Spansion S29GL512S10DHA020
- Part No.:
- S29GL512S10DHA020
- Manufacturer:
- Spansion
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S10DHA020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,302
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Product details
Overview
S29GL512S10DHA020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), and 15 ns page access time. It features hardware ECC for single-bit error correction, 128 kB uniform sector erase, and a 512-byte write buffer enabling 1.5 MBps buffered programming. Used in boot code storage for industrial microcontrollers requiring XIP capability and high reliability.
For engineers reviewing the S29GL512S10DHA020 datasheet, S29GL512S10DHA020 pinout, S29GL512S10DHA020 application, or S29GL512S10DHA020 equivalent, key selection criteria include its asynchronous 16-bit interface, Versatile I/O (1.65–VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program/erase cycles, and CFI-compliant software interface.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without host CPU intervention. Its MIRRORBIT™ Eclipse architecture on 65 nm process enables simultaneous read-while-suspend during programming or erasing, supported by status register polling, RY/BY# pin signaling, and data polling mechanisms.
The flash array is organized into uniform 128 kB sectors with advanced sector protection (ASP) offering both volatile and non-volatile lock bits per sector. A dedicated 1024-byte OTP array includes two lockable regions for secure configuration storage, and the device supports Common Flash Interface (CFI) parameter tables for runtime identification and command set discovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB); supports full firmware image storage for mid-range MCUs |
| Interface | Asynchronous 16-bit parallel; no clock required, compatible with legacy address/data bus controllers |
| Page Access Time | 15 ns; enables fast sequential reads within 32-byte aligned pages for XIP execution |
| Random Access Time | 100 ns (VCC = VIO); determines worst-case latency for first-word fetch from new page |
| Write Buffer Size | 512 bytes; reduces effective programming time by batching up to 256 words per command |
| ECC | Internal hardware single-bit correction; eliminates need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles; suitable for field-upgradable firmware with moderate update frequency |
| Data Retention | 20 years at +85°C; ensures long-term reliability in unpowered industrial deployments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), JEDEC standard MO-141AC, 18.4 mm × 10.16 mm × 1.2 mm body height, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit word address bus (A24 = MSB); supports full 512 Mb addressing with word boundary alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates at VIO (1.65–VCC) independent of VCC |
| CE# | Chip enable | Active-low chip select; controls device power state and enables internal timing for access |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state or timing |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands and data latching |
| RY/BY# | Ready/Busy indicator | Open-drain active-low status pin; signals ongoing embedded operation completion |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state, clears status registers |
| VCC | Core supply | 3.0 V nominal supply (2.7–3.6 V); powers core logic, EAC, and voltage generators |
| VIO | I/O supply | Independent I/O voltage (1.65–VCC); enables interfacing with mixed-voltage host systems |
| WP# | Write protect | Active-low hardware sector protection enable; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read | 32-byte aligned page access with 15 ns subsequent word latency-enables efficient XIP execution |
| Buffered programming | 512-byte write buffer allows single-command multi-word programming-reduces host overhead and improves throughput |
| Hardware ECC | On-die single-bit error correction with automatic detection-eliminates external ECC IC and simplifies BOM |
| Advanced sector protection | Volatile and non-volatile lock bits per 128 kB sector-supports flexible firmware partitioning and secure boot enforcement |
| OTP array | 1024-byte one-time-programmable region with two independently lockable sections-stores immutable keys or calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns random access latency. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across extended maintenance intervals without refresh. | Use Scenario: Hosting boot code and safety monitor firmware in radar control units certified to ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) parallel NOR flash with hardware ECC for fault-tolerant startup sequence. Use Value: Internal ECC and sector-level protection prevent corrupted boot due to single-event upsets or aging effects in automotive under-hood locations. