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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S10FHI020

Name: S29GL512S10FHI020
Brand: Infineon Technologies
SKU: S29GL512S10FHI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10FHI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S10FHI020.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

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Inventory:1,973

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Product details

Overview

S29GL512S10FHI020 from Infineon is a 512 Mb (64 MB), 16-bit parallel NOR flash memory using 65 nm MIRRORBIT™ Eclipse technology, with 100 ns random access time, 15 ns page access time, and single 3.0 V supply (2.7–3.6 V) for read/program/erase - deployed in industrial embedded systems for firmware storage and XIP boot code execution.

For engineers reviewing the S29GL512S10FHI020 datasheet, S29GL512S10FHI020 pinout, S29GL512S10FHI020 application, or S29GL512S10FHI020 equivalent, key selection criteria include its 128 kB uniform sector erase, 512-byte write buffer, internal ECC, Versatile I/O (1.65–3.6 V), and AEC-Q100 Grade 2 qualification (–40°C to +105°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), 16-bit DQ bus, and hardware status signaling via RY/BY#. Its embedded algorithm controller (EAC) manages autonomous program/erase operations including suspend/resume, sector protection, and automatic single-bit ECC correction.

The architecture supports both full-voltage and Versatile I/O modes: in Versatile I/O mode, VIO may be independently set from 1.65 V to VCC, enabling interoperability with mixed-voltage SoCs while maintaining full 100 ns random access at VIO = VCC or 110 ns at reduced VIO.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports large firmware images and dual-bank boot partitions
Random Access Time	100 ns at VCC = VIO; enables real-time XIP execution without CPU stall penalties
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages
Write Buffer Size	512 bytes; reduces average programming time by batching up to 256 words per command
Erase Unit	Uniform 128 kB sectors; simplifies wear leveling and field firmware updates
Data Retention	20 years; ensures long-term reliability in unpowered storage
Endurance	100,000 program/erase cycles per sector; supports frequent OTA update deployments

Pinout & Package

Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.5 mm pitch). Pinout validated per Infineon datasheet Rev. *U (2024-06-25), Section 12.1.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	Word-aligned address bus (A24 MSB); supports 32 MB address space for 512 Mb density
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates in 1.65–3.6 V Versatile I/O range
CE#	Chip enable	Active-low device select; tCE = 100 ns max in Versatile I/O mode
OE#	Output enable	Active-low read strobe; tOE = 35 ns max in Versatile I/O mode
WE#	Write enable	Active-low control for program/erase commands and status register writes
RY/BY#	Ready/Busy output	Open-drain status indicator; low during embedded operations, high when ready
RESET#	Hardware reset	Active-low asynchronous reset; clears internal state and aborts pending operations
VCC	Core supply	3.0 V nominal (2.7–3.6 V); powers core logic, EAC, and voltage generators
VIO	I/O supply	Independent 1.65–3.6 V supply; decouples I/O voltage from core for mixed-signal interfacing

Key Features

Feature	Design Value
Embedded Algorithm Controller (EAC)	Autonomous execution of program/erase/suspend/resume without host CPU intervention
Internal Hardware ECC	Single-bit error correction per 512-byte sector; eliminates need for external ECC logic
Advanced Sector Protection (ASP)	Volatile and non-volatile lock bits per 128 kB sector; prevents accidental firmware overwrite
Secure Silicon Region (OTP)	1024-byte one-time-programmable array with two lockable regions; stores keys or calibration data
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands; enables OS/driver auto-detection

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, boot loader, and safety-critical firmware in AEC-Q100 Grade 2 (–40°C to +105°C) environment.

IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency and 128 kB sector granularity for safe firmware rollback.

Use Value: Enables zero-latency boot and runtime code execution while meeting automotive thermal and reliability requirements.

Use Scenario: Holding programmable logic controller (PLC) firmware, configuration tables, and HMI assets in factory automation equipment.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 100,000 erase cycles and 20-year retention for infrequent but mission-critical firmware updates.

Use Value: Eliminates external ECC circuitry and supports secure field upgrades via OTP-protected update keys.

