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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S10GHI023

Name: S29GL512S10GHI023
Brand: Infineon Technologies
SKU: S29GL512S10GHI023
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10GHI023

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-VFBGA

Datasheet:: S29GL512S10GHI023.pdf

Description:: IC FLASH 512MBIT CFI 56FBGA

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL512S10GHI023 from Infineon is a 512 Mb (64 MB), 16-bit parallel NOR flash memory with 3.0 V core supply, 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It operates across –40°C to +105°C (Industrial Plus grade) and supports sector erase of uniform 128-kbyte sectors in embedded boot code storage applications.

For engineers reviewing the S29GL512S10GHI023 datasheet, S29GL512S10GHI023 pinout, S29GL512S10GHI023 application, or S29GL512S10GHI023 equivalent, key selection criteria include its 512-byte programming buffer, Versatile I/O (1.65 V–V_CC), CFI compliance, OTP array with dual lockable regions, and AEC-Q100 Grade 2 qualification for automotive control modules.

Technical Context

This device implements MIRRORBIT™ Eclipse architecture on 65 nm process, enabling simultaneous read-while-write capability via suspend/resume commands for program and erase operations. Its embedded algorithm controller (EAC) manages autonomous sector erase and buffer programming without host intervention.

The flash uses asynchronous interface timing with three status monitoring methods - status register, data polling, and RY/BY# pin - and supports both volatile and non-volatile advanced sector protection (ASP) per 128-kbyte sector. The 1024-byte OTP array includes two independently lockable regions for secure configuration storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words - enables full boot image storage for mid-tier microcontrollers.
Random access time	100 ns at full V_CC = V_IO - meets real-time interrupt response requirements in industrial PLCs.
Page access time	15 ns - accelerates sequential instruction fetch in XIP execution mode.
Programming buffer	512 bytes (256 words) - reduces effective programming time by >70% vs. single-word writes.
ECC capability	Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical firmware storage.
Endurance & retention	100,000 program/erase cycles; 20-year data retention - supports 15+ year field deployment in infrastructure equipment.
Operating temperature	–40°C to +105°C (Industrial Plus grade) - qualified for under-hood automotive ECUs and outdoor telecom base stations.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width). Pin-compatible with industry-standard parallel NOR flash footprints and socketed debug interfaces.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	25-bit address bus supporting 32-Mword addressing; A24 is MSB for 512 Mb density.
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte-wide access via upper/lower byte enable (not pins, controlled by address).
CE#	Chip enable	Active-low chip select; controls device power state and enables multi-chip memory expansion.
OE#	Output enable	Active-low read strobe; gates output drivers during read cycles to reduce bus contention.
WE#	Write enable	Active-low write strobe; initiates command sequences and data latching for program/erase operations.
RY/BY#	Ready/Busy indicator	Open-drain status pin signaling active embedded operation (low) or completion (high).
RESET#	Hardware reset	Active-low asynchronous reset that halts ongoing operations and returns device to read mode.
WP#	Write protect	Active-low hardware sector protection override; disables program/erase when asserted.

Key Features

Feature	Design Value
Versatile I/O voltage range	V_IO = 1.65 V to V_CC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters.
Asynchronous 32-byte page read	Initial access reads full 32-byte aligned page; subsequent intra-page reads take only 15 ns - optimizes burst instruction fetch.
Secure OTP array	1024-byte one-time-programmable region with two independent lock bits - stores cryptographic keys or calibration data irreversibly.
Advanced sector protection (ASP)	Volatile (SRAM-based) and non-volatile (flash-based) locking per 128-kbyte sector - enables dynamic firmware update partitioning.
Common Flash Interface (CFI)	Standardized parameter table accessible via command sequence - enables automatic driver detection and OS-level flash abstraction.

Applications

Automotive Engine Control Unit (ECU)

Industrial Programmable Logic Controller (PLC)

Use Scenario: Storing calibrated engine maps, diagnostic firmware, and bootloader code in AEC-Q100 Grade 2 environment.

IC Role / Device Role / Timing Role: Non-volatile boot memory with XIP support and hardware ECC for ASIL-B functional safety compliance.

Use Value: Eliminates external error-correction logic while meeting 100,000-cycle endurance over 15-year vehicle lifetime.

