Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Spansion S29GL512S10DHA023

Name: S29GL512S10DHA023
Brand: Spansion
SKU: S29GL512S10DHA023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512S10DHA023

Manufacturer:: Spansion

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S10DHA023.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:311

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512S10DHA023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access and 15 ns page access, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile firmware retention.

For engineers reviewing the S29GL512S10DHA023 datasheet, S29GL512S10DHA023 pinout, S29GL512S10DHA023 application, or S29GL512S10DHA023 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), OTP array for secure configuration, and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status reporting via status register, data polling, or RY/BY# pin.

The internal architecture includes a 32-byte page-aligned read path, hardware-based ECC engine correcting single-bit errors on-the-fly, and advanced sector protection (ASP) with volatile/non-volatile lock options per 128 kB sector. The 1024-byte OTP array is split into two independently lockable regions for secure boot keys or calibration data.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - supports full firmware image storage for mid-range MCUs.
Access Time	100 ns random access (VCC = VIO), 15 ns page access - enables low-latency XIP execution without external cache.
Write Buffer Size	512 bytes (256 words) - reduces effective programming time by batching writes, critical for field firmware updates.
ECC Support	On-die hardware single-bit error correction - eliminates need for external ECC logic and improves system-level data integrity.
Sector Erase	Uniform 128 kB sectors (512 total) - simplifies partitioning for bootloader, app, and parameter storage with deterministic timing.
Operating Voltage	VCC = 2.7–3.6 V; VIO = 1.65–VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V I/O domains without level shifters.
Data Retention	20 years at +85°C - ensures long-term reliability in unattended industrial deployments.
Endurance	100,000 program/erase cycles per sector - supports frequent OTA update cycles in edge gateway applications.

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, lead-free.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address Inputs	25-bit address bus; A24 is MSB for 512 Mb density (4M × 16), enabling full memory mapping without bank switching.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes and reads; compatible with standard SRAM-like controllers.
CE#	Chip Enable	Active-low chip select; controls device power state - deassertion places device in low-power standby (100 µA).
OE#	Output Enable	Active-low read strobe; gates output drivers during read cycles; independent of CE# for flexible timing control.
WE#	Write Enable	Active-low write strobe; initiates command latching or data programming; must be synchronized with address/data setup/hold.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low = operation in progress (program/erase); high = ready - enables polling-free interrupt-driven control.
RESET#	Hardware Reset	Active-low asynchronous reset; aborts ongoing operations and returns device to read mode - critical for recovery after power brownout.
WP#	Write Protect	Hardware sector lock override; when asserted, prevents program/erase of protected sectors - adds physical layer security beyond software locks.

Key Features

Feature	Design Value
Page Mode Read	32-byte aligned page access with 15 ns subsequent reads - cuts average read latency by >60% vs. full random access in sequential code fetch.
Embedded Algorithm Controller (EAC)	On-chip state machine executing program/erase/suspend/resume without host CPU intervention - frees MCU resources during long-duration flash operations.
Versatile I/O (VIO)	Independent VIO supply (1.65–3.6 V) decoupled from VCC - permits direct connection to mixed-voltage SoC buses without external level translation.
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with dual lock bits - stores immutable root keys or device-unique identifiers for secure boot chain enforcement.
Common Flash Interface (CFI)	Standardized CFI query table at fixed address - enables automatic driver detection and configuration in Linux/U-Boot without hard-coded parameters.

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency and guaranteed 20-year data retention at 85°C.

Use Value: Eliminates external SRAM cache and reduces BOM count by enabling direct execution from flash, while ASP and OTP prevent unauthorized firmware modification.

Use Scenario: Holding safety-critical boot code and sensor calibration data in front-camera modules compliant with ISO 26262 ASIL-B requirements.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified parallel NOR flash serving as primary boot source for automotive SoCs with hardware ECC and sector locking.

Use Value: Meets automotive temperature and reliability mandates; OTP region stores cryptographic keys validated at production, preventing runtime tampering.

Medical Imaging System Configuration

Telecom Base Station BIOS

Use Scenario: Storing FPGA configuration bitstreams and calibration profiles in portable ultrasound devices requiring rapid power-on and field-upgradable settings.