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound devices requiring regulatory traceability. IC Role / Device Role / Timing Role: Secure, CFI-compliant flash with OTP region for storing cryptographic keys and device-specific parameters. Use Value: Two-lock OTP sections enable separation of manufacturer keys (permanent lock) and field-service calibration data (reprogrammable lock). | Use Scenario: Holding FPGA configuration bitstreams and protocol stack binaries in 5G remote radio units deployed outdoors. IC Role / Device Role / Timing Role: High-reliability parallel flash supporting rapid field updates via JTAG or PCIe-based host interface. Use Value: 1.5 MBps buffered programming reduces firmware update time by >60% compared to byte-wise programming, minimizing service downtime. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | 64-ball LAE Fortified BGA (9 mm × 9 mm); same electrical specs but different package and thermal profile | Preferred for space-constrained PCBs where TSOP footprint is prohibitive; requires rework of layout and signal routing | Select when board area is critical and BGA assembly capability exists |
| MX29GL512FHI-90G | Macronix part with 90 ns random access (vs. 100 ns), no built-in ECC, CFI-compatible but separate ECC must be implemented externally | Suitable for cost-sensitive designs where ECC is handled in software or external logic; lacks OTP array | Choose only if ECC is already managed at system level and footprint compatibility allows |
Compared with S29GL512S10DHA020, the TSOP-packaged Infineon variant offers proven industrial thermal performance and integrated ECC, while the LAE BGA alternative trades package size for identical functionality, and the Macronix option sacrifices on-die ECC and OTP for lower unit cost.
Availability
S29GL512S10DHA020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply over 10+ year product lifecycles.
Supply support for S29GL512S10DHA020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor company specializing in power management, automotive, industrial, and security solutions, with global manufacturing and R&D infrastructure.
The GL-S family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with enhanced endurance, ECC, and automotive qualification-designed specifically for boot code and firmware storage in harsh environments.
FAQ
Does S29GL512S10DHA020 support synchronous read or burst mode?
No. This device is strictly asynchronous-no clock input is required or supported. All read operations use CE#, OE#, and address setup/hold timing per datasheet AC specifications. Page mode read provides faster subsequent accesses within the same 32-byte page, but it remains asynchronous and does not rely on clock edges or burst counters.
Can VIO be set to 1.8 V while VCC is at 3.3 V?
Yes. The Versatile I/O feature explicitly supports VIO from 1.65 V to VCC. At VCC = 3.3 V, VIO may be independently set to 1.8 V to interface with 1.8 V logic families, provided all timing parameters (e.g., tVEX, tVDS) are met per the "VersatileIO" column in the Performance Summary table.
Is the 1024-byte OTP array field-programmable after soldering?
Yes. The OTP array is programmable in-system using standard command sequences (e.g., unlock + program commands). Each of the two lockable regions can be permanently locked once written, preventing further modification-ideal for storing calibration data or cryptographic keys during final test or field provisioning.
What happens during power loss while a sector erase is in progress?
The device includes hardware data protection during power-off: if VCC drops below the reset threshold during erase, the embedded algorithm controller aborts the operation and restores valid data from the last known good state. No partial or corrupted sector results-only the incomplete erase is canceled, preserving prior contents.
S29GL512S10DHA020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Spansion
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S10DHA020 FAQ
1.How can I place an order for S29GL512S10DHA020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S10DHA020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S10DHA020 reliable?
The price and inventory of S29GL512S10DHA020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10DHA020 is usually 5 days.
3.What payment methods are accepted for S29GL512S10DHA020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10DHA020 transactions.
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4.How is shipping managed for S29GL512S10DHA020?
S29GL512S10DHA020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S10DHA020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S10DHA020?
For technical support, including S29GL512S10DHA020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10DHA020 requirements.
6.How does Aetrix verify that S29GL512S10DHA020 is sourced from the original manufacturer or authorized distributors?
All S29GL512S10DHA020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10DHA020 meets industry standards.
7.What is the process for return or replacement of S29GL512S10DHA020?
All S29GL512S10DHA020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10DHA020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S10DHA020 part is unused and in its original packaging.
Return procedure for S29GL512S10DHA020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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