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Infineon Technologies S29GL512S10FHI010
- Part No.:
- S29GL512S10FHI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512S10FHI010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:238
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Product details
Overview
S29GL512S10FHI010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update partitions of industrial control systems.
For engineers reviewing the S29GL512S10FHI010 datasheet, S29GL512S10FHI010 pinout, S29GL512S10FHI010 application, or S29GL512S10FHI010 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, uniform 128 kB sector erase, and Versatile I/O (1.65–VCC) for mixed-voltage host interfacing.
Technical Context
This parallel NOR flash implements an embedded algorithm controller (EAC) that executes autonomous program/erase operations without external timing control. Its architecture features 32-byte page-aligned reads, status register polling, RY/BY# pin signaling, and CFI-compliant parameter tables for automatic software identification.
The device supports volatile/non-volatile sector protection, suspend/resume for program/erase, and a dedicated 1024-byte OTP array with dual lockable regions. ECC logic operates transparently during read cycles, correcting single-bit errors in real time using internal syndrome generation and correction circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit words |
| Random Access Time | 100 ns at VCC = VIO, enabling fast instruction fetch in XIP configurations |
| Page Access Time | 15 ns for subsequent 32-byte aligned reads within same page |
| Programming Buffer | 512-byte write buffer supporting burst programming up to 1.5 MBps effective rate |
| ECC Capability | On-the-fly single-bit error correction with no software overhead |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention at 85°C |
| Operating Temperature | Industrial grade: –40°C to +85°C (confirmed by part suffix 'I') |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 400 mil width, JEDEC standard MO-141AC. Pin-compatible with legacy S29GLxxxS family devices in same footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address Inputs | 25-bit address bus; A24 is MSB for 512 Mb density (2^24 × 16 = 64 MB) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes per command sequence |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching |
| OE# | Output Enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write Enable | Active-low control for write/program/erase command execution |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready |
| WP# | Write Protect | Hardware sector protection enable; active-low, tied high for normal operation |
| VCC | Core Supply | 2.7–3.6 V core and I/O supply (Versatile I/O allows VIO = 1.65–VCC) |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte aligned page access with 15 ns cycle time reduces sequential instruction fetch latency |
| Embedded Algorithm Controller | Autonomous erase and program execution eliminates need for external timing management |
| Advanced Sector Protection | Volatile and non-volatile locking per 128 kB sector prevents accidental firmware overwrite |
| Common Flash Interface (CFI) | Standardized parameter table enables OS/driver auto-detection without hard-coded timing |
| Secure Silicon Region | 1024-byte OTP array with two independently lockable regions for keys or calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with field-upgrade capability. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency and sector-level write protection. Use Value: Enables safe over-the-air updates via 128 kB uniform sector erase and hardware WP#-controlled lockdown during critical runtime. | Use Scenario: Holding boot code and sensor fusion algorithms in automotive camera ECU requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and built-in ECC for ASIL-B functional safety support. Use Value: Provides certified 20-year data retention and 100,000-cycle endurance under thermal cycling stress in engine bay proximity. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound devices with strict EMC requirements. IC Role / Device Role / Timing Role: Low-noise, single-supply flash with Versatile I/O (1.65–3.6 V) interfacing directly to 1.8 V or 3.3 V SoC buses. Use Value: Eliminates level shifters and reduces BOM count while maintaining 15 ns page-mode read for rapid system initialization. | Use Scenario: Storing FPGA configuration images and protocol stack parameters in 5G remote radio units with hot-swap capability. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting suspend/resume during power transitions and RY/BY#-driven status monitoring. Use Value: Allows seamless reconfiguration during maintenance windows without full system reset or data corruption risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of 56-pin TSOP | Preferred for space-constrained PCBs with fine-pitch routing capability | Select when board layout requires BGA footprint and thermal performance exceeds TSOP limits |
| S29GL512S11TFI010 | Slower timing: 110 ns random access, 25 ns page access; otherwise identical feature set | Suitable for cost-sensitive designs where 10 ns timing margin is not required | Choose for legacy-compatible timing budgets or lower-power operation at reduced speed |
Compared with S29GL512S10FHI010, the TSOP variant offers easiest drop-in replacement in existing sockets, while the LAE BGA version improves thermal dissipation and signal integrity at higher densities-both retain identical command set, CFI structure, and ECC behavior.
Availability
S29GL512S10FHI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across multi-year production cycles.
Supply support for S29GL512S10FHI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions with global manufacturing and quality certification.
The GL-S family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with integrated ECC, sector protection, and extended temperature operation-designed specifically for industrial automation, automotive, and medical equipment.
FAQ
What is the maximum operating voltage for VIO on S29GL512S10FHI010?
The versatile I/O feature supports VIO from 1.65 V to VCC, with VCC rated 2.7–3.6 V. Therefore, VIO may be as high as 3.6 V when VCC = 3.6 V, enabling direct interface to 3.3 V or 1.8 V host processors without level shifters. This range is validated across the full industrial temperature range and specified in DC characteristics Table 10.5.
Does S29GL512S10FHI010 support hardware reset recovery after power loss?
Yes-it includes a power-on reset (POR) circuit and supports warm reset via the RESET# pin. During brown-out or abrupt power loss, internal state machines revert to known idle states, and the device enters standby mode with all outputs high-impedance. Recovery is automatic upon stable VCC, with no external initialization required beyond standard command sequencing.
How is the 1024-byte OTP array structured and accessed?
The OTP array occupies a dedicated address space (0x0000_0000–0x0000_03FF) and contains two independently lockable 512-byte regions. Locking is performed via specific unlock-bypass-write sequences to status register bits SR[2] and SR[3]. Once locked, regions become permanently read-only; no factory reprogramming is possible. Access uses standard read commands but requires OTP-specific address mapping.
Can S29GL512S10FHI010 be used in synchronous interface modes?
No-it is strictly asynchronous. All read, program, and erase operations rely on CE#, OE#, and WE# timing without clock input. There is no DLL, PLL, or source-synchronous strobe support. The device does not support QSPI, xSPI, or DDR modes. Its timing model is defined entirely by tACC, tPACC, tCE, and tOE parameters in the AC characteristics table.
S29GL512S10FHI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (11x13)
S29GL512S10FHI010 FAQ
1.How can I place an order for S29GL512S10FHI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S10FHI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S10FHI010 reliable?
The price and inventory of S29GL512S10FHI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10FHI010 is usually 5 days.
3.What payment methods are accepted for S29GL512S10FHI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10FHI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S10FHI010?
S29GL512S10FHI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S10FHI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S10FHI010?
For technical support, including S29GL512S10FHI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10FHI010 requirements.
6.How does Aetrix verify that S29GL512S10FHI010 is sourced from the original manufacturer or authorized distributors?
All S29GL512S10FHI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10FHI010 meets industry standards.
7.What is the process for return or replacement of S29GL512S10FHI010?
All S29GL512S10FHI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10FHI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S10FHI010 part is unused and in its original packaging.
Return procedure for S29GL512S10FHI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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