My Inquiry
My Account
Infineon Technologies S29GL512S10TFI013
- Part No.:
- S29GL512S10TFI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512S10TFI013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:900
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512S10TFI013 from Infineon is a 512 Mb (64 MB), 3.0 V core, parallel-interface MIRRORBIT™ Eclipse flash memory with ×16 data bus, 100 ns random access time, 15 ns page access time, and industrial temperature grade (–40°C to +85°C). It integrates hardware ECC for single-bit error correction, 128-kbyte uniform sectors, and a 512-byte programming buffer-enabling fast embedded code storage and firmware updates in microcontroller-based systems.
For engineers reviewing the S29GL512S10TFI013 datasheet, S29GL512S10TFI013 pinout, S29GL512S10TFI013 application, or S29GL512S10TFI013 equivalent, this device supports XIP-capable boot code execution, sector-level erase control, Versatile I/O (1.65 V to VCC), and CFI-compliant software interface-critical for automotive ECU, industrial HMI, and network edge controller designs.
Technical Context
The S29GL512S10TFI013 implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both random and page-mode reads. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via RY/BY#, data polling, or status register.
It features dual-voltage I/O (VIO = 1.65 V to VCC) independent of core supply (VCC = 2.7 V to 3.6 V), enabling interoperability with mixed-voltage SoCs. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without CPU intervention and flagging uncorrectable multi-bit errors via status bits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB); supports full firmware images for mid-tier MCUs without external memory expansion. |
| Random access time (tACC) | 100 ns at full VCC = VIO; enables deterministic boot timing in real-time embedded systems. |
| Page access time (tPACC) | 15 ns; allows rapid sequential instruction fetch within 32-byte aligned pages for XIP performance. |
| Programming buffer size | 512 bytes; reduces effective programming time by up to 4× vs. single-word writes in firmware update routines. |
| Erase granularity | Uniform 128-kbyte sectors; simplifies partitioning of bootloader, application, and configuration storage. |
| Data retention | 20 years at 85°C; meets long-lifecycle requirements for industrial control and automotive modules. |
| Endurance | 100,000 program/erase cycles per sector; supports field-upgradable firmware with robust wear leveling. |
| Operating temperature | –40°C to +85°C (Industrial grade); qualified for deployment in factory automation and outdoor gateways. |
Pinout & Package
Package: 56-pin TSOP (Type I, standard thin small outline package), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC MO-141AC compliant. Pin count and layout match industry-standard parallel NOR flash footprint for drop-in compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | 25-bit address bus; A24 is MSB for 512 Mb (2²⁶ × 16-bit words), enabling full memory mapping without bank switching. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports byte/word writes and reads; compatible with ARM Cortex-M and RISC-V MCU parallel interfaces. |
| CE# | Chip enable | Active-low chip select; controls device power state and enables multi-device decoding in memory-mapped systems. |
| OE# | Output enable | Active-low read strobe; gates output drivers independently of CE#, allowing shared bus arbitration. |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming when CE# and OE# are inactive. |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during internal program/erase; used for hardware flow control without polling overhead. |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into reading state and clears internal state machines after power-up or fault recovery. |
| VCC | Core supply | 3.0 V ±0.3 V supply (2.7–3.6 V); powers logic, array, and ECC circuitry; decoupling required per datasheet layout guidelines. |
| VIO | I/O supply | Independent 1.65–3.6 V I/O rail; permits interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction with automatic detection and status reporting-eliminates need for external error-handling firmware. |
| 512-byte write buffer | Enables burst programming of up to 512 bytes per command; cuts typical firmware update time by >65% vs. legacy NOR devices. |
| Versatile I/O (VIO) | Configurable I/O voltage (1.65–3.6 V) independent of VCC; removes level-shifter components in mixed-voltage designs. |
| CFI-compliant interface | Standardized ID and parameter table accessible via read commands; enables OS-agnostic flash management (e.g., U-Boot, Linux MTD). |
| Advanced sector protection | Volatile and non-volatile lock bits per 128-kbyte sector; prevents accidental overwrite of bootloader or calibration data in production. |
| OTP array | 1024-byte one-time-programmable region with two lockable segments; stores cryptographic keys or unique device identifiers securely. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial Human-Machine Interface (HMI) |
|---|---|
Use Scenario: Storing calibrated engine maps, diagnostic routines, and boot firmware in AEC-Q100 Grade 3 qualified systems. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency and sector-level update isolation. Use Value: Enables safe over-the-air (OTA) firmware patching without disrupting real-time engine timing loops. |
Use Scenario: Hosting GUI assets, firmware, and configuration data in panel-mounted HMIs operating continuously in factory environments. IC Role / Device Role / Timing Role: High-reliability parallel flash with 20-year data retention and hardware ECC for unattended operation. Use Value: Eliminates field failures due to bit corruption in extended-temperature industrial deployments. |
