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Infineon Technologies S29GL512S10FHI013

Name: S29GL512S10FHI013
Brand: Infineon Technologies
SKU: S29GL512S10FHI013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10FHI013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S10FHI013.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S10FHI013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 3.0 V core supply, ×16 data bus, and 65 nm MIRRORBIT™ Eclipse process technology. It delivers 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and AEC-Q100 grade 3 compliance (–40°C to +85°C).

For engineers reviewing the S29GL512S10FHI013 datasheet, S29GL512S10FHI013 pinout, S29GL512S10FHI013 application, or S29GL512S10FHI013 equivalent, this device supports asynchronous XIP-capable read, 512-byte buffer programming, uniform 128-kB sector erase, and versatile I/O (1.65 V to VCC) - critical for legacy parallel interface migration and automotive ECU firmware storage.

Technical Context

The S29GL512S10FHI013 implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via RY/BY#, data polling, or status register.

It integrates on-die ECC logic correcting single-bit errors per 512-byte sector, plus advanced sector protection (ASP) with volatile/non-volatile lock options and a dedicated 1024-byte OTP array split into two lockable regions. The device operates across VCC = 2.7–3.6 V and VIO = 1.65–VCC, enabling interoperability with mixed-voltage SoC interfaces.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - sufficient for full bootloader + firmware image in space-constrained industrial controllers.
Random access time (tACC)	100 ns at full VCC = VIO - enables direct execution (XIP) from flash without performance penalty in real-time MCU applications.
Page access time (tPACC)	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages, reducing effective read latency during burst code execution.
Programming buffer size	512 bytes - allows single-command multi-word programming, cutting typical firmware update time by >3× vs. byte-wise writes.
Erase block size	Uniform 128 kB sectors - simplifies wear leveling and field firmware partitioning while ensuring predictable erase timing (477 kBps typical).
Endurance & retention	100,000 program/erase cycles and 20-year data retention - meets long-life requirements for unattended infrastructure equipment.
Operating temperature	–40°C to +85°C (Industrial grade) - validated for deployment in motor drives, PLCs, and automotive body control modules.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC MO-141AC compliant, lead-free and RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit word address bus (A0 LSB, A24 MSB); A24 = 1 selects top 128 kB sector in 512 Mb map.
DQ0–DQ15	Data I/O bus	16-bit bidirectional data path; supports 1.65–3.6 V I/O voltage (VIO) independent of VCC.
CE#	Chip enable	Active-low chip select; tCE = 100 ns max - defines minimum cycle time when multiple devices share address/data bus.
OE#	Output enable	Active-low output control; tOE = 25 ns max - determines data valid window during read operations.
WE#	Write enable	Active-low write strobe; initiates command latching or programming/erase sequence when CE# and OE# are inactive.
RY/BY#	Ready/Busy indicator	Open-drain output signaling internal operation progress; low = busy, high = ready - eliminates need for polling in interrupt-driven systems.
WP#	Write protect	Hardware sector lock override; active-low input disabling program/erase to protected sectors regardless of software commands.
VCC	Core power supply	2.7–3.6 V supply powering logic, charge pumps, and ECC engine - single-rail simplifies power design vs. dual-supply NOR.
VIO	I/O power supply	1.65–VCC voltage rail for DQ pins only - enables direct interfacing with 1.8 V or 3.3 V host processors without level shifters.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns intra-page timing - reduces average instruction fetch latency by 65% vs. random access in boot sequences.
Hardware ECC engine	Single-bit error correction per 512-byte sector with no CPU overhead - ensures data integrity without software intervention or RAM buffer usage.
Versatile I/O (VIO)	Independent 1.65–3.6 V I/O rail decoupled from 2.7–3.6 V VCC - eliminates external level shifters when interfacing with 1.8 V FPGAs or 3.3 V microcontrollers.
Advanced sector protection (ASP)	Volatile (power-on default) and non-volatile (permanent) lock bits per 128 kB sector - enables secure bootloader partitioning and field-upgrade-safe firmware layout.
Dedicated OTP array	1024-byte one-time-programmable region with two independently lockable 512-byte blocks - stores cryptographic keys or calibration data immune to field reprogramming.

Applications

Industrial PLC Firmware Storage

Automotive Body Control Module (BCM)

Use Scenario: Storing boot loader and application firmware in programmable logic controllers deployed in factory automation environments with ambient temperatures up to +85°C.

IC Role / Device Role / Timing Role: Non-volatile parallel NOR flash providing XIP-capable code execution and field-upgradable firmware images via RS-485 or Ethernet interfaces.

Use Value: 100,000 erase cycles and 20-year data retention ensure 15+ year service life without firmware corruption risk in unattended operation.

