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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S10FAI023

Name: S29GL512S10FAI023
Brand: Infineon Technologies
SKU: S29GL512S10FAI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10FAI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S10FAI023.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S10FAI023 from Spansion is a 512-Mbit (64 MB) 3.0 V-only page-mode NOR Flash memory IC fabricated on 65 nm MirrorBit Eclipse process technology, featuring 100 ns random access time, industrial temperature range (–40°C to +85°C), and Fortified BGA package (LAA064, 11 mm × 13 mm). It supports sector protection, password-enabled block locking, and is used in boot code storage for industrial controllers and firmware retention in network edge devices.

For engineers reviewing the S29GL512S10FAI023 datasheet, S29GL512S10FAI023 pinout, S29GL512S10FAI023 application, or S29GL512S10FAI023 equivalent, key selection criteria include VIO/VCC compatibility (2.7–3.6 V), sector protection configuration (lowest-address protected), power-up default state of DYB (unprotected), and Read Password Mode operation - all confirmed in Spansion's Pb Package Supplement Rev. 03.

Technical Context

This device implements a parallel asynchronous interface with address/data multiplexing support, compatible with standard x16 bus configurations. It uses MirrorBit Eclipse charge-trapping technology to enable single-bit-per-cell density with enhanced endurance and data retention over conventional floating-gate NOR.

Embedded erase and program algorithms are executed internally without external timing control; the device supports CFI-compliant command sets and JEDEC-standard reset and status polling. Sector protection is implemented via hardware write-protect pins and software-controlled lock bits, with password verification required for protected region access in Read Password Mode.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mbit (64 MB), organized as 4,194,304 × 16-bit words - sufficient for full boot image + firmware partitioning in embedded Linux systems.
Access Time	100 ns max random access - meets timing budget for 10 MHz CPU bus interfaces without wait states.
Supply Voltage	VCC = VIO = 2.7–3.6 V - enables direct connection to 3.3 V I/O rails without level shifters.
Temperature Range	Industrial: –40°C to +85°C - qualified for deployment in uncontrolled factory-floor or outdoor telecom enclosures.
Package	LAA064 Fortified BGA, 11 mm × 13 mm, 64-ball array - provides mechanical robustness and thermal performance for reflow-soldered industrial PCBs.
Protection Mode	Lowest-address sector protected, DYB power-up unprotected, Read Password Mode enabled - ensures secure boot loader execution while allowing runtime firmware updates to upper sectors.

Pinout & Package

Package: LAA064 Fortified Ball-Grid Array (64-ball, 0.8 mm pitch, 11 mm × 13 mm footprint, RoHS-compliant).

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address Inputs	21-bit address bus supporting full 512 Mbit addressing (A0–A20); A0 least significant bit for word-level access.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports x16 configuration only - no x8/x32 mode.
CE#	Chip Enable	Active-low chip select; device enters low-power standby when high - critical for multi-device memory decoding.
OE#	Output Enable	Active-low read strobe; controls output buffer drive - enables shared bus arbitration with other peripherals.
WE#	Write Enable	Active-low signal initiating internal program/erase cycles - must meet tWP and tWH timing per datasheet.
RY/BY#	Ready/Busy Output	Open-drain status indicator; low during internal operations - used for polling instead of fixed delays.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into reading state and clears status registers - essential for recovery after power brownout.

Key Features

Feature	Design Value
MirrorBit Eclipse Technology	65 nm charge-trapping architecture enabling 100K program/erase cycles and 20-year data retention at 85°C - reduces field failure risk in long-lifecycle deployments.
Read Password Mode	Enables selective access to protected sectors only after valid password entry - prevents unauthorized firmware modification while preserving boot integrity.
Lowest-Address Sector Protection	Hardware-configured protection of first 64 KB sector (boot vector region) - ensures bootloader remains immutable during system updates.
DYB Power-Up State	Dynamic Protection Bit defaults to unprotected at power-on - eliminates need for initialization sequence before first write operation.
Fortified BGA (LAA064)	Enhanced mechanical reliability with reinforced solder joint structure - validated for >1,000 thermal cycles and vibration resistance in transportation equipment.

Applications

Industrial PLC Firmware Storage

Telecom Edge Router Boot Memory

Use Scenario: Stores boot code and real-time OS kernel for programmable logic controllers operating in factory automation environments with ambient temperatures up to 85°C.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory mapped to CPU reset vector; accessed via synchronous parallel bus during cold start.

Use Value: 100 ns access time eliminates wait states on 10 MHz bus; industrial temp rating ensures reliability across seasonal thermal swings in unconditioned control cabinets.

Use Scenario: Holds bootloader and FPGA configuration bitstream in carrier-grade edge routers deployed in outdoor street cabinets.

