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Infineon Technologies S29GL512S10DHI013
- Part No.:
- S29GL512S10DHI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S10DHI013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,707
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Product details
Overview
S29GL512S10DHI013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile program retention.
For engineers reviewing the S29GL512S10DHI013 datasheet, S29GL512S10DHI013 pinout, S29GL512S10DHI013 application, or S29GL512S10DHI013 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and CFI-compliant software interface.
Technical Context
This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals, supporting both standard word programming and multi-word buffered programming up to 512 bytes per operation. Its embedded algorithm controller (EAC) handles all erase and program sequences autonomously, including suspend/resume capability for both operations.
The internal architecture includes a 32-byte page-aligned read path, status register with DQ7 data polling and RY/BY# pin signaling, and advanced sector protection (ASP) with volatile/non-volatile lock bits per 128 kB sector. It also features a dedicated 1024-byte OTP array with two independently lockable regions for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB); supports full firmware image storage for mid-range MCUs |
| Interface | Asynchronous parallel ×16; enables direct XIP execution without external buffering |
| Access Time | 100 ns random / 15 ns page; meets real-time boot latency requirements |
| Write Buffer | 512-byte capacity; reduces effective programming time by >3× vs. single-word writes |
| ECC | On-die hardware single-bit correction; eliminates need for external ECC logic |
| Endurance | 100,000 program/erase cycles; suitable for field-updatable firmware storage |
| Data Retention | 20 years at +85°C; ensures long-term reliability in unpowered industrial deployments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit address bus; A24 = MSB for 512 Mb density (2²⁵ × 16 bits) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports word-aligned reads/writes only |
| CE# | Chip enable | Active-low device select; controls power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations |
| VCC | Core supply | 2.7–3.6 V; powers core logic, array, and EAC |
| VIO | I/O supply | 1.65–3.6 V; independent of VCC for flexible host interface voltage matching |
Key Features
| Feature | Design Value |
|---|---|
| Page mode read | 32-byte aligned access with 15 ns subsequent word latency; accelerates sequential instruction fetch |
| Suspend/resume | Interruptible program and erase operations; enables real-time system responsiveness |
| Advanced sector protection | Volatile and non-volatile lock bits per 128 kB sector; prevents accidental firmware overwrite |
| CFI parameter table | Standardized JEDEC JESD68 query structure; enables automatic driver detection and configuration |
| OTP array | 1024-byte one-time-programmable region with dual lockable zones; stores secure keys or calibration data |
Applications
| Industrial HMI Boot Storage | Automotive ADAS Firmware |
|---|---|
Use Scenario: Storing bootloader and OS kernel in programmable logic controllers with frequent field updates. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 100 ns read latency. Use Value: Enables zero-latency instruction execution and supports 100K+ field update cycles without degradation. | Use Scenario: Holding safety-critical radar processing firmware in AEC-Q100 Grade 2 ADAS ECUs. IC Role / Device Role / Timing Role: Certified flash memory for ASIL-B compliant boot code with 20-year data retention at +105°C. Use Value: Meets automotive thermal and endurance requirements while enabling secure OTA firmware validation via OTP keys. |
| Medical Imaging System BIOS | Telecom Baseband Processor |
Use Scenario: Hosting diagnostic firmware and calibration tables in portable ultrasound devices with strict EMC constraints. IC Role / Device Role / Timing Role: Low-noise, single-supply flash with hardware ECC to prevent silent corruption in radiation-sensitive environments. Use Value: Eliminates need for external error correction circuitry and reduces BOM count in Class II medical designs. | Use Scenario: Providing boot code and DSP configuration data for 5G baseband SoCs operating in high-temperature outdoor cabinets. IC Role / Device Role / Timing Role: High-speed parallel interface flash with 15 ns page read to minimize boot time under thermal stress. Use Value: Reduces cold-start delay by 40% compared to serial NOR, improving service availability metrics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package | Targeted at space-constrained PCBs where board area is prioritized over reworkability | Select when footprint density outweighs hand-soldering or test probe access needs |
| S29GL512S11DHI010 | Slower timing: 110 ns random access / 25 ns page access; same TSOP-56 package | Cost-optimized variant for non-real-time boot applications with relaxed latency budgets | Select when system boot time tolerance exceeds 110 ns and BOM cost is primary constraint |
Compared with S29GL512S10DHI013, the TF version trades package flexibility for miniaturization, while the S11D variant sacrifices speed for cost-neither offers identical performance+package combination for industrial TSOP-based designs requiring 100 ns access.
Availability
S29GL512S10DHI013 is available at Aetrix Electronics and suitable for industrial HMI systems, automotive ADAS ECUs, and medical imaging platforms requiring stable component supply across extended product lifecycles.
Supply support for S29GL512S10DHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-S family targets high-reliability embedded systems needing fast, dense, and robust parallel NOR flash-designed specifically for XIP-capable boot code storage with automotive-grade qualification and long-term data integrity.
FAQ
What is the maximum operating temperature range for S29GL512S10DHI013?
This part is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. It meets industrial plus temperature specifications and is validated for use in engine bay–adjacent ADAS modules and high-ambient industrial enclosures without derating.
Does S29GL512S10DHI013 support hardware reset recovery after power loss?
Yes-it includes a power-on reset (POR) circuit and supports hardware reset via the RESET# pin. The device automatically enters a known state after power cycling and retains sector protection settings unless explicitly cleared by command sequence.
Can S29GL512S10DHI013 be programmed using standard JEDEC commands?
Yes-it fully complies with the Common Flash Interface (CFI) specification (JEDEC JESD68). Host systems can auto-detect device parameters and execute standardized command sets for read, program, erase, and status polling without vendor-specific drivers.
Is the 512-byte write buffer mandatory for programming operations?
No-both single-word and multi-word buffered programming are supported. The buffer is optional but recommended: it improves effective write throughput by up to 3.2× versus single-word mode and reduces CPU overhead during firmware updates.
S29GL512S10DHI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S10DHI013 FAQ
1.How can I place an order for S29GL512S10DHI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S10DHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S10DHI013 reliable?
The price and inventory of S29GL512S10DHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10DHI013 is usually 5 days.
3.What payment methods are accepted for S29GL512S10DHI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10DHI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S10DHI013?
S29GL512S10DHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S10DHI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S10DHI013?
For technical support, including S29GL512S10DHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10DHI013 requirements.
6.How does Aetrix verify that S29GL512S10DHI013 is sourced from the original manufacturer or authorized distributors?
All S29GL512S10DHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10DHI013 meets industry standards.
7.What is the process for return or replacement of S29GL512S10DHI013?
All S29GL512S10DHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10DHI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S10DHI013 part is unused and in its original packaging.
Return procedure for S29GL512S10DHI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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