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Infineon Technologies S29GL512S10DHI023
- Part No.:
- S29GL512S10DHI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S10DHI023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,161
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Product details
Overview
S29GL512S10DHI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.
For engineers reviewing the S29GL512S10DHI023 datasheet, S29GL512S10DHI023 pinout, S29GL512S10DHI023 application, or S29GL512S10DHI023 equivalent, key selection criteria include asynchronous 16-bit parallel interface timing, Versatile I/O (1.65–VCC VIO), 512-byte write buffer performance, OTP array security, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous read/write operations via suspend/resume commands and supporting XIP (execute-in-place) execution without external RAM buffering. Its command-set-driven embedded algorithm controller (EAC) manages program/erase cycles autonomously, with status reporting via RY/BY# pin, data polling, or status register reads.
The GL-S family uses word-aligned addressing (A0–A24), 32-byte page-aligned reads, and sector-level protection with volatile/non-volatile ASP. The 1024-byte OTP array includes two lockable regions for secure boot code or calibration data, and CFI parameter tables enable host software auto-configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words - supports full firmware image storage for mid-tier microcontrollers. |
| Access time (random) | 100 ns at VCC = VIO - enables direct CPU instruction fetch without wait states in 80 MHz+ bus systems. |
| Page access time | 15 ns - accelerates sequential code execution within same 32-byte page boundary. |
| Write buffer size | 512 bytes (256 words) - reduces average programming time by >3× vs. single-word writes. |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot ROMs. |
| Endurance & retention | 100,000 program/erase cycles; 20-year data retention - meets long-life requirements for industrial gateways and automotive ECUs. |
| Operating voltage | VCC: 2.7–3.6 V; VIO: 1.65–VCC - allows interfacing with mixed-voltage SoCs (e.g., 1.8 V I/O, 3.3 V core). |
| Temperature grade | Industrial (–40°C to +85°C) - qualified per JEDEC JESD22-A108, suitable for under-hood and factory-floor deployments. |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | Word-aligned address bus (A0 LSB); A24 MSB selects up to 4M words (512 Mb). No byte addressing. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports high-speed page reads and buffer writes with no direction control pin required. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables internal logic only when asserted. |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles without affecting internal state. |
| WE# | Write enable | Active-low write strobe; initiates command latching or data loading into write buffer. |
| RY/BY# | Ready/Busy indicator | Open-drain active-low signal; asserts low during program/erase; used for hardware flow control without polling. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations. |
| WP# | Write protect | Active-low hardware sector protection override; disables program/erase when asserted, independent of software locks. |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous 32-byte page read | Enables burst-like instruction fetches with 15 ns intra-page access - critical for deterministic real-time boot latency. |
| 512-byte programming buffer | Allows full-page writes in one command sequence, reducing host CPU overhead and improving effective write throughput to 1.5 MBps. |
| Automatic ECC generation/correction | Single-bit correction applied transparently during read; eliminates software ECC overhead and improves system reliability in unattended operation. |
| Uniform 128-kbyte sector erase | Eliminates erase granularity mismatch with typical bootloader partition sizes, simplifying firmware update design and wear leveling. |
| Advanced sector protection (ASP) | Supports both volatile (power-cycle reset) and non-volatile (permanent) locking per sector - essential for secure boot and calibration data integrity. |
| 1024-byte OTP array with dual lock regions | Provides tamper-resistant storage for cryptographic keys or device-specific parameters, with independent lock bits preventing accidental overwrite. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and bootloader code in AEC-Q100 grade 3 ECU modules. IC Role / Device Role / Timing Role: Primary non-volatile boot ROM with XIP capability and hardware ECC for ASIL-B functional safety compliance. Use Value: 100,000 erase cycles and 20-year retention ensure field-upgradable firmware over 15+ year vehicle lifetime without degradation. |
Use Scenario: Holding firmware images and configuration data for programmable logic controllers operating in factory automation environments. IC Role / Device Role / Timing Role: Asynchronous parallel flash serving as main program memory for ARM Cortex-M7-based controllers with deterministic boot timing. Use Value: 15 ns page access time enables sub-100 µs cold boot initialization, meeting tight machine cycle synchronization requirements. |