IC Role / Device Role / Timing Role: Standalone NOR Flash providing XIP-capable boot image; supports secure update via password-protected sector writes.

Use Value: Read Password Mode prevents tampering with boot firmware; lowest-sector protection guarantees bootloader integrity during remote firmware upgrades.

Medical Diagnostic Imaging Control

Railway Signaling System BIOS

Use Scenario: Retains calibration tables and safety-critical startup routines in portable ultrasound and MRI subsystem controllers.

IC Role / Device Role / Timing Role: Non-volatile storage for deterministic boot path; accessed during power-on self-test (POST) before DRAM initialization.

Use Value: 20-year data retention at 85°C ensures calibration persistence over device lifetime without battery-backed SRAM.

Use Scenario: Hosts fail-safe BIOS and watchdog initialization code in EN 5012x-certified railway signaling interlock units.

IC Role / Device Role / Timing Role: Secure boot memory with hardware-enforced sector protection; integrated into safety-critical boot chain verified per IEC 61508 SIL-3.

Use Value: DYB power-up unprotected state allows immediate firmware patching post-deployment; fortified BGA withstands rail vibration profiles per IEC 61373.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NOR Flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI020	Same die, TSOP-56 package (not BGA); 100 ns access; identical VCC/VIO and protection modes.	Requires PCB redesign for leaded package; less suitable for high-vibration or space-constrained layouts.	Select when legacy board layout or manual assembly favors TSOP over BGA.
S29GL512S11FAI023	Same package and protection config, but 110 ns access time; otherwise identical electrical and functional specs.	Marginally lower performance ceiling; may require CPU wait-state insertion in 10+ MHz bus designs.	Select only if 100 ns timing margin is unnecessary and cost optimization drives slower speed bin choice.

Compared with S29GL512S10FAI023, the TSOP alternative trades mechanical robustness for assembly flexibility, while the 110 ns variant sacrifices minimal timing margin for potential cost reduction - neither offers functional enhancement, making the original optimal for new industrial BGA-based designs requiring guaranteed 100 ns timing and fortified packaging.

Availability

S29GL512S10FAI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom edge router boot memory, and medical diagnostic imaging control requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S10FAI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Spansion (now part of Cypress Semiconductor, acquired by Infineon in 2019) specialized in high-reliability NOR Flash and microcontrollers for industrial and automotive markets before integration.

S29GL512S10FAI023 belongs to the S29GL-S MirrorBit Eclipse NOR Flash product line, engineered for deterministic boot performance, long-term data retention, and secure firmware update capability in mission-critical embedded systems.

FAQ

What voltage levels does S29GL512S10FAI023 support for VCC and VIO?

S29GL512S10FAI023 operates with VCC and VIO both in the 2.7 V to 3.6 V range, as indicated by model suffix '02'. This single-supply configuration eliminates the need for separate I/O voltage regulation and simplifies power design for 3.3 V systems.

How is sector protection configured on this specific ordering option?

This part (suffix '02') implements lowest-address sector protection, meaning the first 64 KB sector - typically containing reset vectors and boot code - is hardware-locked against accidental overwrite. Protection is enforced independently of software commands unless overridden by valid password entry in Read Password Mode.

Does S29GL512S10FAI023 support common industry-standard command sets?

Yes, it fully supports JEDEC-standard command sets including CFI (Common Flash Interface) query, and implements Spansion's proprietary command set for advanced features like password-protected block locking and dynamic protection bit (DYB) control, ensuring compatibility with standard flash programming tools and bootloaders.

What is the significance of the 'FAI' in the part number?

'FAI' denotes Fortified Ball-Grid Array package type LAA064 (64-ball, 11 mm × 13 mm), industrial temperature grade (–40°C to +85°C), and standard lead-free finish. The 'F' indicates the fortified mechanical construction, 'A' specifies the standard package materials set, and 'I' confirms industrial temperature qualification.

S29GL512S10FAI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S10FAI023 FAQ

1.How can I place an order for S29GL512S10FAI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10FAI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10FAI023 reliable?

The price and inventory of S29GL512S10FAI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10FAI023 is usually 5 days.

3.What payment methods are accepted for S29GL512S10FAI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10FAI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10FAI023?

S29GL512S10FAI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10FAI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10FAI023?

For technical support, including S29GL512S10FAI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10FAI023 requirements.

6.How does Aetrix verify that S29GL512S10FAI023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10FAI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10FAI023 meets industry standards.

7.What is the process for return or replacement of S29GL512S10FAI023?

All S29GL512S10FAI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10FAI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10FAI023 part is unused and in its original packaging.

Return procedure for S29GL512S10FAI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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