Use Scenario: Holding real-time control firmware and configuration data in DIN-rail mounted PLCs operating continuously at 70°C ambient.

IC Role / Device Role / Timing Role: Primary program storage with suspend/resume capability to avoid I/O blocking during field firmware updates.

Use Value: 15 ns page access enables deterministic <1 µs instruction fetch latency critical for motion control loops.

Telecom Base Station Controller

Medical Imaging System Boot Module

Use Scenario: Hosting FPGA configuration bitstreams and control software in outdoor macrocell base stations with wide thermal cycling.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention and –40°C to +105°C operation.

Use Value: Reduces field failure risk from data corruption during power interruption due to internal ECC and robust sector erase.

Use Scenario: Securing boot firmware and regulatory-compliant calibration tables in FDA-cleared MRI and CT scanner subsystems.

IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked security parameters and CFI-enabled firmware validation.

Use Value: Dual-lock OTP regions prevent unauthorized modification of safety-critical calibration constants during service.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI020	Same die, 64-ball LAE Fortified BGA (9 mm × 9 mm); no TSOP option; identical timing and features.	Preferred for space-constrained PCBs where board area is prioritized over socketability or debug access.	Select when footprint miniaturization and automated assembly outweigh need for manual rework or in-circuit debugging.
MX29GL512FHI-10G	Micron equivalent; 100 ns tACC, but lacks integrated ECC and OTP array; requires external error handling.	Suitable for cost-sensitive consumer applications where ECC is managed in software or omitted.	Choose only if system-level ECC is already implemented and OTP security is not required for boot integrity.

Compared with S29GL512S10GHI023, the TSOP-packaged Infineon variant offers superior debug accessibility and legacy compatibility, while the LAE BGA alternative trades serviceability for density, and the Micron part sacrifices on-chip reliability features for lower unit cost.

Availability

S29GL512S10GHI023 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot code retention, and telecom base station configuration requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL512S10GHI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.

The GL-S family targets mission-critical embedded systems requiring deterministic timing, long-term data integrity, and automotive-grade qualification - designed specifically for boot code, firmware, and secure configuration storage in harsh environments.

FAQ

Does S29GL512S10GHI023 support execute-in-place (XIP) operation?

Yes, it supports true XIP operation due to fast 100 ns random access and 15 ns page-mode reads. The device delivers instruction fetches directly to the processor bus without copying to RAM, verified by its block diagram showing dedicated X-Decoder and Y-Gating paths optimized for low-latency instruction access.

What is the function of the STB pin on S29GL512S10GHI023?

The STB (Strobe) pin is not present on this device. The datasheet's block diagram shows STB labels only on internal logic nodes - S29GL512S10GHI023 has no exposed STB pin. All control is handled via CE#, OE#, WE#, and RESET# signals as defined in Section 8.2 of the datasheet.

Can the OTP array be reprogrammed after locking?

No. Once either of the two lock bits in the 1024-byte OTP array is set, the corresponding 512-byte region becomes permanently read-only. The lock bits are one-time programmable fuses; no command or voltage sequence can clear them, ensuring irreversible protection of calibration or security data.

Is the 512-byte programming buffer mandatory for all write operations?

No. The buffer is optional: the device supports both single-word programming (using standard command sequences) and buffered programming (up to 512 bytes). Buffered mode improves throughput but requires proper command sequencing and status checking; single-word writes retain full compatibility with legacy NOR flash drivers.

S29GL512S10GHI023 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-VFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR (SLC)

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: CFI

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 56-FBGA (9x7)

S29GL512S10GHI023 FAQ

1.How can I place an order for S29GL512S10GHI023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10GHI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10GHI023 reliable?

The price and inventory of S29GL512S10GHI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10GHI023 is usually 5 days.

3.What payment methods are accepted for S29GL512S10GHI023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10GHI023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10GHI023?

S29GL512S10GHI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10GHI023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10GHI023?

For technical support, including S29GL512S10GHI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10GHI023 requirements.

6.How does Aetrix verify that S29GL512S10GHI023 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10GHI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10GHI023 meets industry standards.

7.What is the process for return or replacement of S29GL512S10GHI023?

All S29GL512S10GHI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10GHI023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10GHI023 part is unused and in its original packaging.

Return procedure for S29GL512S10GHI023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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