| Medical Imaging System Boot Memory | Telecom Base Station Configuration Storage |
|
Use Scenario: Secure storage of FPGA bitstreams and safety-critical boot firmware in FDA-regulated imaging equipment. IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked calibration coefficients and hardware ECC to prevent silent data corruption. Use Value: Dual-lock OTP regions allow separate protection of vendor keys and field-service calibration data, satisfying IEC 62304 traceability requirements. |
Use Scenario: Retaining configuration profiles, RF calibration tables, and fail-safe recovery images in outdoor 5G base station radios. IC Role / Device Role / Timing Role: High-reliability parallel flash with Versatile I/O (1.8 V/3.3 V compatibility) interfacing to multi-voltage baseband processors. Use Value: 1.65–3.6 V VIO range eliminates level-shifter components, reducing BOM cost and PCB area in space-constrained RF modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11DHI023 | 110 ns random access time (vs. 100 ns); identical density, package, and feature set. | Lower timing margin for high-frequency bus interfaces; acceptable where 10 ns relaxation is permitted in timing budget. | Select when cost sensitivity outweighs marginal timing advantage and full 100 ns performance is not required. |
| MX29GL512FHTI-90G | Micron part; 90 ns random access, but lacks integrated hardware ECC and OTP array; requires external error management. | Not suitable for safety-critical boot storage without added software/firmware complexity. | Choose only for legacy designs already using MX29GL series and where ECC is handled externally or not required. |
Compared with S29GL512S11DHI023, the -10DHI023 offers tighter timing for demanding real-time boot paths; versus MX29GL512FHTI-90G, it delivers built-in ECC and OTP security-reducing validation effort and increasing system robustness without additional components.
Availability
S29GL512S10DHI023 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and medical imaging system boot memory requiring stable component supply and long-term lifecycle support.
Supply support for S29GL512S10DHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash - specifically designed for boot code storage, firmware updates, and configuration retention in harsh environments.
FAQ
Is S29GL512S10DHI023 pin-compatible with earlier S29GL512P or S29GL512N variants?
No. S29GL512S uses a revised command set, enhanced ECC architecture, and updated timing specifications compared to P/N generations. Pinout is identical in 56-pin TSOP, but software drivers require revision due to differences in status register layout, CFI table structure, and OTP access protocol.
Does this device support synchronous burst reads or only asynchronous operation?
S29GL512S10DHI023 supports asynchronous reads exclusively - including standard random access and page-mode reads. It does not implement clocked (synchronous) interfaces like QSPI or DDR; all timing is governed by CE#, OE#, and WE# setup/hold relationships per AC specifications.
Can the 1024-byte OTP array be reprogrammed after initial lock?
No. Once either OTP lock bit is set (via specific unlock-and-program command sequence), that region becomes permanently read-only. The two lock bits operate independently, allowing one region to remain programmable while the other is locked - but neither can be unlocked after programming.
What is the maximum sustained write throughput using the 512-byte buffer?
Measured buffer programming rate is 1.5 MBps under typical conditions (VCC = 3.0 V, TA = 25°C), corresponding to ~337 µs per 512-byte write. Actual throughput depends on host bus turnaround time and command overhead, but the device guarantees ≤350 µs worst-case buffer write completion.
S29GL512S10DHI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512S10DHI023 FAQ
1.How can I place an order for S29GL512S10DHI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S10DHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S10DHI023 reliable?
The price and inventory of S29GL512S10DHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10DHI023 is usually 5 days.
3.What payment methods are accepted for S29GL512S10DHI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10DHI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S10DHI023?
S29GL512S10DHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S10DHI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S10DHI023?
For technical support, including S29GL512S10DHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10DHI023 requirements.
6.How does Aetrix verify that S29GL512S10DHI023 is sourced from the original manufacturer or authorized distributors?
All S29GL512S10DHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10DHI023 meets industry standards.
7.What is the process for return or replacement of S29GL512S10DHI023?
All S29GL512S10DHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10DHI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S10DHI023 part is unused and in its original packaging.
Return procedure for S29GL512S10DHI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S10DHI023 Tags
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