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Infineon Technologies S29GL512S10DHI020

Name: S29GL512S10DHI020
Brand: Infineon Technologies
SKU: S29GL512S10DHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10DHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S10DHI020.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S10DHI020 from Infineon is a 512 Mb (64 MB), 16-bit parallel NOR flash memory IC using 65 nm MIRRORBIT™ Eclipse technology, with 15 ns page access time, 100 ns random access time, and single 2.7–3.6 V supply for read/program/erase. It features 512-byte write buffer, hardware ECC for single-bit correction, uniform 128 kB sectors, and operates across industrial temperature range (–40°C to +85°C) in 56-pin TSOP package - deployed in boot code storage for industrial HMIs.

For engineers reviewing the S29GL512S10DHI020 datasheet, S29GL512S10DHI020 pinout, S29GL512S10DHI020 application, or S29GL512S10DHI020 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, sector-level erase granularity, OTP array availability, Versatile I/O voltage support (1.65 V to VCC), and AEC-Q100 grade compatibility options.

Technical Context

This device implements an embedded algorithm controller (EAC) that manages autonomous program and erase operations without external intervention. Its architecture supports page-mode reads (32-byte aligned, 15 ns subsequent access) and buffer programming of up to 512 bytes per command, reducing effective programming time versus byte-by-byte methods.

The flash integrates hardware-based ECC with automatic single-bit error correction and status reporting via status register, data polling, or RY/BY# pin. Sector protection includes volatile and non-volatile lock bits per 128 kB sector, plus a dedicated 1024-byte OTP array with two independently lockable regions.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - enables full firmware image storage for mid-complexity microcontrollers.
Access time	100 ns random access (VCC = VIO), 15 ns page access - meets real-time boot latency requirements in industrial controllers.
Write buffer size	512 bytes (256 words) - allows burst programming of contiguous sectors, improving firmware update throughput by ~4× vs standard word programming.
ECC capability	On-die single-bit error correction with detection - eliminates need for external ECC logic in safety-critical boot memory paths.
Sector size	Uniform 128 kB sectors (512 total) - simplifies partitioning for bootloader, application, and configuration storage with deterministic erase boundaries.
Operating voltage	VCC = 2.7–3.6 V; VIO = 1.65 V to VCC - supports mixed-voltage system interfacing without level shifters.
Data retention	20 years at 85°C - ensures long-term reliability in unattended industrial deployments.
Endurance	100,000 program/erase cycles per sector - sufficient for field-upgradable firmware with over-the-air update logging.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), Type I, 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit address bus supporting full 512 Mb addressing (A24 = MSB); word-aligned only - no byte enable required.
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports both read and write transfers on same pins with direction controlled by WE# and OE#.
CE#	Chip enable	Active-low chip select; device enters low-power standby when high - enables multi-device memory decoding.
OE#	Output enable	Active-low read control; gates output drivers - used for read gating and bus sharing in shared-memory systems.
WE#	Write enable	Active-low write control; initiates internal program/erase algorithms when asserted with valid command sequence.
RY/BY#	Ready/Busy indicator	Open-drain active-low signal; low during embedded operations - provides hardware flow control without polling overhead.
RESET#	Hardware reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations - critical for safe power-cycle recovery.
WP#	Write protect	Active-low hardware sector protection enable; disables program/erase when asserted - prevents accidental corruption during power transitions.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns subsequent word latency - reduces boot code fetch time in XIP applications.
Embedded Algorithm Controller (EAC)	Fully autonomous program/erase execution with suspend/resume - enables concurrent host processing during flash updates.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables OS/driver auto-detection and vendor-agnostic firmware tools.
Versatile I/O (VIO)	Independent VIO supply (1.65 V to VCC) - permits direct interfacing with 1.8 V or 3.3 V logic without external level translation.
Advanced Sector Protection (ASP)	Volatile and non-volatile lock bits per 128 kB sector - supports secure bootloader partitioning and field-update isolation.
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with two lockable zones - stores cryptographic keys or calibration data with irreversible write protection.

Applications

Industrial HMI Boot Memory

Automotive Instrument Cluster Firmware

Use Scenario: Storing boot loader and kernel image for ARM Cortex-A series processors in panel-mounted human-machine interfaces.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 100 ns read latency.

Use Value: Enables sub-200 ms cold boot time while supporting field firmware updates via 512-byte buffered programming.

