Value: 100,000 erase cycles support frequent recalibration updates while maintaining FDA-grade traceability logs. |
Use Scenario: Hosting primary and fallback boot images in enterprise-grade routers requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: Dual-image storage with fast page read (25 ns) enabling sub-second failover during upgrade rollback. Use Value: 64-byte write buffer cuts firmware patch time by >75% vs. legacy parallel flash, reducing service window duration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MX29GL512FHI-11G | 110 ns random access, 48-pin TSOP, no VersatileI/O (fixed VIO = VCC), lacks secured silicon sector | Lower-cost alternative where mixed-voltage I/O and device authentication are not required | Select when board-level voltage translation is already implemented and security features are handled externally. |
| S29GL512S11TFIV10 | Same die, 110 ns speed grade, identical pinout and feature set - only timing parameter differs | Drop-in replacement for less timing-critical designs; same industrial temp and package | Choose for cost-optimized sourcing where 110 ns access meets system timing margin requirements. |
Compared with MX29GL512FHI-11G, S29GL512P12TFIV10 delivers superior I/O flexibility and built-in security; versus S29GL512S11TFIV10, it offers tighter 100 ns timing for higher-performance XIP execution - making it optimal for latency-sensitive embedded hosts.
Availability
S29GL512P12TFIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive telematics boot memory, and medical imaging system configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29GL512P12TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and consumer markets.
The S29GL-P series was designed specifically for embedded systems requiring reliable, high-density parallel NOR Flash with robust data integrity, secure identity, and mixed-voltage interoperability - targeting code storage in resource-constrained real-time platforms.
FAQ
What is the function of the VIO pin on S29GL512P12TFIV10?
The VIO pin sets the input/output voltage reference independently from VCC, supporting VIO = 1.65 V to VCC. This enables direct interfacing with 1.8 V or 2.5 V logic families while maintaining 3.3 V core operation - eliminating level shifters in mixed-voltage designs and reducing BOM count and PCB area.
Does S29GL512P12TFIV10 support execute-in-place (XIP) operation?
Yes - its 25 ns page access time and 100 ns random access time meet timing requirements for direct instruction fetch from flash in ARM Cortex-M and Power Architecture-based systems. The device supports standard asynchronous read protocol with CE#, OE#, and WE# controls, enabling seamless XIP integration without external caching logic.
How is the secured silicon sector programmed and locked?
The 256-byte secured silicon sector contains an 8-word (16-byte) electronic serial number. It can be programmed and permanently locked either at the factory or by the customer using dedicated CFI command sequences. Once locked, the sector becomes read-only and immune to erase commands - providing hardware-enforced uniqueness for secure boot and anti-counterfeiting.
What is the purpose of the WP#/ACC pin beyond write protection?
When driven to VHH (~11.5 V), WP#/ACC enables unlock-bypass programming mode, accelerating write buffer programming to 13.5 µs per word. This high-voltage acceleration is used during system manufacturing for rapid firmware loading, while at VIH it provides standard write protection for the top/bottom sector - combining production efficiency with runtime safety.
S29GL512P12TFIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-P
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 120ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512P12TFIV10 FAQ
1.How can I place an order for S29GL512P12TFIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512P12TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512P12TFIV10 reliable?
The price and inventory of S29GL512P12TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512P12TFIV10 is usually 5 days.
3.What payment methods are accepted for S29GL512P12TFIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512P12TFIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512P12TFIV10?
S29GL512P12TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512P12TFIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512P12TFIV10?
For technical support, including S29GL512P12TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512P12TFIV10 requirements.
6.How does Aetrix verify that S29GL512P12TFIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL512P12TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512P12TFIV10 meets industry standards.
7.What is the process for return or replacement of S29GL512P12TFIV10?
All S29GL512P12TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512P12TFIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512P12TFIV10 part is unused and in its original packaging.
Return procedure for S29GL512P12TFIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512P12TFIV10 Tags
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