| Network Edge Router Boot Memory | Medical Diagnostic Imaging Controller |
Use Scenario: Booting Linux kernel and initramfs from flash in carrier-grade edge routers with strict boot-time SLAs. IC Role / Device Role / Timing Role: Fast-random-access NOR flash supporting eXecute-In-Place for sub-500 ms cold boot sequences. Use Value: Reduces boot dependency on external DRAM initialization, improving system resilience after power loss. |
Use Scenario: Storing FPGA configuration bitstreams and safety-critical boot code in FDA Class II imaging equipment. IC Role / Device Role / Timing Role: AEC-Q100-equivalent industrial-grade flash with 100,000-cycle endurance for frequent calibration updates. Use Value: Meets IEC 62304 software lifecycle requirements through verifiable erase/program reliability metrics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFI010 | Slower 110 ns random access time; same 512 Mb density, package, and feature set. | Acceptable where boot timing margin exceeds 10 ns; lower cost in high-volume industrial designs. | Select when system timing budget allows relaxed tACC and cost optimization is prioritized over peak performance. |
| MX29GL512FHT2I-90G | Micron device with 90 ns tACC but no integrated hardware ECC; requires external error handling. | Suitable for cost-sensitive consumer gateways where ECC is implemented in software or omitted. | Choose only if firmware stack includes robust SW ECC and timing-critical XIP is not required. |
Compared with S29GL512S10TFI013, the S29GL512S11TFI010 trades 10 ns read speed for cost reduction while retaining identical reliability and feature coverage; the MX29GL512FHT2I-90G offers faster raw access but lacks hardware ECC-introducing design complexity and risk in safety-critical applications.
Availability
S29GL512S10TFI013 is available at Aetrix Electronics and suitable for automotive ECU development, industrial HMI manufacturing, and network edge router production requiring stable component supply across multi-year product lifecycles.
Supply support for S29GL512S10TFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.
The GL-S family targets high-reliability embedded systems needing deterministic XIP performance and long-term firmware integrity-designed specifically for automotive, industrial, and networking applications demanding AEC-Q100 qualification and 20-year data retention.
FAQ
Does S29GL512S10TFI013 support execute-in-place (XIP) operation?
Yes. The device supports true XIP operation with 100 ns random access and 15 ns page-mode reads, enabling direct CPU instruction fetch from flash without copying to RAM. Its architecture includes dedicated address/data paths and internal state machines optimized for zero-wait-state execution in ARM Cortex-R and Power Architecture systems.
What is the function of the Versatile I/O (VIO) pin?
VIO supplies power to all input/output buffers independently of VCC, allowing operation with I/O voltages from 1.65 V to 3.6 V. This eliminates external level shifters when interfacing with 1.8 V FPGAs or 2.5 V ASICs while maintaining full 3.0 V core performance-verified across all temperature grades in the datasheet's DC characteristics table.
How does the hardware ECC work during read operations?
Hardware ECC runs automatically on every read access: single-bit errors are corrected in real time with no latency penalty or CPU involvement, and multi-bit errors trigger the ERR bit in the status register. Correction occurs transparently within the device's read path-no additional timing overhead or software driver changes are required beyond standard CFI-compliant flash initialization.
Can S29GL512S10TFI013 be used in automotive applications?
Yes. This specific part number (S29GL512S10TFI013) carries Industrial grade (–40°C to +85°C), but Infineon offers automotive variants (e.g., S29GL512S10TFI020) qualified to AEC-Q100 Grade 3. The pinout, timing, and command set are identical-only temperature screening and traceability documentation differ per automotive PPAP requirements.
S29GL512S10TFI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512S10TFI013 FAQ
1.How can I place an order for S29GL512S10TFI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S10TFI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S10TFI013 reliable?
The price and inventory of S29GL512S10TFI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10TFI013 is usually 5 days.
3.What payment methods are accepted for S29GL512S10TFI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10TFI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S10TFI013?
S29GL512S10TFI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S10TFI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S10TFI013?
For technical support, including S29GL512S10TFI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10TFI013 requirements.
6.How does Aetrix verify that S29GL512S10TFI013 is sourced from the original manufacturer or authorized distributors?
All S29GL512S10TFI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10TFI013 meets industry standards.
7.What is the process for return or replacement of S29GL512S10TFI013?
All S29GL512S10TFI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10TFI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S10TFI013 part is unused and in its original packaging.
Return procedure for S29GL512S10TFI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S10TFI013 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