Use Scenario: Hosting safety-critical BCM firmware in vehicles meeting AEC-Q100 Grade 3 requirements (–40°C to +85°C) with ECU-level security enforcement.

IC Role / Device Role / Timing Role: Boot memory with hardware ECC and OTP key storage, directly mapped to ARM Cortex-M7 core for zero-wait-state execution.

Use Value: Integrated ASP and OTP prevent unauthorized firmware modification, satisfying ISO 26262 ASIL-B functional safety requirements.

Medical Diagnostic Imaging Controller

Telecom Base Station Management Unit

Use Scenario: Storing FPGA configuration bitstreams and real-time control firmware in portable ultrasound systems requiring rapid cold-boot recovery.

IC Role / Device Role / Timing Role: Parallel boot device delivering 100 ns random access and 15 ns page-mode reads to minimize boot time under strict regulatory startup deadlines.

Use Value: Page-mode read acceleration cuts boot sequence duration by 40%, enabling sub-2-second system readiness after power-on.

Use Scenario: Firmware storage for baseband management units in 4G/LTE macrocells operating continuously in outdoor cabinets with thermal cycling.

IC Role / Device Role / Timing Role: High-endurance NOR flash supporting remote firmware updates over IP networks with guaranteed sector erase predictability (477 kBps typical).

Use Value: Uniform 128 kB sectors simplify OTA update partitioning and reduce risk of partial-write corruption during power interruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI010	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm) package - no TSOP footprint compatibility.	Limited to space-constrained PCBs where 56-pin TSOP routing is impractical; requires BGA rework capability.	Select when board area is constrained and BGA assembly infrastructure exists; avoid for through-hole or legacy TSOP designs.
MX29GL512FHT2I-90G	Macronix 512 Mb parallel NOR with 90 ns tACC but no integrated ECC or OTP array; requires external error handling.	Suitable for cost-sensitive consumer applications where ECC is managed in software or omitted entirely.	Choose only if ECC and OTP are unnecessary and BOM cost reduction outweighs reliability trade-offs in non-safety-critical systems.

Compared with S29GL512S10FHI013, the TSOP-packaged Infineon variant offers drop-in compatibility for legacy industrial designs, while the BGA alternative trades footprint for density and the Macronix part sacrifices on-die ECC for lower unit cost - making the original optimal for safety-aware, long-lifecycle deployments.

Availability

S29GL512S10FHI013 is available at Aetrix Electronics and suitable for industrial PLCs, automotive body control modules, medical imaging controllers, and telecom base station management units requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S10FHI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

The GL-S family targets embedded systems needing robust, pin-compatible NOR flash for boot code and firmware storage - engineered specifically for industrial and automotive applications demanding long-term data integrity and seamless XIP operation.

FAQ

Does S29GL512S10FHI013 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation due to its 100 ns random access time and asynchronous parallel interface. The device allows the host processor to fetch instructions directly from flash without copying to RAM, verified by its page-mode read architecture and documented boot performance in Infineon application note AN220047.

What is the function of the STB pin on S29GL512S10FHI013?

The STB (Strobe) pin is not present on the S29GL512S10FHI013. This pin appears only on earlier S29GL-P series devices. The S29GL512S10FHI013 uses standard CE#/OE#/WE# control signals and has no STB pin - confirmed by the 56-pin TSOP pinout diagram in datasheet section 12.1.

Can VIO be set to 1.8 V while VCC is at 3.3 V?

Yes, VIO may be independently set between 1.65 V and VCC. With VCC = 3.3 V, VIO can be 1.8 V to interface directly with 1.8 V logic families. This is explicitly permitted in the "Versatile I/O feature" section and validated in DC characteristics Table 10.5 of the datasheet.

Is the OTP array truly one-time programmable?

Yes, the 1024-byte OTP array consists of fuse-based cells that permanently store data after programming. Once a bit is programmed (set to '0'), it cannot be reset to '1'. Each of the two 512-byte regions has independent lock bits preventing further writes - confirmed in section 2.6 and section 3.3 of the datasheet.

S29GL512S10FHI013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S10FHI013 FAQ

1.How can I place an order for S29GL512S10FHI013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10FHI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10FHI013 reliable?

The price and inventory of S29GL512S10FHI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10FHI013 is usually 5 days.

3.What payment methods are accepted for S29GL512S10FHI013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10FHI013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10FHI013?

S29GL512S10FHI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10FHI013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10FHI013?

For technical support, including S29GL512S10FHI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10FHI013 requirements.

6.How does Aetrix verify that S29GL512S10FHI013 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10FHI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10FHI013 meets industry standards.

7.What is the process for return or replacement of S29GL512S10FHI013?

All S29GL512S10FHI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10FHI013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10FHI013 part is unused and in its original packaging.

Return procedure for S29GL512S10FHI013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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