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Infineon Technologies S29GL512S10TFI023
- Part No.:
- S29GL512S10TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512S10TFI023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
S29GL512S10TFI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with 3.0 V core supply, 16-bit data bus, and MIRRORBIT™ Eclipse 65 nm technology. It delivers 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. Designed for embedded boot code storage in industrial control systems requiring high reliability and fast XIP execution.
For engineers reviewing the S29GL512S10TFI023 datasheet, S29GL512S10TFI023 pinout, S29GL512S10TFI023 application, or S29GL512S10TFI023 equivalent, key selection factors include its 128 kB uniform sector erase granularity, 512-byte write buffer throughput (1.5 MBps), Versatile I/O support (1.65 V to VCC), and AEC-Q100 Grade 3 qualification for automotive use cases.
Technical Context
This device implements an asynchronous parallel interface with word-aligned addressing (A0–A24), supporting both standard read and 32-byte page-mode reads. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, status monitoring via RY/BY# pin or status register, and suspend/resume capability during active programming or erasing.
The internal architecture includes dedicated erase voltage and program voltage generators, a state machine-driven command set compliant with Common Flash Interface (CFI), and dual protection mechanisms-Advanced Sector Protection (ASP) with volatile/non-volatile lock bits plus a separate 1024-byte OTP array with two lockable regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), enabling full boot image + firmware storage in single-package solutions |
| Random access time | 100 ns at full VCC = VIO, meeting real-time interrupt latency requirements in MCU-based systems |
| Page access time | 15 ns, allowing rapid sequential instruction fetch within same 32-byte aligned page |
| Write buffer size | 512 bytes (256 words), reducing effective programming time by batching writes without host CPU overhead |
| ECC capability | Internal hardware single-bit error correction, eliminating need for external ECC logic in safety-critical designs |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention, suitable for long-lifecycle industrial deployments |
| Operating temperature | –40°C to +85°C (Industrial grade), validated for use in factory automation and motor drive controllers |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), JEDEC standard MO-141AC, body size 18.4 mm × 10.16 mm, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A24 | Address inputs | Word-aligned address bus; A24 is MSB for 512 Mb density (2²⁵ = 33,554,432 words) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports Versatile I/O with VIO range 1.65 V to VCC |
| CE# | Chip enable | Active-low device select; controls power-down entry when deasserted during standby |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write enable | Active-low write strobe; initiates command latching or data loading during programming |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy, high = ready) |
| RESET# | Hardware reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode |
| WP# | Write protect | Hardware sector protection enable; disables program/erase when asserted |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page-mode read | Enables 15 ns access to subsequent 16-bit words within same 32-byte page, accelerating XIP execution |
| 512-byte write buffer | Allows host to queue up to 256 words before triggering embedded programming, improving system-level throughput |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read, reducing firmware complexity and enhancing functional safety compliance |
| Uniform 128 kB sectors | Supports deterministic erase timing and simplifies partitioning of boot code, config, and application sections |
| OTP array with dual lock | Provides secure storage for calibration data or cryptographic keys, with independent locking per 512-byte region |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency and sector-level update flexibility. Use Value: Eliminates need for external SRAM shadowing; 20-year data retention ensures firmware integrity across multi-decade equipment lifespans. | Use Scenario: Hosting boot code and safety monitor firmware in radar ECU modules certified to ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash serving as primary boot source with hardware ECC and sector lock protection. Use Value: Meets automotive functional safety requirements through built-in error correction and immutable OTP region for critical parameters. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound devices requiring high reliability and low power standby. IC Role / Device Role / Timing Role: Low-power (100 µA standby) flash memory with fast random access for immediate system initialization after cold start. Use Value: Enables rapid power-on response (<500 ms) while maintaining data integrity over 10+ years of clinical deployment. | Use Scenario: Holding FPGA configuration bitstreams and runtime parameter sets in 5G remote radio units exposed to wide thermal swings. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) parallel flash with Versatile I/O supporting mixed-voltage backplane interfaces. Use Value: Ensures consistent timing margins across temperature range via adaptive VIO tracking and stable 128 kB sector erase behavior. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same die, identical specs, but shipped in tape-and-reel (TR) packaging instead of tray (TI) | No functional difference; TR format preferred for automated SMT assembly | Select based on production line feeding method-not electrical or performance criteria |
| MX29GL512FHT2I-90G | Macronix part with 90 ns random access (vs. 100 ns), no integrated ECC, CFI-compatible but different command set | Lacks hardware ECC; requires external error handling; lower endurance (100K vs. Infineon's 100K - same rating) | Choose only if legacy design already uses MX29GL512F and ECC is handled in software |
Compared with S29GL512S10TFI023, the TI-packaged variant offers identical functionality in different logistics form, while the Macronix alternative trades integrated ECC and Infineon's ASP protection for marginally faster access-making it suitable only where firmware-level ECC is already implemented.
Availability
S29GL512S10TFI023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply and long-term lifecycle support.
Supply support for S29GL512S10TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-S family targets embedded systems needing reliable, high-density parallel NOR flash with execute-in-place capability, robust data integrity features, and extended temperature operation-designed specifically for mission-critical boot and firmware storage.
FAQ
What is the function of the RY/BY# pin on S29GL512S10TFI023?
The RY/BY# pin is an open-drain ready/busy indicator used to monitor device status during embedded operations. When low, it signals that a program or erase operation is in progress; when high (pulled up externally), it indicates completion or idle state. This enables hardware handshaking without polling the status register, reducing CPU overhead in time-sensitive applications.
Does S29GL512S10TFI023 support both 3.3 V and 1.8 V I/O interfaces?
Yes - the Versatile I/O feature allows VIO to operate from 1.65 V to VCC (2.7–3.6 V). With VCC = 3.0 V, VIO can be independently set to 1.8 V or 3.3 V, enabling direct interfacing with mixed-voltage SoCs or FPGAs without level shifters, provided VIO remains within the specified range and meets timing requirements.
How does the 512-byte write buffer improve programming efficiency?
The write buffer accepts up to 512 bytes of data before initiating embedded programming, allowing the host to stream data continuously. This reduces total programming time by minimizing command overhead and bus turnaround delays. Measured throughput reaches 1.5 MBps, significantly faster than single-word programming, especially in firmware update scenarios involving large binary images.
Can the OTP array be reprogrammed after initial programming?
No - the 1024-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses; once a bit is set to '0', it cannot be changed back to '1'. Each of the two lockable regions can be individually secured via fuse blowing, preventing further writes while preserving existing content for calibration constants or security keys.
S29GL512S10TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-S
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 32M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512S10TFI023 FAQ
1.How can I place an order for S29GL512S10TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512S10TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512S10TFI023 reliable?
The price and inventory of S29GL512S10TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512S10TFI023 is usually 5 days.
3.What payment methods are accepted for S29GL512S10TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512S10TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512S10TFI023?
S29GL512S10TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512S10TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512S10TFI023?
For technical support, including S29GL512S10TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512S10TFI023 requirements.
6.How does Aetrix verify that S29GL512S10TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL512S10TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512S10TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL512S10TFI023?
All S29GL512S10TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512S10TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512S10TFI023 part is unused and in its original packaging.
Return procedure for S29GL512S10TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512S10TFI023 Tags
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