Medical Imaging Boot Memory

Avionics Display System

Use Scenario: Hosting boot ROM and diagnostic firmware in FDA-compliant imaging devices requiring traceable data integrity.

IC Role / Device Role / Timing Role: CFI-compliant NOR flash with hardware ECC and sector lock for certified firmware validation and version control.

Use Value: Meets IEC 62304 software lifecycle requirements through deterministic erase/write behavior and built-in error correction.

Use Scenario: Storing display firmware and font assets in DO-178C-certified cockpit displays operating across extended temperature ranges.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified flash with 15 ns page read for fast GUI asset loading and real-time rendering.

Use Value: Delivers deterministic timing for safety-critical UI response and supports dual-bank firmware for hot-swappable updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP package	Requires PCB redesign for BGA layout; better thermal performance in high-density modules	Select when board space is constrained and reflow capability exists
MX29GL512FHT2I-90G	Macronix 512 Mb parallel NOR; 90 ns random access, no built-in ECC, no Versatile I/O	Lacks hardware ECC and mixed-voltage I/O; requires external error handling and level-shifting	Select only if cost sensitivity outweighs ECC and I/O flexibility requirements

Compared with S29GL512S10FHI020, the TSOP-packaged Infineon variant offers superior integration (ECC, ASP, OTP) and mixed-voltage operation, while the Macronix alternative trades those features for lower unit cost and slightly faster raw access time - making it suitable only where external ECC and voltage translation are already implemented.

Availability

S29GL512S10FHI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging systems, and avionics displays requiring stable component supply, long-life support, and AEC-Q100 compliance.

Supply support for S29GL512S10FHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global manufacturing and R&D infrastructure.

The GL-S family targets high-reliability embedded applications demanding XIP-capable flash with robust data integrity, extended temperature operation, and automotive qualification - bridging performance between legacy parallel NOR and modern serial flash.

FAQ

Does S29GL512S10FHI020 support execute-in-place (XIP) operation?

Yes. The device supports true XIP operation with 100 ns random access time and 15 ns page access time, enabling direct CPU instruction fetch from flash without copying to RAM. Its asynchronous interface and deterministic timing meet real-time boot and runtime code execution requirements in automotive and industrial controllers.

What is the function of the Versatile I/O (VIO) feature?

Versatile I/O allows independent setting of the I/O supply voltage (VIO) from 1.65 V to VCC, enabling seamless interfacing with mixed-voltage SoCs or FPGAs. This eliminates external level shifters while preserving full-speed operation - for example, VIO = 1.8 V with VCC = 3.3 V maintains 110 ns access time per datasheet specifications.

How does the 512-byte write buffer improve programming efficiency?

The 512-byte write buffer allows up to 256 words to be loaded and programmed in a single embedded operation, achieving 1.5 MBps effective programming rate. This reduces host CPU overhead and total programming time by ~70% compared to single-word programming, especially beneficial for firmware image updates and field provisioning.

Is the Secure Silicon Region (OTP) field-programmable and lockable?

Yes. The 1024-byte OTP array is divided into two independently lockable regions. Each region can be programmed once via standard command sequences, then permanently locked using dedicated lock bits. This supports secure storage of cryptographic keys, calibration data, or device-specific identifiers with irreversible protection against overwrite.

S29GL512S10FHI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S10FHI020 FAQ

1.How can I place an order for S29GL512S10FHI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10FHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10FHI020 reliable?

The price and inventory of S29GL512S10FHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10FHI020 is usually 5 days.

3.What payment methods are accepted for S29GL512S10FHI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10FHI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10FHI020?

S29GL512S10FHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10FHI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10FHI020?

For technical support, including S29GL512S10FHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10FHI020 requirements.

6.How does Aetrix verify that S29GL512S10FHI020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10FHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10FHI020 meets industry standards.

7.What is the process for return or replacement of S29GL512S10FHI020?

All S29GL512S10FHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10FHI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10FHI020 part is unused and in its original packaging.

Return procedure for S29GL512S10FHI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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