IC Role / Device Role / Timing Role: High-reliability configuration store with 100,000 erase cycles and suspend/resume capability to avoid corruption during unexpected power loss.

Use Value: Enables safe in-field updates of imaging algorithms without halting diagnostic operation - suspend feature pauses erase mid-cycle for immediate response to user input.

Use Scenario: Hosting BIOS and platform initialization firmware in carrier-grade 5G baseband units deployed in outdoor cabinets with wide thermal swings.

IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +105°C) parallel flash delivering deterministic 15 ns page reads for fast POST execution and secure boot verification.

Use Value: Supports dual-bank firmware layout with ASP-locked sectors - allows atomic firmware swaps and rollback recovery without external supervision.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package; slightly higher tACC (110 ns) under Versatile I/O mode.	Targeted at space-constrained PCBs where board area is prioritized over manual reworkability.	Select when footprint reduction and automated assembly outweigh hand-soldering serviceability needs.
MX29GL512FHI-90G	Macronix 512 Mb parallel NOR; 90 ns tACC; no integrated ECC; requires external error handling; lacks OTP array and ASP flexibility.	Suitable for cost-sensitive consumer applications where ECC and security features are omitted.	Choose only if system-level ECC is already implemented and sector protection granularity is not required.

Compared with S29GL512S10DHA023, the TSOP-packaged Infineon variant offers superior serviceability and thermal performance in convection-cooled systems, while the LAE BGA alternative trades repairability for density, and the Macronix part sacrifices on-die reliability features to meet aggressive BOM targets.

Availability

S29GL512S10DHA023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S10DHA023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and security solutions for automotive, industrial, and IoT markets.

The GL-S family was designed specifically for embedded systems demanding high-density, low-power, and robust parallel NOR flash with integrated reliability features - targeting boot code, firmware, and secure configuration storage.

FAQ

What is the maximum operating temperature range for S29GL512S10DHA023?

This part is rated for Industrial Plus operation from –40°C to +105°C, verified per Infineon's qualification test plan and documented in the 001-98285 Rev. *U datasheet Section 10.4. It meets JEDEC JESD22-A108 stress testing for high-temperature endurance and is suitable for enclosed, fanless industrial enclosures.

Does S29GL512S10DHA023 support hardware reset recovery during erase operations?

Yes. Asserting RESET# asynchronously aborts any active program or erase operation, clears internal state machines, and returns the device to read mode within 100 µs. This behavior is guaranteed per datasheet Section 8.5 and enables safe recovery from power instability without requiring external watchdog coordination.

Can the OTP array be programmed multiple times?

No. The 1024-byte OTP array is physically one-time programmable: each bit can be written from '1' to '0' only once. Once locked via the dedicated OTP lock bits, further writes are blocked permanently. This is implemented using fuse-based metal-layer programming, as confirmed in Section 2.6 and 3.3 of the datasheet.

Is the 512-byte write buffer usable across sector boundaries?

No. The write buffer operates strictly within a single 128 kB sector. Attempting to program across sector boundaries triggers a command error and sets the status register's VPP error bit. Buffer writes must be aligned to sector boundaries and cannot span multiple sectors - this constraint is enforced by the embedded algorithm controller per Section 5.2.

S29GL512S10DHA023 Specifications

Product attributes: Attribute value

Manufacturer:: Spansion

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Bulk

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512S10DHA023 FAQ

1.How can I place an order for S29GL512S10DHA023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10DHA023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10DHA023 reliable?

The price and inventory of S29GL512S10DHA023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10DHA023 is usually 5 days.

3.What payment methods are accepted for S29GL512S10DHA023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10DHA023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10DHA023?

S29GL512S10DHA023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10DHA023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10DHA023?

For technical support, including S29GL512S10DHA023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10DHA023 requirements.

6.How does Aetrix verify that S29GL512S10DHA023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10DHA023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10DHA023 meets industry standards.

7.What is the process for return or replacement of S29GL512S10DHA023?

All S29GL512S10DHA023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10DHA023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10DHA023 part is unused and in its original packaging.

Return procedure for S29GL512S10DHA023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…