Infineon Technologies S29GL512S10FAI013
- Part No.:
- S29GL512S10FAI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S10FAI013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,473
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Product details
Overview
S29GL512S10FAI013 from Spansion is a 512-Mbit (64 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-enabled block locking, and is used in boot code storage for industrial controllers and firmware storage in network edge devices.
For engineers reviewing the S29GL512S10FAI013 datasheet, S29GL512S10FAI013 pinout, S29GL512S10FAI013 application, or S29GL512S10FAI013 equivalent, key selection criteria include VIO/VCC compatibility (2.7–3.6 V), sector protection configuration (highest address protected), power-up default state of DYB (unprotected), and Read Password Mode operation - all confirmed in Spansion's official ordering supplement S29GL_128S_01GS_Pb_SP Rev 03.
Technical Context
This device implements a parallel asynchronous interface with standard Intel-compatible command set and supports both CFI query and JEDEC-compliant boot-block architecture. It integrates embedded erase and program algorithms with hardware acceleration for single-word programming and uniform 128-KB sector erase.
Memory organization is 67,108,864 × 8 bits (or 33,554,432 × 16 bits), with 512 uniform sectors and support for temporary and permanent sector protection via software commands or hardware write-protect pins. The LAA064 Fortified BGA package enables high-density PCB layout while maintaining signal integrity for 100 ns timing compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mbit (64 MB) - sufficient for full firmware images and dual-bank boot code in industrial gateways |
| Access Time | 100 ns - enables direct execution (XIP) from flash in real-time control applications without wait states |
| Voltage Range | VIO = VCC = 2.7–3.6 V - single-supply operation simplifies power design for 3.3 V systems |
| Temperature Range | –40°C to +85°C - qualified for industrial ambient environments including factory automation and outdoor telecom equipment |
| Package | LAA064 Fortified BGA, 11 mm × 13 mm - robust mechanical construction with enhanced thermal dissipation vs standard BGA |
| Sector Protection | Highest-address sector protected by default - ensures bootloader region remains immutable unless explicitly unlocked |
| DYB State | Power-up in unprotected state - allows immediate firmware update capability after reset without initialization sequence |
Pinout & Package
Package: Fortified Ball-Grid Array (LAA064), 64-ball, 11 mm × 13 mm body, 0.8 mm pitch, RoHS-compliant Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address Inputs | 23-bit address bus supporting full 64 MB linear addressing (A22 = MSB) |
| DQ0–DQ15 | Data I/O (x16 mode) | 16-bit bidirectional data bus; operates in x8 mode when BYTE# = HIGH |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory systems |
| OE# | Output Enable | Active-low control for read data output gating; critical for bus contention management |
| WE# | Write Enable | Active-low signal initiating internal program/erase cycles during command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: LOW during embedded operations, HIGH when ready |
| WP#/ACC | Write Protect / Acceleration | Hardware sector lock override (WP#) and program acceleration enable (ACC) in high VCC mode |
| BYTE# | Bus Width Select | Configures x8 (HIGH) or x16 (LOW) data interface; determines DQ0–DQ7 vs DQ0–DQ15 usage |
Key Features
| Feature | Design Value |
|---|---|
| MirrorBit Eclipse Technology | 65 nm process enabling higher density and lower power vs prior-generation NOR flash, with improved data retention (>20 years) |
| Read Password Mode | Enables secure read access control via user-defined password; prevents unauthorized firmware extraction during field service |
| Uniform 128-KB Sectors | 512 identical sectors simplify memory management in RTOS-based bootloaders and allow granular firmware updates |
| Temporary Sector Unprotection | Allows runtime unlocking of protected sectors for field firmware patches without requiring full chip erase |
| CFI Compliance | Standard Common Flash Interface implementation enables automatic detection and configuration by BIOS/UEFI and Linux MTD drivers |
Applications
| Industrial PLC Firmware Storage | Telecom Edge Router Boot Code |
|---|---|
Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers deployed in manufacturing lines. IC Role / Device Role / Timing Role: Primary non-volatile code storage executing XIP (eXecute-In-Place) during cold start and firmware recovery. Use Value: 100 ns access time eliminates wait states; industrial temperature rating ensures reliability across factory floor thermal cycling. | Use Scenario: Holding bootloader, kernel image, and configuration partition in carrier-grade edge routers operating in uncontrolled environmental enclosures. IC Role / Device Role / Timing Role: Secure, field-upgradable boot memory with password-protected read access to prevent tampering. Use Value: Read Password Mode and highest-sector protection safeguard bootloader integrity against malicious or accidental overwrite. |
| Medical Diagnostic Imaging UI | Railway Signaling Control Module |
