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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512S10TFI020

Name: S29GL512S10TFI020
Brand: Infineon Technologies
SKU: S29GL512S10TFI020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512S10TFI020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512S10TFI020.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

S29GL512S10TFI020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 16-bit data bus, fabricated on 65 nm MIRRORBIT™ Eclipse process. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time and 15 ns page access time, and integrates hardware ECC for single-bit error correction-used in boot code storage and firmware update partitions of industrial control and automotive infotainment systems.

For engineers reviewing the S29GL512S10TFI020 datasheet, S29GL512S10TFI020 pinout, S29GL512S10TFI020 application, or S29GL512S10TFI020 equivalent, key selection criteria include its 128 kB uniform sector erase granularity, 512-byte programming buffer throughput (1.5 MBps), Versatile I/O support (1.65–3.6 V), and AEC-Q100 Grade 3 qualification (–40°C to +85°C).

Technical Context

This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supports XIP-capable page-mode reads (32-byte aligned pages), and uses embedded algorithm controller (EAC) logic to execute program/erase operations without external timing control. Its status monitoring relies on RY/BY# pin, data polling, and status register readback.

The internal architecture includes separate OTP array (1024 bytes, dual lockable regions), CFI-compliant parameter table, and Advanced Sector Protection (ASP) with volatile/non-volatile locking per 128 kB sector-enabling secure firmware partitioning and field-upgrade resilience.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), organized as 4,194,304 × 16-bit words-supports full boot image storage for ARM Cortex-A/R-based controllers.
Access time (random)	100 ns at VCC = VIO - enables direct execution from flash in real-time safety-critical applications.
Page access time	15 ns - accelerates sequential instruction fetch within 32-byte aligned pages during XIP operation.
Programming buffer	512 bytes - reduces effective programming time by batching up to 256 words per command, improving firmware update efficiency.
ECC capability	Internal hardware single-bit error correction - eliminates need for external ECC logic in host MCU design.
Endurance & retention	100,000 program/erase cycles; 20-year data retention - meets long-lifecycle requirements for industrial gateways and automotive ECUs.
Operating temperature	–40°C to +85°C (Industrial grade) - validated for deployment in under-hood and factory-floor environments.
I/O voltage range	1.65 V to VCC - allows interoperability with 1.8 V or 3.3 V host processors without level-shifting circuitry.

Pinout & Package

Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard MO-141AC, body size 18.4 mm × 10.16 mm, lead pitch 0.5 mm.

Pin/Terminal	Circuit Role	Design Meaning
A0–A24	Address inputs	Word-aligned address bus; A24 is MSB for 512 Mb density (2²⁵ × 16 = 536,870,912 bits).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports byte/word writes via WE# and BYTE# control (not present on this variant).
CE#	Chip enable	Active-low chip select; controls device power state and enables internal logic only when asserted.
OE#	Output enable	Active-low read strobe; gates output drivers without affecting internal state or timing.
WE#	Write enable	Active-low write strobe; initiates program/erase commands and data latching on rising edge.
RY/BY#	Ready/Busy indicator	Open-drain output; low during embedded operations (program/erase), high when ready for next command.
VCC	Core supply	2.7–3.6 V single supply powering core logic, charge pumps, and I/O buffers.
VIO	I/O supply	Independent 1.65–3.6 V supply for DQ and control pins-decouples I/O voltage from core for mixed-voltage systems.

Key Features

Feature	Design Value
Asynchronous page-mode read	32-byte aligned page access with 15 ns cycle time-reduces instruction fetch latency in XIP configurations.
Hardware ECC engine	On-die single-bit error correction with automatic detection-removes software ECC overhead and improves system reliability.
Uniform 128 kB sectors	512 individually erasable sectors-enables fine-grained firmware partitioning (e.g., bootloader, OS, app) with independent protection.
Versatile I/O voltage	1.65–3.6 V VIO range-eliminates level shifters when interfacing with 1.8 V FPGAs or 3.3 V microcontrollers.
OTP array	1024-byte one-time-programmable region with two lockable sections-stores cryptographic keys or calibration data permanently.
CFI compliance	Standard Common Flash Interface parameter table-enables auto-configuration in U-Boot, Linux MTD, and vendor-agnostic flash tools.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Stores boot loader, GUI assets, and calibration tables in digital instrument clusters requiring AEC-Q100 Grade 3 compliance.

IC Role / Device Role / Timing Role: Non-volatile firmware storage with XIP-capable read performance and sector-level update isolation.

Use Value: 100,000 erase cycles and 20-year retention ensure lifetime reliability across 15-year vehicle service life.

