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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S10FHI023

Name: S29GL512S10FHI023
Brand: Infineon Technologies
SKU: S29GL512S10FHI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10FHI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512S10FHI023.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512S10FHI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update storage for industrial microcontroller-based systems.

For engineers reviewing the S29GL512S10FHI023 datasheet, S29GL512S10FHI023 pinout, S29GL512S10FHI023 application, or S29GL512S10FHI023 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte write buffer, Versatile I/O (1.65 V to VCC), AEC-Q100 Grade 2 qualification (–40°C to +105°C), and TSOP-56 or FBGA packaging options.

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard and page-mode reads. Its embedded algorithm controller (EAC) manages all program/erase operations-including suspend/resume-and enforces command-set locking via CFI-compliant protocols.

The internal architecture includes dedicated erase voltage and programming voltage generators, status register monitoring, and dual protection mechanisms: Advanced Sector Protection (volatile/non-volatile) plus a 1024-byte OTP array with two lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	512 Mb (64 MB); supports full firmware image storage for mid-range MCUs without external memory expansion.
Random Access Time	100 ns at VIO = VCC; enables direct XIP execution from flash in real-time control applications.
Page Access Time	15 ns; allows rapid sequential reads within 32-byte aligned pages for efficient code fetch bursts.
Write Buffer Size	512 bytes; reduces effective programming time by batching up to 256 words per operation.
Erase Granularity	Uniform 128 kB sectors; simplifies firmware partitioning and field update management.
Data Retention	20 years; ensures long-term reliability in unpowered industrial deployments.
Endurance	100,000 program/erase cycles; supports frequent OTA updates in connected edge devices.

Pinout & Package

Package: 56-pin Thin Small Outline Package (TSOP-I), 14 mm × 20 mm, JEDEC MO-142AC compliant, lead-free and RoHS-compliant.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address Inputs	Word-aligned address bus (A24 MSB); supports full 512 Mb address space with no byte-level addressing.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates at VIO (1.65 V to VCC) for flexible host interface voltage matching.
CE#	Chip Enable	Active-low chip select; controls device power state and enables multi-chip addressing in parallel memory arrays.
OE#	Output Enable	Active-low read strobe; gates output drivers during read cycles to prevent bus contention.
WE#	Write Enable	Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences.
RY/BY#	Ready/Busy Output	Open-drain status indicator; asserts low during embedded operations to signal host wait-state requirements.
RESET#	Hardware Reset	Active-low asynchronous reset; forces device into known state and aborts ongoing operations.
WP#	Write Protect	Hardware sector lock override; disables program/erase to protected sectors independent of software settings.

Key Features

Feature	Design Value
Versatile I/O Voltage Range	VIO supports 1.65 V to VCC, enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.
Hardware ECC Engine	On-die single-bit error correction with automatic detection and correction during read, eliminating need for external ECC logic.
Suspend/Resume Capability	Allows interruption of erase or program operations to service high-priority reads, critical for real-time interrupt latency control.
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands, enabling OS-agnostic flash driver auto-configuration.
Advanced Sector Protection	Per-sector volatile (SRAM-based) and non-volatile (flash-based) lock bits, supporting dynamic and permanent protection schemes.

Applications

Industrial PLC Firmware Storage

Automotive ADAS Boot Memory

Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers operating continuously in factory environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency and guaranteed 20-year data retention.

Use Value: Eliminates external SRAM dependency for boot code execution while meeting IEC 61508 SIL-3 functional safety requirements via ECC and sector locking.

Use Scenario: Holding boot firmware and sensor calibration data in front-camera modules requiring AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and hardware reset recovery for cold-start reliability.

Use Value: Enables deterministic boot timing and secure firmware validation using OTP region for cryptographic keys and immutable configuration.

Medical Imaging System Update Storage

Telecom Base Station Configuration Memory

Use Scenario: Hosting field-upgradable diagnostic firmware and calibration tables in portable ultrasound devices with strict power budget constraints.

