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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S10DHSS10

Name: S29GL512S10DHSS10
Brand: Infineon Technologies
SKU: S29GL512S10DHSS10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10DHSS10

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S10DHSS10.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:3,560

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Product details

Overview

S29GL512S10DHSS10 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, 3.0 V core supply (2.7–3.6 V), 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) and supports asynchronous read, buffer programming (up to 512 bytes), and uniform 128-kbyte sector erase - deployed in boot code storage for industrial HMIs and network edge controllers.

For engineers reviewing the S29GL512S10DHSS10 datasheet, S29GL512S10DHSS10 pinout, S29GL512S10DHSS10 application, or S29GL512S10DHSS10 equivalent, key selection criteria include verified 100,000 program/erase cycles, CFI-compliant interface, Versatile I/O (1.65–VCC VIO), OTP array support, and TSOP-56/LAA/LAE/VBU package compatibility.

Technical Context

This device implements an embedded algorithm controller (EAC) that executes autonomous program and erase operations without external timing control. Its MIRRORBIT™ Eclipse architecture on 65-nm process enables simultaneous bit-line sensing for faster page reads and reduced power per operation.

The flash integrates dual protection mechanisms: Advanced Sector Protection (ASP) with volatile/non-volatile lock bits per sector, and a dedicated 1024-byte one-time-programmable (OTP) array split into two lockable regions - supporting secure boot key storage and device identity binding.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware image storage for mid-tier microcontrollers
Random Access Time	100 ns at VCC = VIO; enables direct XIP execution from flash with minimal CPU stall
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages
Programming Buffer	512 bytes; reduces effective programming time by batching writes without host intervention
ECC Support	Internal hardware single-bit error correction; eliminates need for external ECC logic or software overhead
Endurance & Retention	100,000 program/erase cycles / 20-year data retention; validated for long-life industrial deployments
Operating Voltage	VCC: 2.7–3.6 V; VIO: 1.65–VCC; decouples I/O voltage from core, easing interface to mixed-voltage SoCs

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit address bus; A24 selects highest 128-kB sector (GL512S max address space)
DQ0–DQ15	Data I/O lines	16-bit bidirectional bus; supports word-aligned reads/writes only
CE#	Chip enable	Active-low enable; controls device selection in multi-chip memory systems
OE#	Output enable	Active-low gate for data output drivers; used during read operations
WE#	Write enable	Active-low strobe for write cycles; initiates command sequences and data latching
RY/BY#	Ready/Busy indicator	Open-drain output; low during embedded program/erase, high when ready
WP#	Hardware write protect	Active-low pin; disables sector erase and program when asserted
RESET#	Hardware reset	Active-low asynchronous reset; forces device into standby and clears internal state

Key Features

Feature	Design Value
Asynchronous Page Read	32-byte aligned page access with 15 ns intra-page cycle time - accelerates sequential firmware fetch
Buffer Programming	Up to 512-byte write bursts reduce host CPU overhead and improve effective throughput to 1.5 MBps
Hardware ECC	On-the-fly single-bit correction without software intervention - ensures reliability in unattended systems
Uniform Sector Architecture	64 × 128-kB sectors enable fine-grained firmware partitioning (e.g., bootloader, app, config)
Secure OTP Array	1024-byte one-time-programmable region with dual lock bits - stores cryptographic keys or calibration data

Applications

Industrial HMI Boot Storage

Network Edge Router Firmware

Use Scenario: Storing boot loader and kernel image for ARM-based human-machine interface controllers operating in factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP capability and deterministic 100 ns read latency.

Use Value: Eliminates external SRAM requirement for boot code execution; supports field firmware updates via sector erase.

Use Scenario: Holding configuration tables, routing tables, and firmware images in carrier-grade Ethernet edge routers.

IC Role / Device Role / Timing Role: High-reliability firmware repository with hardware write protection and OTP-secured credentials.