Use Scenario: Holds runtime firmware and configuration data in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and suspend/resume for safe field updates during operational downtime.

Use Value: 512-byte programming buffer cuts firmware patch time by >60% vs. single-word programming in legacy NOR devices.

Medical Imaging Control Board

Telecom Base Station Boot Memory

Use Scenario: Stores FPGA configuration bitstreams and safety-critical diagnostic firmware in Class II medical imaging equipment.

IC Role / Device Role / Timing Role: Secure, radiation-tolerant code storage with OTP-locked security keys and ASP-enabled sector lockdown.

Use Value: Internal ECC and 128 kB uniform sectors meet IEC 62304 SW safety requirements without external redundancy.

Use Scenario: Hosts boot code and baseband firmware in 4G/5G remote radio units operating in extended temperature ranges.

IC Role / Device Role / Timing Role: High-reliability parallel NOR with Versatile I/O supporting both 1.8 V FPGA interfaces and 3.3 V management MCUs.

Use Value: Dual VCC/VIO supplies allow coexistence with heterogeneous SoCs while maintaining 100 ns random access for fast cold boot.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S10TFI022	Same die, identical specs, but shipped in 64-ball LAE Fortified BGA (9 mm × 9 mm) instead of 56-pin TSOP.	Preferred for space-constrained PCB layouts where board area is limited and BGA assembly is available.	Select for compact designs with automated BGA reflow capability; not suitable for hand-soldered or socketed prototyping.
MX29GL512FHT2I-90G	Macronix 512 Mb parallel NOR; 90 ns random access, no integrated ECC, requires external error handling.	Lower-cost option where ECC is implemented in host processor or where data integrity requirements are less stringent.	Choose when cost sensitivity outweighs ECC convenience and long-term data retention assurance is secondary.

Compared with S29GL512S10TFI020, the TSOP-packaged Infineon part offers built-in ECC and industrial temperature rating out-of-box, while the LAE-BGA variant trades package form factor for footprint reduction, and the Macronix alternative sacrifices ECC for lower unit cost and simpler host integration.

Availability

S29GL512S10TFI020 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging control boards, and telecom base station boot memory requiring stable component supply across multi-year production cycles.

Supply support for S29GL512S10TFI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200.

The GL-S family targets high-reliability embedded systems needing XIP-capable, high-density NOR flash with integrated data integrity features-designed specifically for automotive, industrial, and medical applications demanding long-term firmware stability.

FAQ

Is S29GL512S10TFI020 pin-compatible with earlier S29GL512P or S29GL512N variants?

No. S29GL512S10TFI020 uses a 56-pin TSOP package with updated pinout-including dedicated VIO supply and relocated RY/BY#-and is not mechanically or electrically compatible with legacy P/N variants. Migration requires PCB redesign and firmware timing validation due to differences in AC characteristics and command set extensions.

Does this device support byte-write operations?

No. S29GL512S10TFI020 is strictly a 16-bit word-wide device with no BYTE# pin or byte-write capability. All program operations target full 16-bit words; partial-word writes require host-side masking and full-word reprogramming, consistent with its XIP-optimized architecture.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte OTP array is physically one-time programmable: once a bit is set to '0', it cannot be reset to '1'. Each of the two lockable regions can be permanently locked via dedicated CFI commands, preventing further writes-even during subsequent power cycles.

What happens during power loss mid-erase or mid-program?

The device retains partial progress state in non-volatile registers and resumes operation upon power restoration if the embedded algorithm controller detects incomplete status. If power loss occurs before status latch update, the affected sector enters a "locked" state requiring explicit unlock command before reuse-preventing corrupted firmware images.

S29GL512S10TFI020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-S

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 32M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 100 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512S10TFI020 FAQ

1.How can I place an order for S29GL512S10TFI020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512S10TFI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512S10TFI020 reliable?

The price and inventory of S29GL512S10TFI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10TFI020 is usually 5 days.

3.What payment methods are accepted for S29GL512S10TFI020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10TFI020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512S10TFI020?

S29GL512S10TFI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512S10TFI020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512S10TFI020?

For technical support, including S29GL512S10TFI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10TFI020 requirements.

6.How does Aetrix verify that S29GL512S10TFI020 is sourced from the original manufacturer or authorized distributors?

All S29GL512S10TFI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10TFI020 meets industry standards.

7.What is the process for return or replacement of S29GL512S10TFI020?

All S29GL512S10TFI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10TFI020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512S10TFI020 part is unused and in its original packaging.

Return procedure for S29GL512S10TFI020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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