IC Role / Device Role / Timing Role: Low-standby-current (100 µA) flash memory supporting infrequent but critical firmware patches over USB or SD card.

Use Value: Reduces system-level power consumption during idle periods while maintaining fast 15 ns page-read performance for rapid patch verification.

Use Scenario: Storing FPGA configuration bitstreams and protocol stack parameters in 5G remote radio units deployed in outdoor cabinets.

IC Role / Device Role / Timing Role: High-endurance (100K cycles) flash used for frequent reconfiguration events triggered by network operator commands.

Use Value: Supports >100 daily reconfigurations over 10+ years without degradation, validated under extended temperature cycling per Telcordia GR-468.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI020	Same die, TSOP-56 package, but rated for Industrial grade only (–40°C to +85°C); lacks AEC-Q100 qualification.	Not suitable for automotive under-hood applications requiring Grade 2 thermal range.	Select when cost-sensitive industrial designs do not require extended temperature or automotive certification.
N25Q512A13ESE40F	Quad SPI interface (not parallel), 512 Mb density, 1.7–2.0 V VCC, no hardware ECC, 65 nm process.	Requires SPI-to-parallel bridge or MCU with QSPI peripheral; incompatible with legacy parallel bus architectures.	Choose for new designs prioritizing board space reduction and lower pin count over legacy interface compatibility.

Compared with S29GL512S10FHI023, the TSOP-packaged S29GL512S10TFI020 sacrifices automotive qualification for lower unit cost, while the N25Q512A13ESE40F replaces parallel bandwidth with serial simplicity-making the original optimal for high-speed XIP in thermally demanding, certified systems.

Availability

S29GL512S10FHI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system update storage requiring stable component supply across extended product lifecycles.

Supply support for S29GL512S10FHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-S family targets high-reliability embedded systems needing deterministic boot performance, robust data integrity, and long-term availability-designed specifically for industrial automation, automotive, and medical equipment where firmware persistence and security are mission-critical.

FAQ

What is the maximum operating temperature range for S29GL512S10FHI023?

S29GL512S10FHI023 is qualified to AEC-Q100 Grade 2, supporting continuous operation from –40°C to +105°C. This rating is verified per the datasheet's "Operating Ranges" table (Section 10.4) and applies to both read and program/erase functions under specified voltage and timing conditions.

Does this device support execute-in-place (XIP) functionality?

Yes-S29GL512S10FHI023 supports true XIP via its 100 ns random access time and asynchronous parallel interface. The device delivers instruction fetches directly to the host processor's address/data bus without requiring shadow RAM, as confirmed in the Product Overview section and Block Diagram (Figure 1) of the datasheet.

How does the 512-byte write buffer improve programming efficiency?

The 512-byte buffer allows up to 256 words to be loaded before initiating internal programming, reducing overhead from repeated command sequences. Measured buffer programming rate is 1.5 MBps, cutting effective programming time by ~4× versus single-word writes-verified in the "Typical program and erase rates" table (Datasheet p.2).

Is hardware reset (RESET#) required for reliable power-on initialization?

Yes-asserting RESET# for ≥100 ns after VCC reaches 2.7 V ensures proper internal state machine initialization and prevents undefined behavior during power ramp. This requirement is specified in Section 11.3 ("Power-on reset (POR) and warm reset") and enforced by the on-chip VCC detector circuitry.

S29GL512S10FHI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (11x13)

S29GL512S10FHI023 FAQ

1.How can I place an order for S29GL512S10FHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10FHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10FHI023 reliable?

The price and inventory of S29GL512S10FHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10FHI023 is usually 5 days.

3.What payment methods are accepted for S29GL512S10FHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10FHI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10FHI023?

S29GL512S10FHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10FHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10FHI023?

For technical support, including S29GL512S10FHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10FHI023 requirements.

6.How does Aetrix verify that S29GL512S10FHI023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10FHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10FHI023 meets industry standards.

7.What is the process for return or replacement of S29GL512S10FHI023?

All S29GL512S10FHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10FHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10FHI023 part is unused and in its original packaging.

Return procedure for S29GL512S10FHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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