Use Scenario: Holding calibrated display firmware and safety-critical gauge logic in AEC-Q100 Grade 3 instrument clusters.

IC Role / Device Role / Timing Role: Automotive-grade boot memory with 128 kB sector erase for incremental OTA updates.

Use Value: Meets ASIL-B functional safety requirements through hardware ECC and sector-level write protection.

Medical Diagnostic Device Storage

Programmable Logic Controller (PLC) Configuration

Use Scenario: Retaining FDA-approved diagnostic algorithms and calibration tables in portable ultrasound units.

IC Role / Device Role / Timing Role: Secure, long-retention storage with OTP region for immutable calibration constants.

Use Value: Guarantees 20-year data integrity at 85°C and supports audit-ready firmware versioning via CFI identification.

Use Scenario: Hosting ladder logic runtime images and I/O mapping tables in DIN-rail mounted PLCs.

IC Role / Device Role / Timing Role: High-endurance configuration memory supporting 100,000+ reprogramming cycles during commissioning.

Use Value: Eliminates external ECC ICs and simplifies BOM with integrated single-bit correction and sector lock control.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI020	Same core spec, but in 64-ball LAE Fortified BGA (9 mm × 9 mm) - no TSOP footprint compatibility.	Targeted at space-constrained automotive modules requiring higher thermal performance.	Select when board layout prioritizes compactness and thermal dissipation over legacy TSOP socket reuse.
MX29GL512FHT2I-90G	Macronix 512 Mb parallel NOR; 90 ns random access, no hardware ECC, no OTP array, CFI compliant.	Lacks integrated ECC and secure silicon - requires external error handling and key management.	Choose for cost-sensitive industrial designs where ECC is implemented in software or external logic.

Compared with S29GL512S10DHI020, the TSOP-packaged Infineon part delivers hardware ECC and OTP security out-of-box, while the LAE-BGA variant trades footprint for thermal robustness, and the Macronix alternative reduces cost but shifts ECC responsibility to the system level.

Availability

S29GL512S10DHI020 is available at Aetrix Electronics and suitable for industrial HMI boot memory, automotive instrument cluster firmware, and medical diagnostic device storage requiring stable component supply, long-life qualification, and AEC-Q100-compatible sourcing.

Supply support for S29GL512S10DHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

The GL-S family targets embedded systems needing reliable, high-density parallel NOR flash with XIP capability, hardware ECC, and automotive-grade qualification - designed specifically for boot code, firmware, and secure configuration storage.

FAQ

Does S29GL512S10DHI020 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 100 ns random access and 15 ns page-mode latency, enabling direct CPU instruction fetch from flash without RAM loading. Its architecture includes dedicated address/data latching and fast state control to sustain continuous instruction streams in Cortex-M and ARM9-based designs.

What is the function of the STB pin on S29GL512S10DHI020?

The STB (Standby) pin is not present on this TSOP variant. S29GL512S10DHI020 uses CE# for standby control: asserting CE# high places the device in low-power standby mode (100 µA typical), eliminating the need for a separate STB signal found only in certain BGA variants.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP (One-Time Programmable) array consists of fuse-based cells. Once a bit is programmed (set to '0'), it cannot be reverted to '1'. Two independent lock bits prevent further writes to each 512-byte region, ensuring permanent, tamper-resistant storage of keys or calibration data.

How does hardware ECC interact with the status register during read operations?

During every read, internal ECC logic checks the 16-bit data word. If a single-bit error is detected, it is corrected on-the-fly and the corrected data is output; the ECC status bit (bit 6) in the status register is set to '1', indicating correction occurred. No interrupt or external signaling is generated - correction is fully transparent.

S29GL512S10DHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512S10DHI020 FAQ

1.How can I place an order for S29GL512S10DHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10DHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10DHI020 reliable?

The price and inventory of S29GL512S10DHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10DHI020 is usually 5 days.

3.What payment methods are accepted for S29GL512S10DHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10DHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10DHI020?

S29GL512S10DHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10DHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10DHI020?

For technical support, including S29GL512S10DHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10DHI020 requirements.

6.How does Aetrix verify that S29GL512S10DHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10DHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10DHI020 meets industry standards.

7.What is the process for return or replacement of S29GL512S10DHI020?

All S29GL512S10DHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10DHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10DHI020 part is unused and in its original packaging.

Return procedure for S29GL512S10DHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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