Use Value: Enables secure remote reprogramming while maintaining AEC-Q100 grade 3 qualification for extended temperature operation.

Automotive ADAS Camera Module

Medical Imaging Control Board

Use Scenario: Storing calibration data and firmware for automotive surround-view camera modules requiring AEC-Q100 Grade 2 compliance.

IC Role / Device Role / Timing Role: Non-volatile parameter storage with 105°C operational capability and sector-level protection.

Use Value: Guarantees data integrity under thermal stress; OTP region secures sensor calibration coefficients against overwrite.

Use Scenario: Hosting FPGA configuration bitstreams and safety-critical boot code in portable ultrasound imaging systems.

IC Role / Device Role / Timing Role: Radiation-tolerant, long-retention flash with hardware ECC for diagnostic firmware integrity.

Use Value: Meets 20-year data retention requirement for medical device lifecycle; ECC prevents silent corruption of imaging control logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11DHSS10	Slower random access (110 ns vs. 100 ns); identical density, package, and feature set	Acceptable where 10 ns latency margin is available; same footprint and command set	Select for cost-sensitive designs where timing budget permits relaxed tACC
MX29GL512FHI-11G	Macronix part; 110 ns tACC, no integrated hardware ECC, requires external error handling	Lacks on-die ECC and OTP array; not suitable for safety-critical or secure boot use cases	Choose only if ECC and secure storage are handled externally or omitted

Compared with S29GL512S11DHSS10 and MX29GL512FHI-11G, the S29GL512S10DHSS10 delivers tighter timing, built-in ECC, and OTP security - making it optimal for XIP-capable, safety-aware embedded systems where firmware integrity and deterministic latency are critical.

Availability

S29GL512S10DHSS10 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network edge router firmware, and automotive ADAS camera modules requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL512S10DHSS10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash - optimized for boot code execution, firmware updates, and trusted data storage in harsh environments.

FAQ

What is the maximum operating temperature range for S29GL512S10DHSS10?

The S29GL512S10DHSS10 is rated for industrial temperature range: –40°C to +85°C. This grade is explicitly defined in the datasheet's "Temperature range / grade" section and applies to the DHSS10 ordering suffix. It does not support the +105°C automotive grade variants (e.g., DHSS20).

Does this device support Common Flash Interface (CFI)?

Yes, the S29GL512S10DHSS10 implements the Common Flash Interface (CFI) parameter table per JEDEC JESD68-A. The CFI query commands return device geometry, timing, and command set information, enabling OS-agnostic flash drivers and automated firmware update tools.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP (One-Time-Programmable) array consists of fuse-based cells. Once a byte is programmed, it cannot be erased or rewritten. Each of the two lockable regions can be permanently locked via dedicated command sequences to prevent further writes.

Is hardware reset (RESET#) required before power-up?

No. The device features internal Power-On Reset (POR) circuitry that automatically initializes internal logic upon VCC ramp. RESET# is optional and used only for synchronous recovery from error states or forced reinitialization during operation - not required for normal startup.

S29GL512S10DHSS10 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: 0°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512S10DHSS10 FAQ

1.How can I place an order for S29GL512S10DHSS10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10DHSS10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10DHSS10 reliable?

The price and inventory of S29GL512S10DHSS10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10DHSS10 is usually 5 days.

3.What payment methods are accepted for S29GL512S10DHSS10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10DHSS10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10DHSS10?

S29GL512S10DHSS10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10DHSS10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10DHSS10?

For technical support, including S29GL512S10DHSS10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10DHSS10 requirements.

6.How does Aetrix verify that S29GL512S10DHSS10 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10DHSS10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10DHSS10 meets industry standards.

7.What is the process for return or replacement of S29GL512S10DHSS10?

All S29GL512S10DHSS10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10DHSS10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10DHSS10 part is unused and in its original packaging.

Return procedure for S29GL512S10DHSS10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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