Use Scenario: Hosting GUI firmware and calibration data in portable ultrasound and MRI console interfaces requiring deterministic boot. IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic read latency for real-time UI rendering and safety-critical diagnostics startup. Use Value: Uniform 128-KB sectors enable atomic firmware updates without disrupting active diagnostic sessions. | Use Scenario: Storing SIL-2 compliant control logic and fail-safe routines in trackside signaling units exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Radiation-tolerant, long-retention code storage with hardware write-protection for safety-critical boot sequences. Use Value: –40°C to +85°C qualification and >20-year data retention meet EN 5012x railway electronics lifecycle requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10FHAI010 | Same density, speed, and process; differs in package (standard FBGA vs fortified LAA064) and temperature grading (commercial 0°C–70°C) | Lacks industrial temp rating and mechanical reinforcement; unsuitable for extended ambient exposure | Select only for cost-sensitive, benign-environment applications where board-level thermal management is assured |
| MX29GL512FHT2I-10G | Macronix 512-Mbit NOR flash; 100 ns access, industrial temp, but uses different command set and lacks Read Password Mode | No hardware-enforced read security; requires external authentication layer for firmware confidentiality | Choose when legacy compatibility with Macronix toolchains is required and password-based read protection is not mandated |
Compared with S29GL512S10FHAI010 and MX29GL512FHT2I-10G, the S29GL512S10FAI013 uniquely combines industrial temperature operation, fortified BGA packaging for vibration resistance, and integrated Read Password Mode - making it optimal for safety- and security-critical embedded boot applications where physical and logical protection are jointly required.
Availability
S29GL512S10FAI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot code, and medical diagnostic imaging UI requiring stable component supply and long-term lifecycle assurance.
Supply support for S29GL512S10FAI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Spansion (now part of Cypress Semiconductor, acquired by Infineon in 2019) was a fabless semiconductor company specializing in NOR flash, microcontrollers, and analog solutions for embedded systems.
The S29GL-S family targets high-reliability boot code and firmware storage in industrial, networking, and automotive applications, emphasizing data integrity, security features, and long-term manufacturability.
FAQ
What is the default sector protection configuration for S29GL512S10FAI013?
The S29GL512S10FAI013 is configured with highest-address sector protection enabled by default (Model Number "01"). This ensures the bootloader region at the top of the address space remains locked against accidental writes unless explicitly unlocked via command sequence or WP# pin assertion.
Does S29GL512S10FAI013 support both x8 and x16 data bus widths?
Yes - the device supports configurable bus width via the BYTE# pin. When BYTE# is HIGH, it operates in x8 mode using DQ0–DQ7; when LOW, it operates in x16 mode using DQ0–DQ15. This flexibility allows integration into both 8-bit and 16-bit microcontroller buses without external data multiplexing.
How does Read Password Mode function in this device?
Read Password Mode requires a valid 16-byte password to be written before read access to protected sectors is granted. Once enabled, reads from protected regions return undefined data unless the correct password is presented. The mode persists across power cycles and is controlled via specific CFI command sequences defined in Spansion's S29GL-S datasheet.
Is the LAA064 package pin-compatible with standard 64-ball FBGA packages?
No - the LAA064 is a Spansion-specific "Fortified" BGA package with enhanced mechanical robustness, including reinforced solder ball structure and underfill compatibility. While footprint dimensions match standard 64-ball FBGA (11 mm × 13 mm), its mechanical specifications and thermal performance differ, requiring validation per Spansion's LAA064 mounting guidelines.
S29GL512S10FAI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S29GL512S10FAI013 FAQ
1.How can I place an order for S29GL512S10FAI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S10FAI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S10FAI013 reliable?
The price and inventory of S29GL512S10FAI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10FAI013 is usually 5 days.
3.What payment methods are accepted for S29GL512S10FAI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10FAI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S10FAI013?
S29GL512S10FAI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S10FAI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S10FAI013?
For technical support, including S29GL512S10FAI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10FAI013 requirements.
6.How does Aetrix verify that S29GL512S10FAI013 is sourced from the original manufacturer or authorized distributors?
All S29GL512S10FAI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10FAI013 meets industry standards.
7.What is the process for return or replacement of S29GL512S10FAI013?
All S29GL512S10FAI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10FAI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S10FAI013 part is unused and in its original packaging.
Return procedure for S29GL512S10FAI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S10FAI013 Tags

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M24C02-WMN6TP
STMicroelectronics
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M24C02-FMC6TG
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Microchip Technology

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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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